Polymer blends are described that are formed from a transient polymer material, a polymer comprising an acrylonitrile group (e.g., ABS, SAN), and/or one or more polyester polymers. For blends in which two or more polyester polymers are blended with a transient polymer material, at least two of the polyester polymers are immiscible with one another, and one of the polyester polymers has a glass transition temperature less than or equal to 0° C. The polymer blends herein can decompose into liquid phase decomposition products upon exposure to a transience reaction trigger in less than 8 hours even at temperatures of less than −20° C.

Polymer blends are described that are formed from a transient polymer material, a polymer comprising an acrylonitrile group (e.g., ABS, SAN), and/or one or more polyester polymers. For blends in which two or more polyester polymers are blended with a transient polymer material, at least two of the polyester polymers are immiscible with one another, and one of the polyester polymers has a glass transition temperature less than or equal to 0° C. The polymer blends herein can decompose into liquid phase decomposition products upon exposure to a transience reaction trigger in less than 8 hours even at temperatures of less than −20° C.

A durable palm fiber composite material is obtained by impregnating an unprocessed palm bark in a resin adhesive solution prepared by using a palm leaf as a raw material and then hot-pressing. The palm bark is dried under a natural state without additional processing. The palm leaf is made into a tannin resin adhesive solution under the effect of additives such as furfuryl alcohol, paraformaldehyde, and others. A pH value of the adhesive solution is controlled to be 9-11. A solid content is 40-60%. An adhesive amount applied to the palm bark by the resin adhesive solution is 800-1500 g/m.sup.2. Odd number of layers (three or more layers) of palm barks that are impregnated by the resin adhesive solution and are hot-pressed to the composite material. Hot-pressed parameters are as follows: the temperature is 150-180° C. the unit pressure is 0.8-1.5 MPa, and the time is 10-30 s/mm.

A durable palm fiber composite material is obtained by impregnating an unprocessed palm bark in a resin adhesive solution prepared by using a palm leaf as a raw material and then hot-pressing. The palm bark is dried under a natural state without additional processing. The palm leaf is made into a tannin resin adhesive solution under the effect of additives such as furfuryl alcohol, paraformaldehyde, and others. A pH value of the adhesive solution is controlled to be 9-11. A solid content is 40-60%. An adhesive amount applied to the palm bark by the resin adhesive solution is 800-1500 g/m.sup.2. Odd number of layers (three or more layers) of palm barks that are impregnated by the resin adhesive solution and are hot-pressed to the composite material. Hot-pressed parameters are as follows: the temperature is 150-180° C. the unit pressure is 0.8-1.5 MPa, and the time is 10-30 s/mm.

A method for reducing the level difference (iso-dense bias) (reverse bump) of a resist underlayer film formed on a semiconductor substrate having a stepped portion and a non-stepped portion by 5 nm or more, which comprises a step of applying the composition to an upper surface of the semiconductor substrate having a stepped portion and a non-stepped portion. A method for reducing the level difference (iso-dense bias) of a resist underlayer film, comprising the steps of adding a fluorine-containing surfactant to a resist underlayer film-forming composition containing a polymer and a solvent and applying the composition containing the fluorine-containing surfactant to an upper surface of a semiconductor substrate having a stepped portion and a non-stepped portion. The level difference of a resist underlayer film formed on a semiconductor substrate between a stepped portion and a non-stepped portion (i.e., reverse bump) is reduced by 5 nm or more.

The invention is a method comprising (a) providing a substrate having at least one recessed feature characterized by a width of less than about 0.3 microns and an aspect ratio of 5 or higher, (b) coating onto the substrate a composition comprising (i) a curable polymeric material, (ii) a thermally deactivatable gap-filling aid, and (iii) at least one solvent, (c) drying the coated substrate to remove the solvent, leaving a composition of cross-linkable polymeric material and gap-filling aid substantially filling the recessed feature, and (d) heating the coated substrate to cure the polymeric material and to de-activate the gap-filling aid, wherein the cured material has a glass transition temperature of no less than 300° C. and, preferably, a thermal stability temperature of at least 300° C.

The invention is a method comprising (a) providing a substrate having at least one recessed feature characterized by a width of less than about 0.3 microns and an aspect ratio of 5 or higher, (b) coating onto the substrate a composition comprising (i) a curable polymeric material, (ii) a thermally deactivatable gap-filling aid, and (iii) at least one solvent, (c) drying the coated substrate to remove the solvent, leaving a composition of cross-linkable polymeric material and gap-filling aid substantially filling the recessed feature, and (d) heating the coated substrate to cure the polymeric material and to de-activate the gap-filling aid, wherein the cured material has a glass transition temperature of no less than 300° C. and, preferably, a thermal stability temperature of at least 300° C.

Provided is a glass fiber-reinforced resin molded article having well-balanced and excellent static and dynamic strength and fluidity. In the glass fiber-reinforced resin molded article, glass fiber included in the glass fiber-reinforced resin molded article includes a flat cross-sectional shape having a minor axis D1 in the range of 3.0 to 10.5 μm and a major axis D2 in the range of 11.0 to 29.0 μm, the number average fiber length L (μm) of the glass fiber included in the glass fiber-reinforced resin molded article is in the range of 150 to 475 μm, the glass fiber content C (wt %) in the glass fiber-reinforced resin molded article is in the range of 40.0 to 75.0 wt %, and the above DI, D2, L, and C satisfy the following formula (1):
260.0<C.sup.2×L/(D1×D2.sup.2)<400.0  (1).

Polymer blends are described that are formed from a transient polymer material, a polymer comprising an acrylonitrile group (e.g., ABS, SAN), and/or one or more polyester polymers. For blends in which two or more polyester polymers are blended with a transient polymer material, at least two of the polyester polymers are immiscible with one another, and one of the polyester polymers has a glass transition temperature less than or equal to 0° C. The polymer blends herein can decompose into liquid phase decomposition products upon exposure to a transience reaction trigger in less than 8 hours even at temperatures of less than −20° C.

Polymer blends are described that are formed from a transient polymer material, a polymer comprising an acrylonitrile group (e.g., ABS, SAN), and/or one or more polyester polymers. For blends in which two or more polyester polymers are blended with a transient polymer material, at least two of the polyester polymers are immiscible with one another, and one of the polyester polymers has a glass transition temperature less than or equal to 0° C. The polymer blends herein can decompose into liquid phase decomposition products upon exposure to a transience reaction trigger in less than 8 hours even at temperatures of less than −20° C.