An epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an unsaturated fatty acid amide having from 14 to 24 carbons, a gas barrier laminate and a retort food packaging material using the epoxy resin composition, an odor-proofing or aroma-retaining packaging material, an odor-proofing or aroma-retaining method of sealing an article containing an odorous component or an aromatic component in the packaging material, a heat-shrinkable label, the production method of the heat-shrinkable label, a heat-shrunken label and a bottle having the heat-shrunken label, and a CO.sub.2 transmission prevention method.

An end and monomer functionalized poly(propylene fumarate) polymer and methods for preparing this polymer, comprising isomerized residue of a maleic anhydride monomer and a functionalized propylene oxide monomer according to the formula: ##STR00001## where n is an integer from more than 1 to 100; R is the residue of an initiating alcohol having a propargyl, norbornene, ketone or benzyl functional group; and R′ is a second functional group selected from the group consisting of propargyl groups, 2-nitrophenyl groups, and combinations thereof are disclosed. The end and monomer functional groups allow for post-polymerization modification with bioactive materials using “click” chemistries and use of the polymer for a variety of applications in medical fields, including, for example, 3-D printed polymer scaffold.

An end and monomer functionalized poly(propylene fumarate) polymer and methods for preparing this polymer, comprising isomerized residue of a maleic anhydride monomer and a functionalized propylene oxide monomer according to the formula: ##STR00001## where n is an integer from more than 1 to 100; R is the residue of an initiating alcohol having a propargyl, norbornene, ketone or benzyl functional group; and R′ is a second functional group selected from the group consisting of propargyl groups, 2-nitrophenyl groups, and combinations thereof are disclosed. The end and monomer functional groups allow for post-polymerization modification with bioactive materials using “click” chemistries and use of the polymer for a variety of applications in medical fields, including, for example, 3-D printed polymer scaffold.

The present invention relates to a method of insulating a motor, comprising: providing a impregnating resin; heating up the motor windings with electricity to 100-120° C., and potting the motor windings with the impregnating resin for 2-5 min at that temperature; heating up the motor windings with electricity to 140-160° C., and trickling the impregnating resin for 3-8 min for insulation; heating up the motor windings with electricity to 165-175° C., and curing for 15-45 min. The method of insulating a motor provided by the present invention has a higher resin filling level and a higher resin utilization rate, as well as faster curing speed.

The present invention relates to a method of insulating a motor, comprising: providing a impregnating resin; heating up the motor windings with electricity to 100-120° C., and potting the motor windings with the impregnating resin for 2-5 min at that temperature; heating up the motor windings with electricity to 140-160° C., and trickling the impregnating resin for 3-8 min for insulation; heating up the motor windings with electricity to 165-175° C., and curing for 15-45 min. The method of insulating a motor provided by the present invention has a higher resin filling level and a higher resin utilization rate, as well as faster curing speed.

The present invention relates to an adhesive film for a semiconductor, including: a first layer including an adhesive binder and a heat-dissipating filler; and a second layer including an adhesive binder and a magnetic filler, which is formed on at least one surface of the first layer, wherein the adhesive film has a predetermined composition for the adhesive binder included in each of the first layer and the second layer.

The present invention relates to an adhesive film for a semiconductor, including: a first layer including an adhesive binder and a heat-dissipating filler; and a second layer including an adhesive binder and a magnetic filler, which is formed on at least one surface of the first layer, wherein the adhesive film has a predetermined composition for the adhesive binder included in each of the first layer and the second layer.

The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. An information carrying card includes a body defining a first cavity and a second cavity. The first cavity has a first area and the second cavity has a second area. The first cavity is continuous with the second cavity and the second area is less than the first area. A circuit element is disposed within the first cavity.

The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. An information carrying card includes a body defining a first cavity and a second cavity. The first cavity has a first area and the second cavity has a second area. The first cavity is continuous with the second cavity and the second area is less than the first area. A circuit element is disposed within the first cavity.

The present invention relates to a thermosetting material for use in additive manufacturing, the material comprising at least one thermosetting resin and at least two curing compounds different from said thermosetting resin that are able to cure this/these thermosetting resin(s), wherein at least one curing compound is provided for curing during the additive manufacturing process and at least one curing compound is provided for curing during a post-curing step. The invention furthermore relates to a method of producing a cured 3D thermoset object comprising at least the steps of subjecting the material according to the present invention to an additive manufacturing process, obtaining a partially cured 3D thermoset object and subsequently subjecting the partially cured 3D thermoset object to a post-curing process to further cure the 3D thermoset object Additionally, the invention relates to the use of the material in an SLS, FFF, CBAM, FGF or powder bed additive manufacturing process.