Patent classifications
C08L55/005
Macromonomers improving the thermal stability of (meth)acrylic comb polymers, use of these polymers in loaded plastic compositions
The invention concerns to the use, as an agent improving the thermal stability of (meth)acrylic comb polymers of a macromonomer whose formula (I) is:
R-(A-O).sub.m(BO).sub.nR(I)
wherein both m and n are non-zero and A and B designate alkyl groups having 2 to 4 carbon atoms, but different from one another. The invention further pertains to the implementation of the polymers obtained, as agents improving the thermal stability of the plastic compositions that contain them.
Macromonomers improving the thermal stability of (meth)acrylic comb polymers, use of these polymers in loaded plastic compositions
The invention concerns to the use, as an agent improving the thermal stability of (meth)acrylic comb polymers of a macromonomer whose formula (I) is:
R-(A-O).sub.m(BO).sub.nR(I)
wherein both m and n are non-zero and A and B designate alkyl groups having 2 to 4 carbon atoms, but different from one another. The invention further pertains to the implementation of the polymers obtained, as agents improving the thermal stability of the plastic compositions that contain them.
DIENE RUBBER COMPOSITION AND METHOD FOR PRODUCING SAME
The present invention addresses the problem of providing: a conjugated diene rubber composition which has excellent rebound resilience and wear resistance, while exhibiting good workability during rubber kneading and excellent wet grip performance; and a method for producing this conjugated diene rubber composition.
The present invention provides a diene rubber composition which is obtained by subjecting a mixture of a diene rubber component 1 that is obtained by terminally modifying a conjugated diene polymer 1 with at least one silicon compound that is represented by formula (1) and/or formula (2) and a diene rubber component 2 that is obtained by terminally modifying a conjugated diene polymer 2 with at least one silicon compound that is represented by formula (1) and/or formula (2) to a hydrolysis process, and subsequently drying the resulting product.
Curable composition, cured product, color filter, solid-state imaging element, and image display device
Provided are a curable composition including a pigment, a curable compound, and a resin A having a constitutional unit represented by Formula (1), a constitutional unit represented by Formula (2), and a constitutional unit having a molecular weight of 1,000 or less and represented by Formula (3); a cured product of the curable composition; a color filter including the cured product; and a solid-state imaging element and an image display device including the color filter. X.sup.1 represents an (m+2)-valent organic group, X.sup.2 and X.sup.3 represent a trivalent organic group, m represents an integer of 1 to 4, L.sup.2's each independently represent O or NR, L.sup.3's each independently represent a carbonyl group, O, or NR, R represents a hydrogen atom, an alkyl group, or an aryl group, P.sup.1 represents a group having a polymer chain, R.sup.1's each independently represent a substituent, and R.sup.3 represents a group having a polymerizable group. ##STR00001##
Curable composition, cured product, color filter, solid-state imaging element, and image display device
Provided are a curable composition including a pigment, a curable compound, and a resin A having a constitutional unit represented by Formula (1), a constitutional unit represented by Formula (2), and a constitutional unit having a molecular weight of 1,000 or less and represented by Formula (3); a cured product of the curable composition; a color filter including the cured product; and a solid-state imaging element and an image display device including the color filter. X.sup.1 represents an (m+2)-valent organic group, X.sup.2 and X.sup.3 represent a trivalent organic group, m represents an integer of 1 to 4, L.sup.2's each independently represent O or NR, L.sup.3's each independently represent a carbonyl group, O, or NR, R represents a hydrogen atom, an alkyl group, or an aryl group, P.sup.1 represents a group having a polymer chain, R.sup.1's each independently represent a substituent, and R.sup.3 represents a group having a polymerizable group. ##STR00001##
Compositions for Fibreboards With Enhanced Properties Upon Fast-Curing at Low Temperature
The disclosure relates to compositions including a constituent-A of a polylysine component, a XL-component, and a fibrous component of a fibrous element of vegetable fibers. The fibrous element is free of any fibers other than the vegetable fibers. The composition is free of any fibers other than the vegetable fibers of the fibrous component. The disclosure further relates to processes for obtaining an object from the compositions. The disclosure further relates to objects such as sheets, tapes, sticks, strips, films, cloths, containers, boards, panels, beams, frames, planks, engineered wood e.g. fibreboards obtained by said processes.
Compositions for Fibreboards With Enhanced Properties Upon Fast-Curing at Low Temperature
The disclosure relates to compositions including a constituent-A of a polylysine component, a XL-component, and a fibrous component of a fibrous element of vegetable fibers. The fibrous element is free of any fibers other than the vegetable fibers. The composition is free of any fibers other than the vegetable fibers of the fibrous component. The disclosure further relates to processes for obtaining an object from the compositions. The disclosure further relates to objects such as sheets, tapes, sticks, strips, films, cloths, containers, boards, panels, beams, frames, planks, engineered wood e.g. fibreboards obtained by said processes.
RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Provided are a resin composition including at least one resin selected from the group consisting of polyimide and a precursor of the polyimide, a polymerizable compound, and a polymerization initiator, in which a dissolution rate of a film having a film thickness of 10 m, which is obtained from the resin composition, in cyclopentanone is 0.01 to 0.55 m/sec, a cured substance obtained by curing the composition, a laminate including the cured substance, a manufacturing method for a cured substance, a manufacturing method for a laminate, a manufacturing method for a semiconductor device including the method for a cured substance, and a semiconductor device including a cured substance.
MALEIMIDE RESIN MIXTURE, CURABLE RESIN COMPOSITION, VARNISH, AND CURED PRODUCT THEREOF
The present invention provides: a maleimide resin mixture having an excellent low dielectric loss tangent and excellent storage stability in varnished form; a curable resin composition; and a cured product thereof. The maleimide resin mixture comprises: a maleimide resin having repeating units represented by formulas (a) and (b); and bis(3-ethyl-5-methyl-4-maleimidephenyl)methane represented by formula (c), wherein the content of the bismaleimide represented by formula (c) in the total amount of the maleimide resin mixture is 5.0-30.0 area % in terms of GPC area percentage. In the formulas, m is the average number of repetitions and is 0<m<200. n is the average number of repetitions and is 0<n<100. (a) and (b) are each bonded at *, and repetition positions may be random.
##STR00001##