The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

A resin composition, a metal-resin composite formed with the resin composition and a metal substrate and a preparation method and use thereof, and an electronic product shell using the resin composition are provided. The resin composition comprises a base resin, a modified resin and a fiber, wherein the base resin is one or two or more of a polyarylene sulfide resin, a polyether resin, and a polyester resin, and the modified resin has a melting point that is 3-24° C. higher than a glass transition temperature of the base resin.

A resin composition, a metal-resin composite formed with the resin composition and a metal substrate and a preparation method and use thereof, and an electronic product shell using the resin composition are provided. The resin composition comprises a base resin, a modified resin and a fiber, wherein the base resin is one or two or more of a polyarylene sulfide resin, a polyether resin, and a polyester resin, and the modified resin has a melting point that is 3-24° C. higher than a glass transition temperature of the base resin.

A self-lubricating composite material is disclosed. The self-lubricating composite material can include discontinuous polymer fiber segments dispersed within a woven matrix of semi-continuous thermoplastic fiber. The woven matrix can be embedded within a thermosetting resin. Also disclosed are methods of manufacturing the self-lubricating composite material.

A self-lubricating composite material is disclosed. The self-lubricating composite material can include discontinuous polymer fiber segments dispersed within a woven matrix of semi-continuous thermoplastic fiber. The woven matrix can be embedded within a thermosetting resin. Also disclosed are methods of manufacturing the self-lubricating composite material.

To provide a composite laminate having excellent adhesiveness to a resin material imparted to a metal base material, such as an aluminum, and a method for producing the same, and a metal-resin bonded article using the composite laminate and a method for producing the same. A composite laminate 1 includes a metal base material 2 and one layer or plural layers of a resin coating layer 4 laminated on the metal base material 2, the resin coating layer 4 is laminated on a surface-treated surface of the metal base material 2, and at least one layer of the resin coating layer 4 is formed of a resin composition containing an in situ polymerizable phenoxy resin.

To provide a composite laminate having excellent adhesiveness to a resin material imparted to a metal base material, such as an aluminum, and a method for producing the same, and a metal-resin bonded article using the composite laminate and a method for producing the same. A composite laminate 1 includes a metal base material 2 and one layer or plural layers of a resin coating layer 4 laminated on the metal base material 2, the resin coating layer 4 is laminated on a surface-treated surface of the metal base material 2, and at least one layer of the resin coating layer 4 is formed of a resin composition containing an in situ polymerizable phenoxy resin.

A process of preparing a compounded hydrostable poly(aliphatic ester-carbonate) includes providing a hydrostable poly(aliphatic ester-carbonate), compounding in an extruder the hydrostable poly(aliphatic ester-carbonate) and 0.05 wt % to 0.60 wt % of a multifunctional epoxide compounding stabilizer, based on the total weight of the compounded hydrostable poly(aliphatic ester-carbonate), under vacuum of 17000 to 85000 Pascals, and a torque of 30% to 75%, to provide the compounded hydrostable poly(aliphatic ester-carbonate). After compounding, at least one of the following apply: the inter-sample variability in molecular weight is less than 5%, wherein inter-sample variability is determined by comparing five 100 mil chips of the compounded hydrostable poly(aliphatic ester-carbonate); the % weight average molecular weight (MW) difference is less than 5% after hydroaging at 85° C. and 85% humidity; or the compounded poly(aliphatic ester-carbonate) has less than 75 ppm of unreacted —COOH end groups measured by .sup.31P NMR.

A process of preparing a compounded hydrostable poly(aliphatic ester-carbonate) includes providing a hydrostable poly(aliphatic ester-carbonate), compounding in an extruder the hydrostable poly(aliphatic ester-carbonate) and 0.05 wt % to 0.60 wt % of a multifunctional epoxide compounding stabilizer, based on the total weight of the compounded hydrostable poly(aliphatic ester-carbonate), under vacuum of 17000 to 85000 Pascals, and a torque of 30% to 75%, to provide the compounded hydrostable poly(aliphatic ester-carbonate). After compounding, at least one of the following apply: the inter-sample variability in molecular weight is less than 5%, wherein inter-sample variability is determined by comparing five 100 mil chips of the compounded hydrostable poly(aliphatic ester-carbonate); the % weight average molecular weight (MW) difference is less than 5% after hydroaging at 85° C. and 85% humidity; or the compounded poly(aliphatic ester-carbonate) has less than 75 ppm of unreacted —COOH end groups measured by .sup.31P NMR.

A fiber structure includes a biodegradable polymer fiber, the fiber structure having two or more peaks in a molecular weight distribution obtained by GPC measurement of the biodegradable polymer, and the fiber structure having one or more peaks in each of a region of 100,000 or less of molecular weight and a region of more than 100,000 of molecular weight in the molecular weight distribution obtained by GPC measurement of the biodegradable polymer.