The present invention relates to a polyester elastomer resin composition containing: (A) a thermoplastic polyester elastomer; (B) a di- or higher functional epoxy compound; (C) an organic carboxylic acid alkali metal salt having 3 to 40 carbon atoms; (D) an inorganic crystal nucleating agent; and (E) a urea compound scavenger having an amine value of 50 eq/t or more, wherein per 100 parts by mass of component (A), component (B) is present in an amount of 0.1 to 5 parts by mass, component (D) is present in an amount of 0 to 3 parts by mass, and component (E) is present in an amount of 0.1 to 5 parts by mass; component (C), on an alkali metal basis, is present in an amount of 50 to 2000 ppm in the polyester elastomer resin composition on a mass basis.

A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100140 parts of halogen-free phosphorous epoxy resin, 1035 parts of dicyclopentadiene phenolic epoxy resin, 3260 parts of benzoxazine, 15 parts of phenolic resin, 0.050.5 parts of accelerants; and 2570 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI500V), high heat resistance (Tg150 C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.

A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100140 parts of halogen-free phosphorous epoxy resin, 1035 parts of dicyclopentadiene phenolic epoxy resin, 3260 parts of benzoxazine, 15 parts of phenolic resin, 0.050.5 parts of accelerants; and 2570 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI500V), high heat resistance (Tg150 C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.

Disclosed are powder coating compositions that include a polymeric aromatic product of an aromatic isocyanate manufacturing process.

Disclosed are powder coating compositions that include a polymeric aromatic product of an aromatic isocyanate manufacturing process.

There is provided an epoxy resin composition containing an epoxy compound, which has a low viscosity and a low dielectric constant, and when added to a general-purpose epoxy resin composition, can lower a viscosity of the composition and can sufficiently lower a dielectric constant of an epoxy resin cured product obtained from the composition. An epoxy resin composition comprising: (a) an epoxy component containing at least an epoxy compound of formula [1]; and (b) a curing agent:

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wherein R.sup.1 to R.sup.3 each independently are a hydrogen atom or methyl group, and L.sup.1 to L.sup.3 each independently are pentamethylene group, hexamethylene group or heptamethylene group.

An epoxy resin composition includes: an [A] epoxy resin at least comprising an [A1] isocyanurate epoxy resin and an [A2] glycidyl amine epoxy resin; [B] dicyandiamide; and [C] diaminodiphenyl sulfone, wherein (1) an average epoxy equivalent of the [A] epoxy resin is 115 g/eq to 150 g/eq, and (2) an amount of the component [C] added is an amount of 0.05 equivalent to 0.3 equivalent relative to epoxy groups in the [A] epoxy resin in terms of active hydrogen groups.

An epoxy resin composition includes: an [A] epoxy resin at least comprising an [A1] isocyanurate epoxy resin and an [A2] glycidyl amine epoxy resin; [B] dicyandiamide; and [C] diaminodiphenyl sulfone, wherein (1) an average epoxy equivalent of the [A] epoxy resin is 115 g/eq to 150 g/eq, and (2) an amount of the component [C] added is an amount of 0.05 equivalent to 0.3 equivalent relative to epoxy groups in the [A] epoxy resin in terms of active hydrogen groups.

The present invention provides porous particles uniform in shape and having through holes that are not closed. The porous particles according to the present invention are porous particles having a substantially spherical shape. Each of the porous particles has an interconnected pore structure in which through holes provided inside the porous particle communicate with each other, and ends of the through holes are open toward an outside of the porous particle.

The present invention provides porous particles uniform in shape and having through holes that are not closed. The porous particles according to the present invention are porous particles having a substantially spherical shape. Each of the porous particles has an interconnected pore structure in which through holes provided inside the porous particle communicate with each other, and ends of the through holes are open toward an outside of the porous particle.