A polyester-based pressure-sensitive adhesive layer, pressure-sensitive adhesive tape, and double-coated pressure-sensitive adhesive tape each having high durability (high heating humidification storage stability) and good adhesive properties are provided using a polyester-based pressure-sensitive adhesive composition. The polyester-based pressure-sensitive adhesive composition of the invention includes a polyester, a hydrolysis-resistant agent, a tackifier with an acid value of 8 or less and a softening point of 80 to 170 C., and a crosslinking agent, and contains 20 to 100 parts by weight of the tackifier based on 100 parts by weight of the polyester.

A polyester-based pressure-sensitive adhesive layer, pressure-sensitive adhesive tape, and double-coated pressure-sensitive adhesive tape each having high durability (high heating humidification storage stability) and good adhesive properties are provided using a polyester-based pressure-sensitive adhesive composition. The polyester-based pressure-sensitive adhesive composition of the invention includes a polyester, a hydrolysis-resistant agent, a tackifier with an acid value of 8 or less and a softening point of 80 to 170 C., and a crosslinking agent, and contains 20 to 100 parts by weight of the tackifier based on 100 parts by weight of the polyester.

A polyester-based pressure-sensitive adhesive layer, pressure-sensitive adhesive tape, and double-coated pressure-sensitive adhesive tape each having high durability (high heating humidification storage stability) and good adhesive properties are provided using a polyester-based pressure-sensitive adhesive composition. The polyester-based pressure-sensitive adhesive composition of the invention includes a polyester, a hydrolysis-resistant agent, a tackifier with an acid value of 8 or less and a softening point of 80 to 170 C., and a crosslinking agent, and contains 20 to 100 parts by weight of the tackifier based on 100 parts by weight of the polyester.

A binder composition for an electrochemical device positive electrode contains a polymer and an organic compound. The polymer includes a nitrile group-containing monomer unit and an alkylene structural unit. The organic compound includes not fewer than 2 and not more than 15 aromatic hydrocarbon monocycles and not fewer than 2 and not more than 15 sulfur atom-containing functional groups, on average, per one molecule.

A binder composition for an electrochemical device positive electrode contains a polymer and an organic compound. The polymer includes a nitrile group-containing monomer unit and an alkylene structural unit. The organic compound includes not fewer than 2 and not more than 15 aromatic hydrocarbon monocycles and not fewer than 2 and not more than 15 sulfur atom-containing functional groups, on average, per one molecule.

Provided is a nanocarbon dispersion having good dispersibility of nanocarbon.

A nanocarbon dispersion according to an embodiment includes (A) nanocarbon, (B) a naphthalenesulfonic acid condensate which is at least one selected from the group consisting of alkylnaphthalenesulfonic acid-formaldehyde condensates, a naphthalenesulfonic acid-formaldehyde condensate, formaldehyde condensates of an alkylnaphthalenesulfonic acid and naphthalenesulfonic acid, and salts thereof and which has a number-average molecular weight of 470 to 3,000, (C) an anionic water-soluble polymer, (D) an organic solvent having an O/I of less than 1.00, the O/I being a ratio of an organic value to an inorganic value in an organic conceptual diagram, and (E) water.

A prepreg having low water absorption, and having remarkably suppressed deterioration in insulation resistance over time, and further having excellent heat resistance, a metal foil-clad laminate using the prepreg, and a printed wiring board using the metal foil-clad laminate are provided. A prepreg of the present invention is obtained by impregnating or coating a base material (D) with a resin composition comprising: a naphthol-modified dimethylnaphthalene formaldehyde resin (A); an epoxy resin (B) having an epoxy equivalent of 200 to 400 g/eq.; and an inorganic filler (C).

A prepreg having low water absorption, and having remarkably suppressed deterioration in insulation resistance over time, and further having excellent heat resistance, a metal foil-clad laminate using the prepreg, and a printed wiring board using the metal foil-clad laminate are provided. A prepreg of the present invention is obtained by impregnating or coating a base material (D) with a resin composition comprising: a naphthol-modified dimethylnaphthalene formaldehyde resin (A); an epoxy resin (B) having an epoxy equivalent of 200 to 400 g/eq.; and an inorganic filler (C).

A prepreg having low water absorption, and having remarkably suppressed deterioration in insulation resistance over time, and further having excellent heat resistance, a metal foil-clad laminate using the prepreg, and a printed wiring board using the metal foil-clad laminate are provided. A prepreg of the present invention is obtained by impregnating or coating a base material (D) with a resin composition comprising: a naphthol-modified dimethylnaphthalene formaldehyde resin (A); an epoxy resin (B) having an epoxy equivalent of 200 to 400 g/eq.; and an inorganic filler (C).

The present invention is a dispersant composition for a hydraulic composition, which includes (A) a cement dispersant composed of a polymer having a naphthalene ring-containing monomer unit, and (B) one or more specific alkylene oxide-added compounds represented by the general formula (B1), wherein a molar ratio of a total amount of (B) to the naphthalene ring-containing monomer unit in (A) is 3% or more and 16% or less.