Disclosed herein is a prepreg including a woven fabric base and a semi-cured product of a resin composition impregnated into the woven fabric base. The resin composition contains a maleimide resin as Component (A), an acrylic resin as Component (B), and a phenol resin as Component (C). The Component (B) has a weight average molecular weight falling within the range from 200,000 to 850,000.

A composition for film formation containing a polycyclic polyphenolic resin having repeating units derived from at least one monomer selected from the group consisting of aromatic hydroxy compounds represented by the following formulae (1A) and (1B), wherein the repeating units are linked to each other by a direct bond between aromatic rings.

##STR00001##

(In the formula (1A), X represents an oxygen atom, a sulfur atom, a single bond, or non-crosslinked state and Y represents a 2n-valent group having 1 to 60 carbon atoms, or a single bond, wherein when X is non-crosslinked state, Y represents the 2n-valent group; in the formula (1B), A represents a benzene ring or a fused ring; in the formulas (1A) and (1B), each R.sup.0 is independently an alkyl group having 1 to 40 carbon atoms and optionally having a substituent, an aryl group having 6 to 40 carbon atoms and optionally having a substituent, an alkenyl group having 2 to 40 carbon atoms and optionally having a substituent, an alkynyl group having 2 to 40 carbon atoms, an alkoxy group having 1 to 40 carbon atoms and optionally having a substituent, a halogen atom, a thiol group, or a hydroxy group, wherein at least one R.sup.0 is a hydroxy group, and each m is independently an integer of 1 to 9; and N is an integer of 1 to 4, and each p is independently an integer of 0 to 3.)

A composition for film formation containing a polycyclic polyphenolic resin having repeating units derived from at least one monomer selected from the group consisting of aromatic hydroxy compounds represented by the following formulae (1A) and (1B), wherein the repeating units are linked to each other by a direct bond between aromatic rings.

##STR00001##

(In the formula (1A), X represents an oxygen atom, a sulfur atom, a single bond, or non-crosslinked state and Y represents a 2n-valent group having 1 to 60 carbon atoms, or a single bond, wherein when X is non-crosslinked state, Y represents the 2n-valent group; in the formula (1B), A represents a benzene ring or a fused ring; in the formulas (1A) and (1B), each R.sup.0 is independently an alkyl group having 1 to 40 carbon atoms and optionally having a substituent, an aryl group having 6 to 40 carbon atoms and optionally having a substituent, an alkenyl group having 2 to 40 carbon atoms and optionally having a substituent, an alkynyl group having 2 to 40 carbon atoms, an alkoxy group having 1 to 40 carbon atoms and optionally having a substituent, a halogen atom, a thiol group, or a hydroxy group, wherein at least one R.sup.0 is a hydroxy group, and each m is independently an integer of 1 to 9; and N is an integer of 1 to 4, and each p is independently an integer of 0 to 3.)

Disclosed herein are polymers formed by the condensation of bis(hydroxycarbyl)-aminophenolic compounds with aldehydes. The condensation polymers include one or more repeat units having bis(hydroxycarbyl)amino functionality. The polymers are useful as antifoulants, antipolymerants, rheology modifiers, dehazers, polymerization retardants, surfactants, or a combination of these in one or more industrial process streams.

A fire retardant (FR) composite composition, including a liquid polymer, wherein the liquid polymer includes a photopolymer including at least two of a first molecule, a second molecule, and a third molecule, a FR thermoset, and a photoinitiator.

A fire retardant (FR) composite composition, including a liquid polymer, wherein the liquid polymer includes a photopolymer including at least two of a first molecule, a second molecule, and a third molecule, a FR thermoset, and a photoinitiator.

The present disclosure provides a silicone-modified dicyclopentadiene-derived hydroxy aromatic compound, which includes a structure represented by formula (I). Formula (I) is defined as in the specification. The present disclosure further provides a manufacturing method for a silicone-modified dicyclopentadiene-derived hydroxy aromatic compound and a curable product, wherein the curable product is obtained by mixing the silicone-modified dicyclopentadiene-derived hydroxy aromatic compound and a modified polyphenylene oxide resin, and then adding a peroxide to perform a curing reaction.

The present disclosure provides a silicone-modified dicyclopentadiene-derived hydroxy aromatic compound, which includes a structure represented by formula (I). Formula (I) is defined as in the specification. The present disclosure further provides a manufacturing method for a silicone-modified dicyclopentadiene-derived hydroxy aromatic compound and a curable product, wherein the curable product is obtained by mixing the silicone-modified dicyclopentadiene-derived hydroxy aromatic compound and a modified polyphenylene oxide resin, and then adding a peroxide to perform a curing reaction.

A rubber composition including 100 parts by mass of a diene rubber containing natural rubber, and blended with from 40 to 80 parts by mass of carbon black, cobalt neodecanoate borate represented by the following Chemical Formula (1), a phenolic resin, a curing agent, sulfur, and a vulcanization accelerator, wherein the carbon black has DBP oil absorption of from 50×10.sup.−5 to 80×10.sup.−5 m.sup.3/kg, and iodine adsorption of from 100 to 150 g/kg, and a vulcanized rubber has characteristics of a dynamic storage modulus (E′) at a dynamic strain of 2% and at 20° C. of 8 MPa or more, a tangent loss (tan δ) at 60° C. of 0.20 or less, and the number of times of repetition until fracture is caused in a constant strain fatigue test at a strain of 60% and at 400 rpm of 45,000 or more. ##STR00001##

The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor chip; a support member having the semiconductor chip mounted thereon; and a bonding adhesive member provided between the semiconductor chip and the support member and adhering the semiconductor chip and the support member. The bonding adhesive member includes a sintered body of silver particles.