Provided are a resin composition for encapsulation that is superior in high-temperature reverse bias test (HTRB test) reliability; and a semiconductor device. The resin composition for encapsulation is used to encapsulate a power semiconductor element made of Si, SiC, GaN, Ga.sub.2O.sub.3 or diamond, and a cured product of the resin composition for encapsulation has a dielectric tangent of not larger than 0.50 when measured at 150° C. and 0.1 Hz. The semiconductor device is such that a power semiconductor element made of Si, SiC, GaN, Ga.sub.2O.sub.3 or diamond is encapsulated by the cured product of the resin composition for encapsulation.

Provided are a resin composition for encapsulation that is superior in high-temperature reverse bias test (HTRB test) reliability; and a semiconductor device. The resin composition for encapsulation is used to encapsulate a power semiconductor element made of Si, SiC, GaN, Ga.sub.2O.sub.3 or diamond, and a cured product of the resin composition for encapsulation has a dielectric tangent of not larger than 0.50 when measured at 150° C. and 0.1 Hz. The semiconductor device is such that a power semiconductor element made of Si, SiC, GaN, Ga.sub.2O.sub.3 or diamond is encapsulated by the cured product of the resin composition for encapsulation.

An electrophotographic photoreceptor includes a conductive substrate and a photosensitive layer containing a charge transport portion including a first hole transport material represented by General Formula (1) below, a cured resin, and a cross-linked structure there between: ##STR00001## where Za is a polymerizable functional group with a Structural Formula (2), (3), or (4), Zb is a divalent group with a Structural Formula (6) or (7), Ra, Rb, Rc and Rd each are one of a branched or unbranched alkyl group having from 1 to 6 carbon atoms, an alkoxy group having from 1 to 6 carbon atoms, a substituted or unsubstituted phenyl group, or a substituted or unsubstituted styryl group, I is 0 or 1 when Za is (2) or (4) and 1 when Za is (3), m is from 0 to 5, n, o, and p are each from 0 to 4, q is from 1 to 3.

An electrophotographic photoreceptor includes a conductive substrate and a photosensitive layer containing a charge transport portion including a first hole transport material represented by General Formula (1) below, a cured resin, and a cross-linked structure there between: ##STR00001## where Za is a polymerizable functional group with a Structural Formula (2), (3), or (4), Zb is a divalent group with a Structural Formula (6) or (7), Ra, Rb, Rc and Rd each are one of a branched or unbranched alkyl group having from 1 to 6 carbon atoms, an alkoxy group having from 1 to 6 carbon atoms, a substituted or unsubstituted phenyl group, or a substituted or unsubstituted styryl group, I is 0 or 1 when Za is (2) or (4) and 1 when Za is (3), m is from 0 to 5, n, o, and p are each from 0 to 4, q is from 1 to 3.

A rubber composition exhibiting an improved processability/stiffness compromise is based on at least a diene elastomer, a reinforcing filler, a crosslinking system, between 1 and 30 parts by weight per hundred parts by weight of elastomer, phr, of an epoxy resin and between 1 and 15 phr of a specific amine-comprising hardener comprising in particular at least two primary amine functional groups located on at least one six-membered aromatic ring and at least two Ri radicals, which are identical or different, selected from the group consisting of linear or branched C.sub.1-C.sub.6 alkyl radicals, halogens, and ethers, tertiary amines, thioethers, ketones, esters and amides, substituted by linear or branched C.sub.1-C.sub.6 alkyl radicals, the said ring not comprising a hydrogen atom located in the ortho position with respect to the primary amine functional groups.

A rubber composition exhibiting an improved processability/stiffness compromise is based on at least a diene elastomer, a reinforcing filler, a crosslinking system, between 1 and 30 parts by weight per hundred parts by weight of elastomer, phr, of an epoxy resin and between 1 and 15 phr of a specific amine-comprising hardener comprising in particular at least two primary amine functional groups located on at least one six-membered aromatic ring and at least two Ri radicals, which are identical or different, selected from the group consisting of linear or branched C.sub.1-C.sub.6 alkyl radicals, halogens, and ethers, tertiary amines, thioethers, ketones, esters and amides, substituted by linear or branched C.sub.1-C.sub.6 alkyl radicals, the said ring not comprising a hydrogen atom located in the ortho position with respect to the primary amine functional groups.

A rubber composition exhibiting an improved processability/stiffness compromise is based on at least a diene elastomer, a reinforcing filler, a crosslinking system, between 1 and 30 parts by weight per hundred parts by weight of elastomer, phr, of an epoxy resin and between 1 and 15 phr of a specific amine-comprising hardener comprising in particular at least two primary amine functional groups located on at least one six-membered aromatic ring and at least two Ri radicals, which are identical or different, selected from the group consisting of linear or branched C.sub.1-C.sub.6 alkyl radicals, halogens, and ethers, tertiary amines, thioethers, ketones, esters and amides, substituted by linear or branched C.sub.1-C.sub.6 alkyl radicals, the said ring not comprising a hydrogen atom located in the ortho position with respect to the primary amine functional groups.

A curing composition is useful for a multi-component epoxy resin compound and includes at least one first polyamine, at least one second polyamine, and at least one polyphenol from the group of bisphenols and novolac resins as an accelerator. Upon contact with atmospheric oxygen, the curing composition discolors within a few days and therefore leakages can be visually identified.

A curing composition is useful for a multi-component epoxy resin compound and includes at least one first polyamine, at least one second polyamine, and at least one polyphenol from the group of bisphenols and novolac resins as an accelerator. Upon contact with atmospheric oxygen, the curing composition discolors within a few days and therefore leakages can be visually identified.

Provided is a resin composition for an acoustic matching layer, the resin composition including metal particles (A), an epoxy resin (B), a polythiol compound (C), and a cure-accelerating compound (D). The epoxy resin (B) includes at least one epoxy resin selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins, and the polythiol compound (C) includes a compound having at least two specific partial structures. Also provided are a cured product formed of the composition, an acoustic matching sheet, an acoustic probe, an acoustic measuring apparatus, and a method for producing an acoustic probe. Further provided is an acoustic matching layer material set suitable for preparation of the composition.