Polymer blends are described that are formed from a transient polymer material, a polymer comprising an acrylonitrile group (e.g., ABS, SAN), and/or one or more polyester polymers. For blends in which two or more polyester polymers are blended with a transient polymer material, at least two of the polyester polymers are immiscible with one another, and one of the polyester polymers has a glass transition temperature less than or equal to 0° C. The polymer blends herein can decompose into liquid phase decomposition products upon exposure to a transience reaction trigger in less than 8 hours even at temperatures of less than −20° C.

Polymer blends are described that are formed from a transient polymer material, a polymer comprising an acrylonitrile group (e.g., ABS, SAN), and/or one or more polyester polymers. For blends in which two or more polyester polymers are blended with a transient polymer material, at least two of the polyester polymers are immiscible with one another, and one of the polyester polymers has a glass transition temperature less than or equal to 0° C. The polymer blends herein can decompose into liquid phase decomposition products upon exposure to a transience reaction trigger in less than 8 hours even at temperatures of less than −20° C.

For the purpose of providing a POM resin composition containing a conductive filler, the conductive POM resin composition suppressing the amount of the curing accelerator to be added, having excellent low thermal decomposition mechanical physical properties, and having no practical problem for injection molding applications, and a resin molded article, provided is a resin composition including a polyacetal resin, polyethylene, carbon black, a reaction product of an oxazoline group-containing polymer represented by formula (1), and a tertiary aromatic phosphine represented by formula (3) and/or a tertiary aromatic phosphine oxide represented by formula (4), wherein a content of the polyacetal resin is 50% by mass or more, and a sum of the content of the tertiary aromatic phosphine and the content of the tertiary aromatic phosphine oxide is 0.2% by mass or more and less than 0.5% by mass.

A polyoxymethylene polymer composition is disclosed containing a formaldehyde stabilizer package. The formaldehyde stabilizer package, which contains at least two emission control agents, dramatically and unexpectedly reduces formaldehyde emissions. The formaldehyde stabilizer package includes at least two emission control agents selected from the group of benzoguanamine compounds, a hydantoin, a substituted hydantoin, an amino acid, and an alkylene urea such as ethylene urea.

A polyoxymethylene polymer composition is disclosed containing a formaldehyde stabilizer package. The formaldehyde stabilizer package, which contains at least two emission control agents, dramatically and unexpectedly reduces formaldehyde emissions. The formaldehyde stabilizer package includes at least two emission control agents selected from the group of benzoguanamine compounds, a hydantoin, a substituted hydantoin, an amino acid, and an alkylene urea such as ethylene urea.

Formulations for forming stimulus responsive polymers (SRPs) on semiconductor substrates include organic weak acids. Methods of protecting sensitive substrates including forming an SRP layer on sensitive substrates and forming one or more cap layers on the SRP layer.

A polyoxymethylene polymer composition is disclosed containing a formaldehyde stabilizer package. The formaldehyde stabilizer package, which contains at least two emission control agents, dramatically and unexpectedly reduces formaldehyde emissions. The formaldehyde stabilizer package includes at least two emission control agents selected from the group of benzoguanamine compounds, a hydantoin, a substituted hydantoin, an amino acid, and an alkylene urea such as ethylene urea.

A polyoxymethylene polymer composition is disclosed containing a formaldehyde stabilizer package. The formaldehyde stabilizer package, which contains at least two emission control agents, dramatically and unexpectedly reduces formaldehyde emissions. The formaldehyde stabilizer package includes at least two emission control agents selected from the group of benzoguanamine compounds, a hydantoin, a substituted hydantoin, an amino acid, and an alkylene urea such as ethylene urea.

An object of the present invention is to provide a nonaqueous primer composition offering excellent discharge property and adhesion to printing media, even when applied on roll materials (acrylic, PET, etc.), board materials (glass, plastics, etc.), and other nonabsorbent media. As a solution, a nonaqueous primer composition containing a chlorinated polyolefin resin and a ketone resin is provided, wherein the chlorinated polyolefin resin and ketone resin together account for at least 10 percent by mass in the primer composition, the chlorine content in the chlorinated polyolefin resin is 30 to 50 percent by mass, and the chlorinated polyolefin resin and ketone resin are contained at a ratio by mass, calculated by “Chlorinated polyolefin resin/Ketone resin,” of 3/7 to 7/3.

An object of the present invention is to provide a nonaqueous primer composition offering excellent discharge property and adhesion to printing media, even when applied on roll materials (acrylic, PET, etc.), board materials (glass, plastics, etc.), and other nonabsorbent media. As a solution, a nonaqueous primer composition containing a chlorinated polyolefin resin and a ketone resin is provided, wherein the chlorinated polyolefin resin and ketone resin together account for at least 10 percent by mass in the primer composition, the chlorine content in the chlorinated polyolefin resin is 30 to 50 percent by mass, and the chlorinated polyolefin resin and ketone resin are contained at a ratio by mass, calculated by “Chlorinated polyolefin resin/Ketone resin,” of 3/7 to 7/3.