C08L61/04

RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

A resin composition for semiconductor encapsulation, containing (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) amorphous carbon, wherein the amorphous carbon of the component (D) contains 30 atomic % or more of an SP.sup.3 structure and 55 atomic % or less of an SP.sup.2 structure.

Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board
09765173 · 2017-09-19 · ·

There are provided a compound containing a phenolic hydroxyl group which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product, a phenolic resin including the same, a curable composition and a cured product thereof, and a semiconductor sealing material. The compound containing a phenolic hydroxyl group has a dinaphthofuran skeleton, in which each of the two naphthylene skeletons has a hydroxyl group on an aromatic nucleus thereof.

RUBBER COMPOSITION FOR TREADS AND PNEUMATIC TIRE
20170253728 · 2017-09-07 · ·

Provided are: a rubber composition for treads which contains a diene rubber in the rubber component and can simultaneously achieve blowing resistance during dry running, wet grip performance and abrasion resistance; and a pneumatic tire including a tread formed from the rubber composition for treads. The rubber composition contains: a diene rubber including styrene-butadiene rubber; zinc dithiophosphate; an inorganic filler including at least one selected from the group consisting of: a compound of the formula: mM.xSiO.sub.y.zH.sub.2O wherein M represents at least one metal selected from the group consisting of Al, Mg, Ti, Ca, and Zr, or an oxide or hydroxide of the metal, m represents an integer of 1-5, x represents an integer of 0-10, y represents an integer of 2-5, and z represents an integer of 0-10; magnesium sulfate; and silicon carbide, and having a BET value of 5-120 m.sup.2/g and a linseed oil absorption of 30-80 mL/100 g; and sulfur, wherein, per 100 parts by mass of the diene rubber, there are 0.2-15 parts by mass of the zinc dithiophosphate, 1-70 parts by mass of the inorganic filler, and less than 2.5 parts by mass of zinc oxide.

USE OF A COATING ON A CHROMIUM-FREE TINPLATE SUBSTRATE

Use of a coating composition on a chromium free tinplate substrate, the coating composition comprising: a polyester material, and benzoguanamine or a derivative thereof,
wherein the coating composition is substantially free of bisphenol A (BPA), bisphenol F (BPF), bisphenol A diglycidyl ether (BADGE) and bisphenol F diglycidyl ether (BFDGE).

USE OF A COATING ON A CHROMIUM-FREE TINPLATE SUBSTRATE

Use of a coating composition on a chromium free tinplate substrate, the coating composition comprising: a polyester material, and benzoguanamine or a derivative thereof,
wherein the coating composition is substantially free of bisphenol A (BPA), bisphenol F (BPF), bisphenol A diglycidyl ether (BADGE) and bisphenol F diglycidyl ether (BFDGE).

Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same

A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): ##STR00001##
wherein m, n, l, R.sub.1, and R.sub.2 are as defined in the specification.

Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same

A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): ##STR00001##
wherein m, n, l, R.sub.1, and R.sub.2 are as defined in the specification.

THERMOPLASTIC ELASTOMER COMPOSITION AND MOLDED ARTICLE OF THE SAME

[Object] An object of the present invention is to provide a thermoplastic elastomer composition with excellent heat aging resistance and also excellent hardness and mechanical properties as well as excellent moldability.

[Solution] A thermoplastic elastomer composition (I) including a cross-linked product of an ethylene.α-olefin.nonconjugated polyene copolymer (A) with a phenolic resin cross-linking agent (E), and 360 to 460 parts by mass of a crystalline polyolefin (B), 70 to 140 parts by mass of a softener (C), and 2 to 6 parts by mass of a lubricant (D) (provided that the amount of the copolymer (A) is 100 parts by mass).

THERMOPLASTIC ELASTOMER COMPOSITION AND MOLDED ARTICLE OF THE SAME

[Object] An object of the present invention is to provide a thermoplastic elastomer composition with excellent heat aging resistance and also excellent hardness and mechanical properties as well as excellent moldability.

[Solution] A thermoplastic elastomer composition (I) including a cross-linked product of an ethylene.α-olefin.nonconjugated polyene copolymer (A) with a phenolic resin cross-linking agent (E), and 360 to 460 parts by mass of a crystalline polyolefin (B), 70 to 140 parts by mass of a softener (C), and 2 to 6 parts by mass of a lubricant (D) (provided that the amount of the copolymer (A) is 100 parts by mass).

METHOD FOR FORMING PROTECTIVE FILM, METHOD FOR MANUFACTURING PATTERNED SUBSTRATE, AND COMPOSITION

A method for forming a protective film includes directly or indirectly coating only a periphery of a substrate with a composition. The composition includes a compound having an aromatic ring, and a solvent. The solvent includes a first solvent having a normal boiling point of 156° C. or higher and lower than 300° C. A content of the first solvent in the solvent is preferably 20 mass % or more and 100 mass % or less. The first solvent is preferably an ester, an alcohol, an ether, a carbonate, or a combination of two or more of an ester, an alcohol, an ether, and a carbonate.