A method for producing a polyurethane polymer comprises the steps of: (a) providing a polyol composition, the polyol composition comprising (i) a polyol, (ii) a polyethylenimine compound; and (iii) a bisulfite compound, (b) providing an isocyanate compound; (c) providing a catalyst; (d) combining and reacting the polyol composition, the isocyanate compound, and the catalyst to produce a polyurethane polymer.

A method for producing a polyurethane polymer comprises the steps of: (a) providing a polyol composition, the polyol composition comprising (i) a polyol, (ii) a polyethylenimine compound; and (iii) a bisulfite compound, (b) providing an isocyanate compound; (c) providing a catalyst; (d) combining and reacting the polyol composition, the isocyanate compound, and the catalyst to produce a polyurethane polymer.

A method for producing a polyurethane polymer comprises the steps of: (a) providing a polyol composition, the polyol composition comprising (i) a polyol, (ii) a polyethylenimine compound; and (iii) a bisulfite compound, (b) providing an isocyanate compound; (c) providing a catalyst; (d) combining and reacting the polyol composition, the isocyanate compound, and the catalyst to produce a polyurethane polymer.

High strength biomedical materials and processes for making the same are disclosed. Included in the disclosure are nanoporous hydrophilic solids that can be extruded with a high aspect ratio to make high strength medical catheters and other devices with lubricious and biocompatible surfaces. Polymers may be entrapped in pores of materials to provide a durable modification of the materials.

High strength biomedical materials and processes for making the same are disclosed. Included in the disclosure are nanoporous hydrophilic solids that can be extruded with a high aspect ratio to make high strength medical catheters and other devices with lubricious and biocompatible surfaces. Polymers may be entrapped in pores of materials to provide a durable modification of the materials.

Thermosetting resin compositions useful for liquid compression molding encapsulation of a reconfigured wafer are provided. The so-encapsulated molded wafer offers improved resistance to warpage, compared to reconfigured wafers encapsulated with known encapsulation materials.

Thermosetting resin compositions useful for liquid compression molding encapsulation of a reconfigured wafer are provided. The so-encapsulated molded wafer offers improved resistance to warpage, compared to reconfigured wafers encapsulated with known encapsulation materials.

An aromatic polysulfone resin having a repeating unit represented by Formula (I) and a repeating unit represented by Formula (II), in which a ratio (m:n) of a molar content (m) of the repeating unit represented by Formula (I) to a molar content (n) of the repeating unit represented by Formula (II) is 1:2,000 to 1:200. ##STR00001## wherein hydrogen atoms of phenylene groups of Formulae (I) and (II) may be each independently substituted with an alkyl group, an aryl group, or a halogen atom.

Disclosed are a photoresist composition, a pixel definition structure and a manufacturing method thereof, and a display panel. The photoresist composition includes an organic film-forming resin, a superhydrophobic polymerizable monomer, a polyfunctional crosslinkable polymerizable monomer, a photoinitiator, an additive and a solvent.

Disclosed are a photoresist composition, a pixel definition structure and a manufacturing method thereof, and a display panel. The photoresist composition includes an organic film-forming resin, a superhydrophobic polymerizable monomer, a polyfunctional crosslinkable polymerizable monomer, a photoinitiator, an additive and a solvent.