The disclosed invention relates to a composition comprising a crosslinked blend of polyphosphazene polymers. The composition comprises a first polyphosphazene and a second polyphosphazene, where the first polyphosphazene and the second polyphosphazene being bound by a thiol bearing crosslinking agent. Such compositions are useful as a membrane material for the separation of gasses in a gaseous mixture.

The disclosed invention relates to a composition comprising a crosslinked blend of polyphosphazene polymers. The composition comprises a first polyphosphazene and a second polyphosphazene, where the first polyphosphazene and the second polyphosphazene being bound by a thiol bearing crosslinking agent. Such compositions are useful as a membrane material for the separation of gasses in a gaseous mixture.

[Problem] To provide a polyester resin-coated metal sheet which has excellent coating material adhesion capable of withstanding severe forming processing while retaining high decorative property and photoluminescence property and a container using the same. [Solution] The polyester resin-coated metal sheet of the present invention includes a metal sheet, and a non-oriented polyester resin formed of a plurality of layers provided on at least one surface of the metal sheet. A surface layer and an adjacent layer in contact with the surface layer, of the plurality of layers, have a difference therebetween in melting temperature of not less than 10° C., and a difference in tensile stress at an elongation of 250% under an environmental temperature of 70° C. of less than 3 MPa in tensile tests in a single-layer film state corresponding to each layer, and the surface layer contains fine particles.

The use of a sulfonated polyaryl ether ketone or of a sulfonated non-polymeric aryl ether ketone as a dispersant for a polyaryl ether ketone resin powder in an aqueous solution, and also to a corresponding composition, and to a process for preparing a semifinished product comprising a polyaryl ether ketone resin and reinforcing fibers.

The use of a sulfonated polyaryl ether ketone or of a sulfonated non-polymeric aryl ether ketone as a dispersant for a polyaryl ether ketone resin powder in an aqueous solution, and also to a corresponding composition, and to a process for preparing a semifinished product comprising a polyaryl ether ketone resin and reinforcing fibers.

The use of a sulfonated polyaryl ether ketone or of a sulfonated non-polymeric aryl ether ketone as a dispersant for a polyaryl ether ketone resin powder in an aqueous solution, and also to a corresponding composition, and to a process for preparing a semifinished product comprising a polyaryl ether ketone resin and reinforcing fibers.

A composition comprising lignin compounds possessing 8-30 (or 5-15 or 8-12) phenyl rings interconnected by ether and alkylene linkages and containing hydroxy and/or methoxy groups attached to said phenyl rings, wherein said composition possesses a glass transition temperature of 80-100° C. (or 95-98° C.) and a degree of substitution (DS) of carboxylic acid groups per phenyl ring of at least 0.5 and a DS of methoxy groups per phenyl ring of no more than 1.2, 1.1, or 1.0, wherein at least 90 wt % of said lignin compounds has a molecular weight within a range of 500-5000 g/mol, 1500-3000 g/mol, or 2000-2500 g/mol and/or wherein the molecular weight distribution of the lignin compounds is characterized by a polydispersity index of 1.0-1.5, 1.0-1.4, or 1.0-1.3, and wherein other lignin compounds not possessing the above characteristics are not present. Methods for producing the lignin extract and lignin copolymers and blends produced therefrom are also described.

A composition comprising lignin compounds possessing 8-30 (or 5-15 or 8-12) phenyl rings interconnected by ether and alkylene linkages and containing hydroxy and/or methoxy groups attached to said phenyl rings, wherein said composition possesses a glass transition temperature of 80-100° C. (or 95-98° C.) and a degree of substitution (DS) of carboxylic acid groups per phenyl ring of at least 0.5 and a DS of methoxy groups per phenyl ring of no more than 1.2, 1.1, or 1.0, wherein at least 90 wt % of said lignin compounds has a molecular weight within a range of 500-5000 g/mol, 1500-3000 g/mol, or 2000-2500 g/mol and/or wherein the molecular weight distribution of the lignin compounds is characterized by a polydispersity index of 1.0-1.5, 1.0-1.4, or 1.0-1.3, and wherein other lignin compounds not possessing the above characteristics are not present. Methods for producing the lignin extract and lignin copolymers and blends produced therefrom are also described.

Provided are: a thermosetting resin composition, for use in an organic material suited to high frequency use, that has outstanding low dielectric tangent, heat resistance, flexibility, and ease of workability; a thermosetting resin sheet; an electronic component; and an electronic device. The present invention is a thermosetting resin composition that includes the following constituents (A1)-(C). (A1) Polyimide resin: a polyimide resin including a diamine residue with formula (8) and/or formula (9) (in formula (8), a, b, c, and d are integers 1 or greater that meet the conditions a+b=6-17 and c+d=8-19, and the dashed lines denote carbon-carbon single bonds or carbon-carbon double bonds) (in formula (9), e, f, g, and h are integers 1 or greater that meet the conditions e+f=5-16 and g+h=8-19, and the dashed lines denote carbon-carbon single bonds or carbon-carbon double bonds). (B) Phenylene ether resin: a phenylene ether resin that has a number average molecular weight of 500-5,000 and, at a terminal of a molecular chain, includes at least one cross-linked functional group selected from the group consisting of a phenolic hydroxyl group, an acryl group, a vinyl group, and an epoxy group. (C) Maleimide resin: a maleimide resin.

##STR00001##

Provided are: a thermosetting resin composition, for use in an organic material suited to high frequency use, that has outstanding low dielectric tangent, heat resistance, flexibility, and ease of workability; a thermosetting resin sheet; an electronic component; and an electronic device. The present invention is a thermosetting resin composition that includes the following constituents (A1)-(C). (A1) Polyimide resin: a polyimide resin including a diamine residue with formula (8) and/or formula (9) (in formula (8), a, b, c, and d are integers 1 or greater that meet the conditions a+b=6-17 and c+d=8-19, and the dashed lines denote carbon-carbon single bonds or carbon-carbon double bonds) (in formula (9), e, f, g, and h are integers 1 or greater that meet the conditions e+f=5-16 and g+h=8-19, and the dashed lines denote carbon-carbon single bonds or carbon-carbon double bonds). (B) Phenylene ether resin: a phenylene ether resin that has a number average molecular weight of 500-5,000 and, at a terminal of a molecular chain, includes at least one cross-linked functional group selected from the group consisting of a phenolic hydroxyl group, an acryl group, a vinyl group, and an epoxy group. (C) Maleimide resin: a maleimide resin.

##STR00001##