A fire retardant (FR) composite composition, including a liquid polymer, wherein the liquid polymer includes a photopolymer including at least two of a first molecule, a second molecule, and a third molecule, a FR thermoset, and a photoinitiator.

A fire retardant (FR) composite composition, including a liquid polymer, wherein the liquid polymer includes a photopolymer including at least two of a first molecule, a second molecule, and a third molecule, a FR thermoset, and a photoinitiator.

A carbonaceous material having a pore size (p) ranging from a lower limit (a) to an upper limit (z) and a bulk density (σ) ranging from a lower limit (b) to an upper limit (y) where the comparative variability (g) defined as (y−b)/(z−a) is less than 1. Also, an adsorbent formed therefrom. Also, a chelating agent formed therefrom. Also, a film formed therefrom.

A resin composition that has excellent adhesiveness to chips and substrates such as printed wiring boards and excellent flux activity is provided. The present application provides a resin composition containing: a benzoxazine compound (A); an organic compound (B) having a flux function; and at least one thermosetting component (C) selected from a phenolic resin and a radical polymerizable thermosetting resin, wherein the radical polymerizable thermosetting resin is a resin or a compound having at least one or more functional groups selected from the group consisting of an alkenyl group, a maleimide group and a (meth)acryloyl group, and wherein a mass ratio between the benzoxazine compound (A) and the thermosetting component (C) ((A)/(C)) is 20/80 to 90/10.

A resin composition that has excellent adhesiveness to chips and substrates such as printed wiring boards and excellent flux activity is provided. The present application provides a resin composition containing: a benzoxazine compound (A); an organic compound (B) having a flux function; and at least one thermosetting component (C) selected from a phenolic resin and a radical polymerizable thermosetting resin, wherein the radical polymerizable thermosetting resin is a resin or a compound having at least one or more functional groups selected from the group consisting of an alkenyl group, a maleimide group and a (meth)acryloyl group, and wherein a mass ratio between the benzoxazine compound (A) and the thermosetting component (C) ((A)/(C)) is 20/80 to 90/10.

The present invention provides a compound having a specific structure represented by the following formula (0), a resin having a constituent unit derived from the compound, various compositions containing the compound and/or the resin, and various methods using the compositions.

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The present invention provides a compound having a specific structure represented by the following formula (0), a resin having a constituent unit derived from the compound, various compositions containing the compound and/or the resin, and various methods using the compositions.

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Provided are a resin composition, a pellet, a veil, a vibration damping material, a sound insulator, and an intermediate film for laminated glass, each of which is much more excellent in damping properties. Specifically, the resin composition is a resin composition containing the following block copolymer or hydrogenation product thereof (X); and a tackifier resin (Y) having a glass transition temperature of 50 to 45 C., wherein when a glass transition temperature of a polymer block (B) of the block copolymer or hydrogenation product thereof (X) is designated as Tg(X), and a glass transition temperature of the tackifier resin (Y) is designated as Tg(Y), an absolute value of a difference between Tg(X) and Tg(Y) is 50 C. or lower, the block copolymer or hydrogenation product thereof (X) being a block copolymer or a hydrogenation product thereof having a polymer block (A) containing more than 70 mol % of a structural unit derived from an aromatic vinyl compound and a polymer block (B) containing 30 mol % or more of a structural unit derived from at least one selected from the group consisting of a conjugated diene compound and isobutylene, and the content of the polymer block (A) in the block copolymer being 25% by mass or less.

An organic board of the present disclosure has a resin component comprising at least one resin selected from the group consisting of an epoxy resin, a polyimide resin, a phenolic resin, an amino resin, a polyester resin, a polyphenylene resin, a cyclic olefin resin, and a Teflon (registered trademark) resin as the main component, and a non-resin component including at least one of an inorganic filler and a flame retardant, in which the non-resin component is dispersed in the resin component, at least a part of the non-resin component is agglomerated to form an aggregate, a part of the resin component forms a resin material part having a particle shape, the resin material part exists within the aggregate, or the resin component forms a matrix phase surrounding the aggregate, and there are voids at some interfaces between the resin component and the aggregate.

An organic board of the present disclosure has a resin component comprising at least one resin selected from the group consisting of an epoxy resin, a polyimide resin, a phenolic resin, an amino resin, a polyester resin, a polyphenylene resin, a cyclic olefin resin, and a Teflon (registered trademark) resin as the main component, and a non-resin component including at least one of an inorganic filler and a flame retardant, in which the non-resin component is dispersed in the resin component, at least a part of the non-resin component is agglomerated to form an aggregate, a part of the resin component forms a resin material part having a particle shape, the resin material part exists within the aggregate, or the resin component forms a matrix phase surrounding the aggregate, and there are voids at some interfaces between the resin component and the aggregate.