The present invention relates to a thermosetting material for use in additive manufacturing, the material comprising at least one thermosetting resin and at least two curing compounds different from said thermosetting resin that are able to cure this/these thermosetting resin(s), wherein at least one curing compound is provided for curing during the additive manufacturing process and at least one curing compound is provided for curing during a post-curing step. The invention furthermore relates to a method of producing a cured 3D thermoset object comprising at least the steps of subjecting the material according to the present invention to an additive manufacturing process, obtaining a partially cured 3D thermoset object and subsequently subjecting the partially cured 3D thermoset object to a post-curing process to further cure the 3D thermoset object Additionally, the invention relates to the use of the material in an SLS, FFF, CBAM, FGF or powder bed additive manufacturing process.

The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. An information carrying card includes a body defining a first cavity and a second cavity. The first cavity has a first area and the second cavity has a second area. The first cavity is continuous with the second cavity and the second area is less than the first area. A circuit element is disposed within the first cavity.

The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. An information carrying card includes a body defining a first cavity and a second cavity. The first cavity has a first area and the second cavity has a second area. The first cavity is continuous with the second cavity and the second area is less than the first area. A circuit element is disposed within the first cavity.

The present invention relates to a thermoplastic resin composition, a method of preparing the same and a molded article including the same. More particularly, the thermoplastic resin composition includes a polycarbonate resin having a limited melt flow index, a polyorganosiloxane-polycarbonate resin, a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound copolymer, a polyester resin and an epoxy group-containing copolymer in predetermined weight ratios.

The present invention relates to a thermoplastic resin composition, a method of preparing the same and a molded article including the same. More particularly, the thermoplastic resin composition includes a polycarbonate resin having a limited melt flow index, a polyorganosiloxane-polycarbonate resin, a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound copolymer, a polyester resin and an epoxy group-containing copolymer in predetermined weight ratios.

A resin composition includes (A) a polyolefin epoxy resin, (B) an epoxy resin having a condensed polycyclic aromatic hydrocarbon, (C) a nitrogen-containing novolak resin, and (D) an inorganic filler, in which an epoxy equivalent of the (A) component is 200 g/eq. or more, a nitrogen content in the (C) component is 13% by mass or more and/or the (C) component has a cresol novolak structure, and a content of the (D) component is 60% by mass or more on the basis of 100% by mass of non-volatile components in the resin composition.

A resin composition includes (A) a polyolefin epoxy resin, (B) an epoxy resin having a condensed polycyclic aromatic hydrocarbon, (C) a nitrogen-containing novolak resin, and (D) an inorganic filler, in which an epoxy equivalent of the (A) component is 200 g/eq. or more, a nitrogen content in the (C) component is 13% by mass or more and/or the (C) component has a cresol novolak structure, and a content of the (D) component is 60% by mass or more on the basis of 100% by mass of non-volatile components in the resin composition.

A curable epoxy composition comprising a polyvalent epoxy compound (A) having a biphenyl structure and/or condensed polycyclic structure, a phosphorus-containing epoxy compound (B) having a structure shown by the following formula (1) or (2), and a triazine structure-containing phenol resin (C) and a film, laminated film, prepreg, laminate, cured article, and composite article obtained using the same are provided.

##STR00001##

Where, in the formula (1), each of R.sup.1 and R.sup.2 respectively independently represents a hydrocarbon group having 1 to 6 carbon atoms, the pluralities of R.sup.1 and R.sup.2 may be the same or different, and each of “m” and “n” respectively independently represents an integer of 0 to 4, and where, in the formula (2), each of R.sup.1 and R.sup.2 respectively independently represents a hydrocarbon group having 1 to 6 carbon atoms, the pluralities of R.sup.1 and R.sup.2 may be the same or different, and each of “m” and “n” respectively independently represents an integer of 0 to 5.

A curable epoxy composition comprising a polyvalent epoxy compound (A) having a biphenyl structure and/or condensed polycyclic structure, a phosphorus-containing epoxy compound (B) having a structure shown by the following formula (1) or (2), and a triazine structure-containing phenol resin (C) and a film, laminated film, prepreg, laminate, cured article, and composite article obtained using the same are provided.

##STR00001##

Where, in the formula (1), each of R.sup.1 and R.sup.2 respectively independently represents a hydrocarbon group having 1 to 6 carbon atoms, the pluralities of R.sup.1 and R.sup.2 may be the same or different, and each of “m” and “n” respectively independently represents an integer of 0 to 4, and where, in the formula (2), each of R.sup.1 and R.sup.2 respectively independently represents a hydrocarbon group having 1 to 6 carbon atoms, the pluralities of R.sup.1 and R.sup.2 may be the same or different, and each of “m” and “n” respectively independently represents an integer of 0 to 5.

Provided is a one-pack type adhesive which contains (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler and (E) a polycarbodiimide compound, and wherein: the curing agent (B) contains at least one amine-based curing agent; the curing accelerator (C) contains at least one capsule type curing accelerator; the inorganic filler (D) contains at least one flake-like inorganic filler; and the content of the inorganic filler (D) is 10-200 parts by mass relative to 100 parts by mass of the epoxy resin (A).