The present invention relates to new formulations for adhesive compositions and also to adhesive compositions particularly for a hybrid adhesive comprising at least one mixture of an amino resin and at least one polyether, and the combination of this mixture with isocyanate, and also to the use of polyethers in adhesives based on amino resins. These adhesive compositions are especially suitable for use as adhesives for woodbase materials, more particularly OSB boards, fiberboards, or chipboards. In a further aspect the present invention relates to processes for producing such woodbase materials from lignocellulosic products of comminution, more particularly to processes for producing OSB boards, wood fiberboards, or chipboards, where the lignocellulosic products of comminution are contacted with the adhesive composition of the invention and subsequently the woodbase materials are obtained by pressing with heat treatment. Lastly, the present invention is directed to woodbase materials obtainable accordingly.

The present invention relates to new formulations for adhesive compositions and also to adhesive compositions particularly for a hybrid adhesive comprising at least one mixture of an amino resin and at least one polyether, and the combination of this mixture with isocyanate, and also to the use of polyethers in adhesives based on amino resins. These adhesive compositions are especially suitable for use as adhesives for woodbase materials, more particularly OSB boards, fiberboards, or chipboards. In a further aspect the present invention relates to processes for producing such woodbase materials from lignocellulosic products of comminution, more particularly to processes for producing OSB boards, wood fiberboards, or chipboards, where the lignocellulosic products of comminution are contacted with the adhesive composition of the invention and subsequently the woodbase materials are obtained by pressing with heat treatment. Lastly, the present invention is directed to woodbase materials obtainable accordingly.

A curable resin composition contains 100 parts by weight of a component (A) and 5 to 2000 parts by weight of at least one of a component (B) and a component (C): (A) a benzoxazine compound having a thiol group; (B) a compound having a three- or four-membered ring cyclic ether group; (C) a compound having a reactive group including a carbon-carbon double bond or a carbon-carbon triple bond. The curable composition is intended to suppress an odorous volatile component (sulfur-containing volatile component) generated during the production of a cured product using the curable resin composition.

Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 520%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 520%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

A biodegradable crosslinked polymer which is a reaction product of a polymer having aldehyde-reactive functional groups and a polyaldehyde, wherein the polymer having aldehyde-reactive functional groups comprises a biodegradable structure or the polyaldehyde comprises a biodegradable structure.

A biodegradable crosslinked polymer which is a reaction product of a polymer having aldehyde-reactive functional groups and a polyaldehyde, wherein the polymer having aldehyde-reactive functional groups comprises a biodegradable structure or the polyaldehyde comprises a biodegradable structure.

Formaldehyde-free binder compositions are described that include an aldehyde or ketone, a reaction product between a polyamine and an organic anhydride, and an acidic compound. The acidic compound may be an organic acid, an acidic catalyst, or both. The acidic compound is supplied in quantities that lower the pH of the binder composition to about 5 or less. The binder compositions may be used in methods of binding fiberglass and the resulting fiberglass products have an improved tensile strength due to the addition of the acidic compound.

Formaldehyde-free binder compositions are described that include an aldehyde or ketone, a reaction product between a polyamine and an organic anhydride, and an acidic compound. The acidic compound may be an organic acid, an acidic catalyst, or both. The acidic compound is supplied in quantities that lower the pH of the binder composition to about 5 or less. The binder compositions may be used in methods of binding fiberglass and the resulting fiberglass products have an improved tensile strength due to the addition of the acidic compound.

Formaldehyde-free binder compositions are described that include an aldehyde or ketone, a reaction product between a polyamine and an organic anhydride, and an acidic compound. The acidic compound may be an organic acid, an acidic catalyst, or both. The acidic compound is supplied in quantities that lower the pH of the binder composition to about 5 or less. The binder compositions may be used in methods of binding fiberglass and the resulting fiberglass products have an improved tensile strength due to the addition of the acidic compound.