A resin composition includes (A) a polyolefin epoxy resin, (B) an epoxy resin having a condensed polycyclic aromatic hydrocarbon, (C) a nitrogen-containing novolak resin, and (D) an inorganic filler, in which an epoxy equivalent of the (A) component is 200 g/eq. or more, a nitrogen content in the (C) component is 13% by mass or more and/or the (C) component has a cresol novolak structure, and a content of the (D) component is 60% by mass or more on the basis of 100% by mass of non-volatile components in the resin composition.

A curable composition containing more than 80% by weight of a blend of benzoxazines, wherein the blend includes (A) one or more multifunctional benzoxazines and (B) a liquid, non-halogenated monofunctional benzoxazine. This composition has been found to be stable at high temperatures, e.g. 180° C.-250° C., and suitable for making composite materials using conventional techniques such as prepregging and liquid resin infusion.

A curable composition containing more than 80% by weight of a blend of benzoxazines, wherein the blend includes (A) one or more multifunctional benzoxazines and (B) a liquid, non-halogenated monofunctional benzoxazine. This composition has been found to be stable at high temperatures, e.g. 180° C.-250° C., and suitable for making composite materials using conventional techniques such as prepregging and liquid resin infusion.

A curable composition containing more than 80% by weight of a blend of benzoxazines, wherein the blend includes (A) one or more multifunctional benzoxazines and (B) a liquid, non-halogenated monofunctional benzoxazine. This composition has been found to be stable at high temperatures, e.g. 180° C.-250° C., and suitable for making composite materials using conventional techniques such as prepregging and liquid resin infusion.

A resin, including a compound having the following Formula 1-1:

##STR00001##

wherein n ranges from 1 to 5, and R1, R2, R3 and R4 are as defined herein.

A resin, including a compound having the following Formula 1-1:

##STR00001##

wherein n ranges from 1 to 5, and R1, R2, R3 and R4 are as defined herein.

Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight parts: (A) 40-80 parts by weight of allyl modified benzoxazine resin; (B) 10-20 parts by weight of hydrocarbon resin; (C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; (D) 0.01-3 parts by weight of initiating agent; (E) 10-100 parts by weight of filler; and (F) 0-80 parts by weight of phosphoric flame retardant. The prepreg and the laminate prepared by using the halogen-free resin composition have lower dielectric constant and lower dielectric loss tangent value, higher peeling strength, higher glass transition temperature, excellent heat resistance and good flame retardant effect.

Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight parts: (A) 40-80 parts by weight of allyl modified benzoxazine resin; (B) 10-20 parts by weight of hydrocarbon resin; (C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; (D) 0.01-3 parts by weight of initiating agent; (E) 10-100 parts by weight of filler; and (F) 0-80 parts by weight of phosphoric flame retardant. The prepreg and the laminate prepared by using the halogen-free resin composition have lower dielectric constant and lower dielectric loss tangent value, higher peeling strength, higher glass transition temperature, excellent heat resistance and good flame retardant effect.

Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight parts: (A) 40-80 parts by weight of allyl modified benzoxazine resin; (B) 10-20 parts by weight of hydrocarbon resin; (C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; (D) 0.01-3 parts by weight of initiating agent; (E) 10-100 parts by weight of filler; and (F) 0-80 parts by weight of phosphoric flame retardant. The prepreg and the laminate prepared by using the halogen-free resin composition have lower dielectric constant and lower dielectric loss tangent value, higher peeling strength, higher glass transition temperature, excellent heat resistance and good flame retardant effect.

The thermosetting resin composition, a prepreg containing same, a metal foil-clad laminate and a printed circuit board; the resin composition comprises the following components: a combination of a bismaleimide resin and a benzoxazine resin or a prepolymer of a bismaleimide resin and a benzoxazine resin, an epoxy resin and an active ester. A metal foil-clad laminate prepared by using the resin composition provided by the present invention has a high glass transition temperature, a low thermal expansion coefficient, a high high-temperature modulus, a high peel strength, a low dielectric constant, a low dielectric loss factor, as well as good heat resistance and good processability.