C08L61/34

High strength rubber composition

A rubber composition comprises at least one resin based on: (A1) at least one aromatic compound resulting from the reaction between a reactant of formula (α): ##STR00001##
where B represents CHO or CH.sub.2OH, (α) and a reactant of formula (β) or ##STR00002##
and (A2) at least one phenolic compound chosen from: (A21) at least one aromatic polyphenol comprising at least one aromatic ring bearing at least two hydroxyl functional groups in the meta position with respect to one another, the two positions ortho to at least one of the hydroxyl functional groups being unsubstituted; and/or (A22) at least one aromatic monophenol comprising at least one six-membered aromatic ring bearing a single hydroxyl functional group, the two positions ortho to the hydroxyl functional group being unsubstituted or at least one position ortho to and the position para to the hydroxyl functional group being unsubstituted.

FLAME-RETARDANT PHENOLIC RESIN FOAM

A phenolic resin foam has a density of 30 kg/m.sup.3 to 80 kg/m.sup.3, a closed cell ratio of 85% or more, and reaches a total amount of heat release of 8 MJ/m.sup.2 in a time of 20 minutes or more in a heat release test performed using a cone calorimeter.

RESIN COMPOSITION AND ARTICLE MADE THEREFROM
20210253855 · 2021-08-19 ·

A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 μm copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.

MODIFIED WOOD PRODUCT
20210197419 · 2021-07-01 ·

A method of producing a modified wood product is disclosed. The method comprises heating a resin impregnated wood product in a reactor, the resin impregnated wood product comprising source wood impregnated with a resin composition comprising resin, the heating being so as to substantially cure the resin, thereby to produce the modified wood product. The method comprises, during the heating of the resin impregnated wood product in the reactor, introducing water into the reactor. A reactor and a modified wood product are also disclosed.

Core-shell particle-based security pigment and method for production thereof

The invention relates to a security pigment, comprising core-shell particles having a core based on an organic addition polymer, a shell based on an organic condensation polymer and a feature substance present in the core in finely dispersed or dissolved form, wherein the addition polymer is a three-dimensionally cross-linked duromer.

Core-shell particle-based security pigment and method for production thereof

The invention relates to a security pigment, comprising core-shell particles having a core based on an organic addition polymer, a shell based on an organic condensation polymer and a feature substance present in the core in finely dispersed or dissolved form, wherein the addition polymer is a three-dimensionally cross-linked duromer.

THERMOSETTING RESIN COMPOSITION FOR COATING METAL THIN FILM AND METAL LAMINATE USING THE SAME

The present invention relates to a thermosetting resin composition for coating a metal film having high flowability and pattern-filling property and a metal laminate using the same.

THERMOSETTING RESIN COMPOSITION FOR COATING METAL THIN FILM AND METAL LAMINATE USING THE SAME

The present invention relates to a thermosetting resin composition for coating a metal film having high flowability and pattern-filling property and a metal laminate using the same.

HARD-MASK FORMING COMPOSITION AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
20210132498 · 2021-05-06 ·

A hard-mask forming composition including a resin (P1) containing a structural unit (u11) represented by General Formula (u11-1), and a resin (P2) containing an aromatic ring and a polar group, provided that the resin (P1) is excluded from the resin (P2), wherein R.sup.11 represents an aromatic hydrocarbon group which may have a substituent, Rp.sup.11 is an aldehyde group, a group represented by Formula (u-r-1), a group represented by Formula (u-r-2), or a group represented by Formula (u-r-3)

##STR00001##

HARD-MASK FORMING COMPOSITION AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
20210132498 · 2021-05-06 ·

A hard-mask forming composition including a resin (P1) containing a structural unit (u11) represented by General Formula (u11-1), and a resin (P2) containing an aromatic ring and a polar group, provided that the resin (P1) is excluded from the resin (P2), wherein R.sup.11 represents an aromatic hydrocarbon group which may have a substituent, Rp.sup.11 is an aldehyde group, a group represented by Formula (u-r-1), a group represented by Formula (u-r-2), or a group represented by Formula (u-r-3)

##STR00001##