A curable resin composition including a first bismaleimide compound, a second bismaleimide compound which is different from the first bismaleimide compound, and a cyanate ester monomer. A liquid processible bismaleimide-triazine resin is provided by curing the resin composition. A method of preparing the liquid processible bismaleimide-triazine resin is also disclosed.

There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

The present disclosure provides a polymerizable thermosetting composition comprising an acetylene-bearing benzoxazine compound and a phthalonitrile monomer. The composition can provide a low viscosity for RTM application and can fully cured at a much lower temperature than the phthalonitrile monomer. The cured thermoset polymers having excellent thermal and mechanical properties, such as high thermal stability, heat resistance, high char yield, and enhanced structural rigidity.

The present disclosure provides a polymerizable thermosetting composition comprising an acetylene-bearing benzoxazine compound and a phthalonitrile monomer. The composition can provide a low viscosity for RTM application and can fully cured at a much lower temperature than the phthalonitrile monomer. The cured thermoset polymers having excellent thermal and mechanical properties, such as high thermal stability, heat resistance, high char yield, and enhanced structural rigidity.

Disclosed are an organic thin film including a semiconducting polymer including a ligand that is metal-coordination bondable or is metal-coordination bonded and an elastomer including a ligand that is metal-coordination bondable or is metal-coordination bonded, wherein the semiconducting polymer and the elastomer are configured to be dynamic intermolecular bonded by a metal-coordination bond, an organic sensor, and an electronic device.

Disclosed are an organic thin film including a semiconducting polymer including a ligand that is metal-coordination bondable or is metal-coordination bonded and an elastomer including a ligand that is metal-coordination bondable or is metal-coordination bonded, wherein the semiconducting polymer and the elastomer are configured to be dynamic intermolecular bonded by a metal-coordination bond, an organic sensor, and an electronic device.

For example, a triazine ring-containing polymer containing a repeating unit structure represented by formula (25) below,

##STR00001##

wherein R.sup.a represents R.sup.102 or R.sup.103, R.sup.102 represents a fluorine atom or a fluoroalkyl group having 1 to 10 carbon atoms, and R.sup.103 represents a crosslinking group.

For example, a triazine ring-containing polymer containing a repeating unit structure represented by formula (25) below,

##STR00001##

wherein R.sup.a represents R.sup.102 or R.sup.103, R.sup.102 represents a fluorine atom or a fluoroalkyl group having 1 to 10 carbon atoms, and R.sup.103 represents a crosslinking group.