Adhesive compositions are described that significantly improve the adhesion of polymer overmold compositions to metal substrates in polymer-metal junctions. The adhesive compositions include one or more poly(aryl ether) polymers, where each of the poly(aryl ether) polymers is, independently, a poly(aryl ether sulfone) polymer or a poly(aryl ether ketone) polymer. The overmold composition includes at least one poly(aryl ether ketone) polymer. Polymer-Metal junctions can be formed by, for example, dip-coating, spin-coating, extruding, or injection molding the adhesive composition and/or the overmold composition onto the metal substrate. Desirable applications settings for the polymer-metal junctions described include, but are not limited to electrical wiring.

Adhesive compositions are described that significantly improve the adhesion of polymer overmold compositions to metal substrates in polymer-metal junctions. The adhesive compositions include one or more poly(aryl ether) polymers, where each of the poly(aryl ether) polymers is, independently, a poly(aryl ether sulfone) polymer or a poly(aryl ether ketone) polymer. The overmold composition includes at least one poly(aryl ether ketone) polymer. Polymer-Metal junctions can be formed by, for example, dip-coating, spin-coating, extruding, or injection molding the adhesive composition and/or the overmold composition onto the metal substrate. Desirable applications settings for the polymer-metal junctions described include, but are not limited to electrical wiring.

Adhesive compositions are described that significantly improve the adhesion of polymer overmold compositions to metal substrates in polymer-metal junctions. The adhesive compositions include one or more poly(aryl ether) polymers, where each of the poly(aryl ether) polymers is, independently, a poly(aryl ether sulfone) polymer or a poly(aryl ether ketone) polymer. The overmold composition includes at least one poly(aryl ether ketone) polymer. Polymer-Metal junctions can be formed by, for example, dip-coating, spin-coating, extruding, or injection molding the adhesive composition and/or the overmold composition onto the metal substrate. Desirable applications settings for the polymer-metal junctions described include, but are not limited to electrical wiring.

The invention relates to a radiation-curable mixture for generating relief structures, comprising a) at least one functionalized, part-hydrolyzed polyvinyl acetate comprising (i) vinyl alcohol units, (ii) vinyl acetate units, and (iii) vinyl acrylate units, where the vinyl acrylate units, which can be substituted, have the general structure

##STR00001## where R is hydrogen or a linear or branched aliphatic or heteroaliphatic radical having 1 to 12 carbon atoms, or a cycloaliphatic, heterocyclic or aromatic radical having 3 to 12 carbon atoms, as component A, b) at least one initiator as component B, c) at least one ethylenically unsaturated compound different from component A, as component C, d) one or more adjuvants as component D, wherein the amount of vinyl acrylate units (iii) in the functionalized, part-hydrolyzed polyvinyl acetate a), based on all the units (i), (ii), and (iii), is 0.1 to <3 mol %, and component D comprises an additive capable of hydrogen bonding, in an amount of 0.001 to 30 wt %, based on the sum of components A to D.

The invention relates to a radiation-curable mixture for generating relief structures, comprising a) at least one functionalized, part-hydrolyzed polyvinyl acetate comprising (i) vinyl alcohol units, (ii) vinyl acetate units, and (iii) vinyl acrylate units, where the vinyl acrylate units, which can be substituted, have the general structure

##STR00001## where R is hydrogen or a linear or branched aliphatic or heteroaliphatic radical having 1 to 12 carbon atoms, or a cycloaliphatic, heterocyclic or aromatic radical having 3 to 12 carbon atoms, as component A, b) at least one initiator as component B, c) at least one ethylenically unsaturated compound different from component A, as component C, d) one or more adjuvants as component D, wherein the amount of vinyl acrylate units (iii) in the functionalized, part-hydrolyzed polyvinyl acetate a), based on all the units (i), (ii), and (iii), is 0.1 to <3 mol %, and component D comprises an additive capable of hydrogen bonding, in an amount of 0.001 to 30 wt %, based on the sum of components A to D.

Disclosed herein is a polymeric paint additive that increases the open time and the flow and leveling of paint compositions, as well as, maintaining/improving paint film properties such as scrub resistance, water sensitivity, surfactant leaching and stain removal. The polymeric open time additive preferably has a high glass transition temperature, e.g., above 100 C., as determined by the well-known Fox's equation, and molecular weight of less than 20,000 Daltons (number average molecular weight). The particle size of the inventive polymeric open time additive is in the range of about 130 nm to about 230 nm (volume average), prior to being dissolved in a basic solution, such as an aqueous architectural composition.

Disclosed herein is a polymeric paint additive that increases the open time and the flow and leveling of paint compositions, as well as, maintaining/improving paint film properties such as scrub resistance, water sensitivity, surfactant leaching and stain removal. The polymeric open time additive preferably has a high glass transition temperature, e.g., above 100 C., as determined by the well-known Fox's equation, and molecular weight of less than 20,000 Daltons (number average molecular weight). The particle size of the inventive polymeric open time additive is in the range of about 130 nm to about 230 nm (volume average), prior to being dissolved in a basic solution, such as an aqueous architectural composition.

Disclosed herein is a copolymer comprising first polymerized units of the formula (1):

##STR00001## wherein: R.sub.1 is H or a substituted or unsubstituted C.sub.1-C.sub.6 alkyl group; and R.sub.2 is a substituted or unsubstituted C.sub.3-C.sub.20 alkyl group that optionally includes one or more of O, S, N, C(O), or C(O)O, NC(O), C(O)NR; wherein R is H or a substituted or unsubstituted C.sub.1-C.sub.6 alkyl group; and second polymerized units of the formula (2):

##STR00002## wherein: R.sub.3 is a substituted or unsubstituted C.sub.1-C.sub.6 alkyl group that optionally includes one or more of O, N, S, C(O), or C(O)O; wherein the first polymerized units and the second polymerized units are chemically different, and the copolymer is free of fluorine.

Disclosed herein is a copolymer comprising first polymerized units of the formula (1):

##STR00001## wherein: R.sub.1 is H or a substituted or unsubstituted C.sub.1-C.sub.6 alkyl group; and R.sub.2 is a substituted or unsubstituted C.sub.3-C.sub.20 alkyl group that optionally includes one or more of O, S, N, C(O), or C(O)O, NC(O), C(O)NR; wherein R is H or a substituted or unsubstituted C.sub.1-C.sub.6 alkyl group; and second polymerized units of the formula (2):

##STR00002## wherein: R.sub.3 is a substituted or unsubstituted C.sub.1-C.sub.6 alkyl group that optionally includes one or more of O, N, S, C(O), or C(O)O; wherein the first polymerized units and the second polymerized units are chemically different, and the copolymer is free of fluorine.

Provided is a thermosetting resin composition that can satisfy both low transmission loss and radiation performance even under the same curing conditions as those for conventional substrate materials for high-frequency applications, and also provided are an adhesive sheet, a prepreg, and a laminate.

The thermosetting resin composition comprises a maleimide compound having at least two maleimide groups per molecule, a polyphenylene ether compound having at least two reactive organic groups per molecule, a curing accelerator, and an inorganic filler, wherein the inorganic filler is low-sodium aluminum oxide, and the low-sodium aluminum oxide has an Na.sup.+ ion content of 10 ppm or less.