A self-lubricating composite material is disclosed. The self-lubricating composite material can include discontinuous polymer fiber segments dispersed within a woven matrix of semi-continuous thermoplastic fiber. The woven matrix can be embedded within a thermosetting resin. Also disclosed are methods of manufacturing the self-lubricating composite material.

A resin composition includes (A) a polyolefin epoxy resin, (B) an epoxy resin having a condensed polycyclic aromatic hydrocarbon, (C) a nitrogen-containing novolak resin, and (D) an inorganic filler, in which an epoxy equivalent of the (A) component is 200 g/eq. or more, a nitrogen content in the (C) component is 13% by mass or more and/or the (C) component has a cresol novolak structure, and a content of the (D) component is 60% by mass or more on the basis of 100% by mass of non-volatile components in the resin composition.

A resin composition includes (A) a polyolefin epoxy resin, (B) an epoxy resin having a condensed polycyclic aromatic hydrocarbon, (C) a nitrogen-containing novolak resin, and (D) an inorganic filler, in which an epoxy equivalent of the (A) component is 200 g/eq. or more, a nitrogen content in the (C) component is 13% by mass or more and/or the (C) component has a cresol novolak structure, and a content of the (D) component is 60% by mass or more on the basis of 100% by mass of non-volatile components in the resin composition.

Provided is a curable composition for a polymer electrolyte, including: a component (A): a radical polymerizable compound having a (meth)acryloyl group, a component (B): a compound having, in one molecule, an epoxy group and a skeleton of at least one selected from the group consisting of polybutadiene, polyisoprene, hydrogenated polybutadiene, and hydrogenated polyisoprene, and a component (C): a radical polymerization initiator, in which a content of each of the components (A) to (C) based on the entire composition is as follows, the component (A): from 30 to 98.9% by mass the component (B): from 1 to 40% by mass, and the component (C): from 0.1 to 15% by mass.

Provided is a curable composition for a polymer electrolyte, including: a component (A): a radical polymerizable compound having a (meth)acryloyl group, a component (B): a compound having, in one molecule, an epoxy group and a skeleton of at least one selected from the group consisting of polybutadiene, polyisoprene, hydrogenated polybutadiene, and hydrogenated polyisoprene, and a component (C): a radical polymerization initiator, in which a content of each of the components (A) to (C) based on the entire composition is as follows, the component (A): from 30 to 98.9% by mass the component (B): from 1 to 40% by mass, and the component (C): from 0.1 to 15% by mass.

This invention relates to an epoxy based composition, comprising at least one epoxidized unsaturated polyolefin; at least one thiol compound; and at least one curing catalyst. The epoxy based composition according to the present invention exhibits fast curing property under UV light and has improved adhesion strength after being further heated.

The present invention relates to a polypropylene resin composition containing a polypropylene resin, an elastomer having a polar functional group, and a filler. The polypropylene resin composition of the present invention can be suitably used in manufactured articles of audio equipment, electric appliances, transportation vehicles, construction buildings, industrial equipment, and the like.

The present invention relates to a polypropylene resin composition containing a polypropylene resin, an elastomer having a polar functional group, and a filler. The polypropylene resin composition of the present invention can be suitably used in manufactured articles of audio equipment, electric appliances, transportation vehicles, construction buildings, industrial equipment, and the like.

The present invention relates to a polypropylene resin composition containing a polypropylene resin, an elastomer having a polar functional group, and a filler. The polypropylene resin composition of the present invention can be suitably used in manufactured articles of audio equipment, electric appliances, transportation vehicles, construction buildings, industrial equipment, and the like.

The present invention relates to a thermosetting resin composition, and a prepreg and a printed circuit board using the same and, more particularly, to a thermosetting resin composition, and a prepreg and a printed circuit board using the same, wherein the thermosetting resin composition can be used for a printed circuit board which simultaneously has excellent low dielectric loss characteristics, good moisture absorption and heat resistance, low thermal expansion characteristics, and thermal stability.