Provided is a polymer of the formula: ##STR00001##
and compositions comprising the same. The polymers comprise a cyclic unsaturated group (Z.sup.3) within the siloxane polymer backbone. The polymers have been found to exhibit good thermal conductivity and may find utility in a variety of applications.

The present invention relates to rapid-curing resin formulations as well as fiber-reinforced composite materials comprising the same and their use in the manufacture of molded articles, particularly where the manufacturing process requires high throughput and where resin formulations having consistent handling characteristics (e.g., tack and flexibility) would be preferable across normal to elevated laminating environments (as defined by temperatures between 20 C. and 60 C.). The present invention further relates to a manufacturing process for preparing an article, particularly a molded article, from a fiber-reinforced composite material comprising a rapid-curing resin formulation.

The present invention relates to rapid-curing resin formulations as well as fiber-reinforced composite materials comprising the same and their use in the manufacture of molded articles, particularly where the manufacturing process requires high throughput and where resin formulations having consistent handling characteristics (e.g., tack and flexibility) would be preferable across normal to elevated laminating environments (as defined by temperatures between 20 C. and 60 C.). The present invention further relates to a manufacturing process for preparing an article, particularly a molded article, from a fiber-reinforced composite material comprising a rapid-curing resin formulation.

A method for manufacturing a three-dimensional (3D) object with an additive manufacturing system, comprising a step consisting in printing layers of the 3D object from the part material comprising a polymeric component comprising, based on the total weight of the polymeric component: from 5 to 95 wt. % of at least one polymer (P1) comprising at least 50 mol. % of recurring units (R1) consisting of an arylene group comprising at least one benzene ring, each recurring unit (R1) being bound to each other through CC bonds, wherein the recurring units (R1) are such that, based on the total number of moles of recurring units (R1):less than 90 mol. % are rigid rod-forming arylene units (R1-a), and at least 10 mol. % are kink-forming arylene units (R1-b), and from 5 to 95 wt. % of at least one polymer (P2), having a glass transition temperature (Tg) between 140 C. and 265 C., and no melting peak, as measured by differential scanning calorimetry (DSC) according to ASTM D3418.

A method for manufacturing a three-dimensional (3D) object with an additive manufacturing system, comprising a step consisting in printing layers of the 3D object from the part material comprising a polymeric component comprising, based on the total weight of the polymeric component: from 5 to 95 wt. % of at least one polymer (P1) comprising at least 50 mol. % of recurring units (R1) consisting of an arylene group comprising at least one benzene ring, each recurring unit (R1) being bound to each other through CC bonds, wherein the recurring units (R1) are such that, based on the total number of moles of recurring units (R1):less than 90 mol. % are rigid rod-forming arylene units (R1-a), and at least 10 mol. % are kink-forming arylene units (R1-b), and from 5 to 95 wt. % of at least one polymer (P2), having a glass transition temperature (Tg) between 140 C. and 265 C., and no melting peak, as measured by differential scanning calorimetry (DSC) according to ASTM D3418.

An adhesive composition having a low dielectric constant and dielectric loss tangent and an excellent folding endurance includes: with respect to the total of 100 parts by mass of the adhesive composition, 75 to 90 parts by mass of a styrene elastomer; 3 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; and totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent.

An adhesive composition having a low dielectric constant and dielectric loss tangent and an excellent folding endurance includes: with respect to the total of 100 parts by mass of the adhesive composition, 75 to 90 parts by mass of a styrene elastomer; 3 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; and totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent.

A method for synthesizing a poly(phenylene) with high ion selectivity comprises dissolving an alkyl halide poly(phenylene) in a polar aprotic solvent to form a nonaqueous solution and adding an anhydrous nucleophile to the nonaqueous solution to replace the halide of the alkyl halide poly(phenylene) with a cationic group of the nucleophile. The poly(phenylene) can be used in anion exchange membranes.

A method for synthesizing a poly(phenylene) with high ion selectivity comprises dissolving an alkyl halide poly(phenylene) in a polar aprotic solvent to form a nonaqueous solution and adding an anhydrous nucleophile to the nonaqueous solution to replace the halide of the alkyl halide poly(phenylene) with a cationic group of the nucleophile. The poly(phenylene) can be used in anion exchange membranes.

A method of preparing a thermoplastic composition is provided. The method includes the following steps. A polyetherimide or a polyphenylene sulfide is provided. A polyimide is provided, wherein the glass transition temperature of the polyimide is between 128 C. and 169 C., the 10% thermogravimetric loss temperature of the polyimide is between 490 C. and 534 C., and when the polyimide is dissolved in N-methyl-2-pyrrolidone and the solid content of the polyimide is 30 wt %, the viscosity of the polyimide is between 100 cP and 250 cP. A melt process is performed to mix the polyetherimide and the polyimide or mix the polyphenylene sulfide and the polyimide to form a thermoplastic composition. Further, a thermoplastic composition is also provided.