The present invention discloses a preparation method of a biomedical titanium implant with a function of eliminating a surface biomembrane. The method includes the following steps: firstly synthesizing mesoporous polydopamine (MPDA) nanoparticles by a “one-pot method”, constituting a surface-aminated titanium material through diacid corrosion and modification of a 3-aminopropyltriethoxysilane (APTES) coupling agent, and integrating the MPDA nanoparticles into the surface of the titanium material through Michael addition reaction; secondly, taking MPDA anchored on the surface of the titanium material as a photothermal material and a photosensitizer carrier, where MPDA contains abundant aromatic rings capable of facilitating abundant loading of a photosensitizer (indocyanine green, ICG) through π-π stacking interaction; and finally further modifying biocompatible RGD polypeptides on the surface of MPDA by Michael addition reaction, where a modified titanium material is referred to as Ti-M/I/RGD.

For example, a triazine ring-containing polymer containing a repeating unit structure represented by Formula (24) below,

##STR00001## wherein R.sup.102 represents a crosslinking group.

For example, a triazine ring-containing polymer containing a repeating unit structure represented by Formula (24) below,

##STR00001## wherein R.sup.102 represents a crosslinking group.

For example, a triazine ring-containing polymer containing a repeating unit structure represented by Formula (24) below,

##STR00001## wherein R.sup.102 represents a crosslinking group.

A resin composition includes 100 parts by weight of a maleimide resin; 20 parts by weight to 60 parts by weight of a benzoxazine resin; 5 parts by weight to 40 parts by weight of an epoxy resin; 120 parts by weight to 240 parts by weight of silica including spherical silica having a sediment volume of less than or equal to 0.4 mL/g and a particle size distribution D50 of less than or equal to 1.0 μm; and 0.5 part by weight to 1.6 parts by weight of an imidazole compound having a long-chain alkyl group, wherein the imidazole compound having a long-chain alkyl group includes octylimidazole, undecylimidazole, heptadecylimidazole or a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, ratio of thermal expansion, copper foil peeling strength, thermal resistance after moisture absorption, dissipation factor, amount of resin cluster and appearance of cooper-free circuit board.

A resin composition includes 100 parts by weight of a maleimide resin; 20 parts by weight to 60 parts by weight of a benzoxazine resin; 5 parts by weight to 40 parts by weight of an epoxy resin; 120 parts by weight to 240 parts by weight of silica including spherical silica having a sediment volume of less than or equal to 0.4 mL/g and a particle size distribution D50 of less than or equal to 1.0 μm; and 0.5 part by weight to 1.6 parts by weight of an imidazole compound having a long-chain alkyl group, wherein the imidazole compound having a long-chain alkyl group includes octylimidazole, undecylimidazole, heptadecylimidazole or a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, ratio of thermal expansion, copper foil peeling strength, thermal resistance after moisture absorption, dissipation factor, amount of resin cluster and appearance of cooper-free circuit board.

Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

A formulation system usable in additive manufacturing of a three-dimensional object that comprises, in at least a portion thereof, a cyanate ester-containing polymeric network, and additive manufacturing processes employing the formulation system are provided. Also provided are objects obtainable by the additive manufacturing and kits containing the formulation system. The formulation system includes a first modeling material formulation which includes a first curable material which is a thermally-curable cyanate ester and a second modeling material formulation which comprises an activating agent for promoting polymerization of the cyanate ester and is devoid of the first curable material, and further includes a second curable material which is different from the first curable material, and optionally an agent for promoting hardening of the second curable material.