A conductive resin composition which has high conductivity and a low water absorption rate, in which thermal decomposition of a polyacetal resin is reduced, and which causes no problems in practical use in injection molding applications, and a resin molded body and an article each including the conductive resin composition. The conductive resin composition includes: a polyacetal serving as a main component; carbon black; graphite; and an oxazoline group-containing compound and a reaction product thereof.

A conductive resin composition which has high conductivity and a low water absorption rate, in which thermal decomposition of a polyacetal resin is reduced, and which causes no problems in practical use in injection molding applications, and a resin molded body and an article each including the conductive resin composition. The conductive resin composition includes: a polyacetal serving as a main component; carbon black; graphite; and an oxazoline group-containing compound and a reaction product thereof.

A conductive resin composition which has high conductivity and a low water absorption rate, in which thermal decomposition of a polyacetal resin is reduced, and which causes no problems in practical use in injection molding applications, and a resin molded body and an article each including the conductive resin composition. The conductive resin composition includes: a polyacetal serving as a main component; carbon black; graphite; and an oxazoline group-containing compound and a reaction product thereof.

An orthopaedic prosthesis includes a femoral component comprising polymeric materials. The polymeric materials may include a polyaromatic ether or a polyacetal. The orthopaedic prosthesis may include a component having an articular layer and a support layer adjacent the articular layer. The support layer may include a reinforcement fiber. The orthopaedic prosthesis may be a knee prosthesis.

Poly-1,3-dioxepane, poly-1,3-dioxolane, polytetrahydrofurane or mixtures thereof are used in molding materials comprising polyoxymethylene or a copolymer containing a majority of oxymethylene units, for improving the flexural toughness of moldings formed from the molding materials.

Poly-1,3-dioxepane, poly-1,3-dioxolane, polytetrahydrofurane or mixtures thereof are used in molding materials comprising polyoxymethylene or a copolymer containing a majority of oxymethylene units, for improving the flexural toughness of moldings formed from the molding materials.

Poly-1,3-dioxepane, poly-1,3-dioxolane, polytetrahydrofurane or mixtures thereof are used in molding materials comprising polyoxymethylene or a copolymer containing a majority of oxymethylene units, for improving the flexural toughness of moldings formed from the molding materials.

Orthopedic devices are described including polymer compositions used to make the devices. The polymer composition contains a polyoxymethylene polymer in combination with various additives that prevent against agglomerations and spotting even when the composition contains significant amounts of coloring agents and/or waxes. In addition, the polymer composition has reduced formaldehyde emissions and excellent thermal stability properties.

Orthopedic devices are described including polymer compositions used to make the devices. The polymer composition contains a polyoxymethylene polymer in combination with various additives that prevent against agglomerations and spotting even when the composition contains significant amounts of coloring agents and/or waxes. In addition, the polymer composition has reduced formaldehyde emissions and excellent thermal stability properties.

Orthopedic devices are described including polymer compositions used to make the devices. The polymer composition contains a polyoxymethylene polymer in combination with various additives that prevent against agglomerations and spotting even when the composition contains significant amounts of coloring agents and/or waxes. In addition, the polymer composition has reduced formaldehyde emissions and excellent thermal stability properties.