The present invention relates to a halogen-free resin composition and a prepreg and a laminated board prepared therefrom. The halogen-free resin composition contains the following components in parts by weight: 50-100 parts of an epoxy resin; 20-70 parts of benzoxazine; 5-40 parts of a polyphenyl ether; 5-40 parts of allyl benzene-maleic anhydride; 10-60 parts of a halogen-free flame retardant; 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and laminated board prepared from the halogen-free resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance, cohesiveness and moisture resistance, etc., and are suitable for use in a halogen-free high multilayer circuit board.

An aspect of the present invention is a resin composition containing a polybutadiene compound having an epoxy group in a molecule, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, a styrene-based block copolymer, and a curing agent. ##STR00001## In Formula (1), p represents 0 to 10, Z represents an arylene group, and R.sub.1 to R.sub.3 each independently represent a hydrogen atom or an alkyl group. ##STR00002## In Formula (2), R.sub.4 represents a hydrogen atom or an alkyl group.

An aspect of the present invention is a resin composition containing a polybutadiene compound having an epoxy group in a molecule, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, a styrene-based block copolymer, and a curing agent. ##STR00001## In Formula (1), p represents 0 to 10, Z represents an arylene group, and R.sub.1 to R.sub.3 each independently represent a hydrogen atom or an alkyl group. ##STR00002## In Formula (2), R.sub.4 represents a hydrogen atom or an alkyl group.

An aspect of the present invention is a resin composition containing a polybutadiene compound having an epoxy group in a molecule, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, a styrene-based block copolymer, and a curing agent. ##STR00001## In Formula (1), p represents 0 to 10, Z represents an arylene group, and R.sub.1 to R.sub.3 each independently represent a hydrogen atom or an alkyl group. ##STR00002## In Formula (2), R.sub.4 represents a hydrogen atom or an alkyl group.

Provided are surface treatment agents that enable surfaces with a chemically fixed lubricant to be produced instead of a resin coating which has drawbacks, such as that lubricity is reduced due to separation, peeling or the like of the coating during the movement within a vessel or tube; and medical devices, such as catheters, having a surface at least partially treated with such a surface treatment agent. The present invention relates to a surface treatment agent for medical devices which contains a copolymer of a hydrophilic functional group-containing monomer and an epoxy group-containing monomer.

Provided are surface treatment agents that enable surfaces with a chemically fixed lubricant to be produced instead of a resin coating which has drawbacks, such as that lubricity is reduced due to separation, peeling or the like of the coating during the movement within a vessel or tube; and medical devices, such as catheters, having a surface at least partially treated with such a surface treatment agent. The present invention relates to a surface treatment agent for medical devices which contains a copolymer of a hydrophilic functional group-containing monomer and an epoxy group-containing monomer.

A composition for an optical waveguide is cured into a sheet to give a cured product. A difference in light transmittance with respect to light having a wavelength of 450 nm is 15% or less between this cured product and this cured product after retention in atmosphere at 175 C. for 40 hours, the light transmittance being calculated in terms of the cured product at a thickness of 50 m.

A composition for an optical waveguide is cured into a sheet to give a cured product. A difference in light transmittance with respect to light having a wavelength of 450 nm is 15% or less between this cured product and this cured product after retention in atmosphere at 175 C. for 40 hours, the light transmittance being calculated in terms of the cured product at a thickness of 50 m.

Disclosed is a resin composition, comprising the following components: (A) 100 parts by weight of an epoxy resin; (B) 10 to 60 parts by weight of a diamino diphenyl ether type benzoxazine resin having a softening point of 40 C. to 140 C.; (C) 10 to 40 parts by weight of a co-hardener; and (D) 10 to 40 parts by weight of a flame retardant which comprises (d1) a high melting point flame retardant with a melting point of greater than 260 C. or (d2) a metal phosphinate flame retardant, wherein the metal is selected from Group IIIA elements. Also disclosed is an article of manufacture obtained from the resin composition and a use thereof. Accordingly, the demands of high frequency application can be met, and a balance of low thermal expansion, high thermal resistance and low warpage in the system can be struck.

Disclosed is a resin composition, comprising the following components: (A) 100 parts by weight of an epoxy resin; (B) 10 to 60 parts by weight of a diamino diphenyl ether type benzoxazine resin having a softening point of 40 C. to 140 C.; (C) 10 to 40 parts by weight of a co-hardener; and (D) 10 to 40 parts by weight of a flame retardant which comprises (d1) a high melting point flame retardant with a melting point of greater than 260 C. or (d2) a metal phosphinate flame retardant, wherein the metal is selected from Group IIIA elements. Also disclosed is an article of manufacture obtained from the resin composition and a use thereof. Accordingly, the demands of high frequency application can be met, and a balance of low thermal expansion, high thermal resistance and low warpage in the system can be struck.