C08L79/02

Method, system and paint for EMI suppression

A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.

Method, system and paint for EMI suppression

A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.

COMPOSITION AND COMPOSITE MOLDED ARTICLE CONTAINING SAME
20220356358 · 2022-11-10 · ·

A composition having a carbon material and a redox substance with a redox potential of −0.2 (V vs. SHE) or higher and 1.5 (V vs. SHE) or lower. A composition having a carbon material that is a carbon fiber. A composition where the carbon fiber is in a form of a chopped strand, roving, textile, non-woven fabric, or unidirectional material.

Prevention of biofilm formation

Antibacterial coatings and methods of making the antibacterial coatings are described herein. A first branched polyethylenimine (BPEI) layer is formed and a first glyoxal layer is formed on a surface of the BPEI layer. The first BPEI layer and the first glyoxal layer are cured to form a crosslinked BPEI coating. The first BPEI layer can be modified with superhydrophobic moieties, superhydrophilic moieties, or negatively charged moieties to increase the antifouling characteristics of the coating. The first BPEI layer can be modified with contact-killing bactericidal moieties to increase the bactericidal characteristics of the coating.

Prevention of biofilm formation

Antibacterial coatings and methods of making the antibacterial coatings are described herein. A first branched polyethylenimine (BPEI) layer is formed and a first glyoxal layer is formed on a surface of the BPEI layer. The first BPEI layer and the first glyoxal layer are cured to form a crosslinked BPEI coating. The first BPEI layer can be modified with superhydrophobic moieties, superhydrophilic moieties, or negatively charged moieties to increase the antifouling characteristics of the coating. The first BPEI layer can be modified with contact-killing bactericidal moieties to increase the bactericidal characteristics of the coating.

Conductive composition and production method therefor, and water-soluble polymer and production method therefor

A conductive composition comprising a conductive polymer (A), a water-soluble polymer (B), and a solvent (C1), wherein: the water-soluble polymer (B) comprises a water-soluble polymer (B11) represented by formula (11), and an amount of a water-soluble polymer (B2) represented by formula (2) as the water-soluble polymer (B) is 0.15% by mass or less, based on a total mass of the conductive composition: ##STR00001##
wherein R.sup.1 denotes a linear or branched alkyl group with 6 to 20 carbon atoms, each of R.sup.4 and R.sup.5 independently denotes a methyl or ethyl group, R.sup.6 denotes a hydrophilic group, R.sup.7 denotes a hydrogen atom or a methyl group, Y.sup.1 denotes a single bond, —S—, —S(═O)—, —C(═O)—O— or —O—, Z denotes a cyano group or a hydroxy group, each of p1 and q denotes an average number of repetitions, and is a number of from 1 to 50, and m denotes a number of from 1 to 5.

Conductive composition and production method therefor, and water-soluble polymer and production method therefor

A conductive composition comprising a conductive polymer (A), a water-soluble polymer (B), and a solvent (C1), wherein: the water-soluble polymer (B) comprises a water-soluble polymer (B11) represented by formula (11), and an amount of a water-soluble polymer (B2) represented by formula (2) as the water-soluble polymer (B) is 0.15% by mass or less, based on a total mass of the conductive composition: ##STR00001##
wherein R.sup.1 denotes a linear or branched alkyl group with 6 to 20 carbon atoms, each of R.sup.4 and R.sup.5 independently denotes a methyl or ethyl group, R.sup.6 denotes a hydrophilic group, R.sup.7 denotes a hydrogen atom or a methyl group, Y.sup.1 denotes a single bond, —S—, —S(═O)—, —C(═O)—O— or —O—, Z denotes a cyano group or a hydroxy group, each of p1 and q denotes an average number of repetitions, and is a number of from 1 to 50, and m denotes a number of from 1 to 5.

POLYMER COMPOSITIONS AND THEIR USES
20230099234 · 2023-03-30 ·

Provided herein is a polymer composition comprising a polyhydroxyamino ether (e.g., a crosslinked polyhydroxyamino ether) and printed circuit boards comprising the same.

POLYMER COMPOSITIONS AND THEIR USES
20230099234 · 2023-03-30 ·

Provided herein is a polymer composition comprising a polyhydroxyamino ether (e.g., a crosslinked polyhydroxyamino ether) and printed circuit boards comprising the same.

GAS BARRIER COATING MATERIAL, GAS BARRIER FILM, GAS BARRIER LAMINATE, AND METHOD FOR PRODUCING GAS BARRIER LAMINATE

A gas barrier film formed of a cured product of a mixture including a polycarboxylic acid, a polyamine compound, and a polyvalent metal compound, in which in an infrared absorption spectrum of the gas barrier film, an area ratio of an amide bond represented by B/A is equal to or less than 0.380, an area ratio of a carboxylic acid represented by C/A is equal to or less than 0.150, and an area ratio of carboxylate represented by D/A is equal to or more than 0.520.