The present invention provides a cyanic acid ester compound having a structure represented by the following general formula (1):

##STR00001##

wherein n represents an integer of 1 or larger.

A resin composition for a printed wiring board containing a cyanate compound (A); a maleimide compound (B); and a benzoguanamine compound (C) having an aminomethyl group represented by the following general formula (1):

##STR00001##

wherein R is a hydrogen atom or a substituent selected from a group consisting of a hydrocarbon group having 1 to 10 carbon atoms, an alkoxyl group having 1 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, a hydroxyl group, an amide group, and a halogen atom, and n is an integer of 1 to 2.

The present invention relates to modified carbon black and a production method therefor, a resin composition and copper clad laminate. The modified carbon black comprises carbon black and a modified group; the surface of the carbon black has an acyl chloride group; the modified group is formed by a modified macromolecule and the acyl chloride group undergoing a grafting reaction; and the modified macromolecule is an alcohol macromolecule.

The present invention relates to modified carbon black and a production method therefor, a resin composition and copper clad laminate. The modified carbon black comprises carbon black and a modified group; the surface of the carbon black has an acyl chloride group; the modified group is formed by a modified macromolecule and the acyl chloride group undergoing a grafting reaction; and the modified macromolecule is an alcohol macromolecule.

A layered material includes a first carrier material and a second carrier material. The first carrier material is coated or saturated with a modified bitumen. The modified bitumen is a bitumen to which is added an agent selected from a wax, a silicone oil, stearic acid, alkene ketene dimer (AKD), alkenyl succinic anhydride (ASA), and mixtures thereof. The first carrier material is continuously attached to the second carrier material.

A triazine ring-containing phenol resin obtained by reacting melamine, para-alkylphenol, and formalin is used to provide an epoxy resin composition capable of providing a cured product with excellent flame retardancy, excellent dielectric characteristics such as a low dielectric tangent and a low dielectric constant, and excellent thermal conductivity, a cured product thereof, and a prepreg, a circuit board, a build-up film, a build-up board, a semiconductor sealing material, a semiconductor device, a fiber reinforced composite material, and a formed article using the epoxy resin composition.

A triazine ring-containing phenol resin obtained by reacting melamine, para-alkylphenol, and formalin is used to provide an epoxy resin composition capable of providing a cured product with excellent flame retardancy, excellent dielectric characteristics such as a low dielectric tangent and a low dielectric constant, and excellent thermal conductivity, a cured product thereof, and a prepreg, a circuit board, a build-up film, a build-up board, a semiconductor sealing material, a semiconductor device, a fiber reinforced composite material, and a formed article using the epoxy resin composition.

A hard-mask forming composition, which is used for forming a hard mask used in lithography, including a first resin and a second resin, in which an amount of carbon contained in the first resin is 85% by mass or more with respect to the total mass of all elements constituting the first resin, and the amount of carbon contained in the second resin is 70% by mass or more with respect to the total mass of all elements constituting the second resin and less than the amount of carbon contained in the first resin.

A hard-mask forming composition, which is used for forming a hard mask used in lithography, including a first resin and a second resin, in which an amount of carbon contained in the first resin is 85% by mass or more with respect to the total mass of all elements constituting the first resin, and the amount of carbon contained in the second resin is 70% by mass or more with respect to the total mass of all elements constituting the second resin and less than the amount of carbon contained in the first resin.

This disclosure generally provides compositions with improved flammability resistance and processes for preparing these compositions, wherein the resin composition comprising: (a) a polyfunctional isocyanate; (b) an isocyanate reactive composition comprising (b1) a polyfunctional polyol and a catalyst composition; and/or (b2) a polyfunctional amine; and (c) a benzoxazine component solved in the resin composition.