Patent classifications
C08L81/04
A POLYPHENYLENE SULFIDE/POLYAMIDE COMPOSITION
Described herein is a polyphenylene sulfide/polyamide composition which includes A) polyphenylene sulfide, B) polyamide and C) a compatibilizer including or consisting of a hydrogenated styrene-diene block copolymer having structural formula (I) S.sup.1.sub.p-D-S.sup.2.sub.q as defined herein. Described herein is also an article obtained or obtainable by the polyphenylene sulfide/polyamide composition.
A POLYPHENYLENE SULFIDE/POLYAMIDE COMPOSITION
Described herein is a polyphenylene sulfide/polyamide composition which includes A) polyphenylene sulfide, B) polyamide and C) a compatibilizer including or consisting of a hydrogenated styrene-diene block copolymer having structural formula (I) S.sup.1.sub.p-D-S.sup.2.sub.q as defined herein. Described herein is also an article obtained or obtainable by the polyphenylene sulfide/polyamide composition.
FOAM MOLDING COMPOSITION, FOAM MOLDED BODY, ELECTRIC WIRE, METHOD FOR PRODUCING FOAM MOLDED BODY AND METHOD FOR PRODUCING ELECTRIC WIRE
A foam molding composition from which a foam molded body and a foamed electric wire can be produced having excellent heat resistance, a small average cell size, a high foaming ratio, and good outer diameter stability. The foam molding composition includes a resin (A) having a pyrolysis temperature of 330° C. or higher and at least one compound (B) selected from phosphoric acid esters and salts thereof and phosphoric acid ester complex compounds. Also disclosed is a foam molded body obtained from the foam molding composition, an electric wire including a core wire and a covering material covering the core wire obtained from the foam molding composition, and a method for producing the foam molded body.
FOAM MOLDING COMPOSITION, FOAM MOLDED BODY, ELECTRIC WIRE, METHOD FOR PRODUCING FOAM MOLDED BODY AND METHOD FOR PRODUCING ELECTRIC WIRE
A foam molding composition from which a foam molded body and a foamed electric wire can be produced having excellent heat resistance, a small average cell size, a high foaming ratio, and good outer diameter stability. The foam molding composition includes a resin (A) having a pyrolysis temperature of 330° C. or higher and at least one compound (B) selected from phosphoric acid esters and salts thereof and phosphoric acid ester complex compounds. Also disclosed is a foam molded body obtained from the foam molding composition, an electric wire including a core wire and a covering material covering the core wire obtained from the foam molding composition, and a method for producing the foam molded body.
FOAM MOLDING COMPOSITION, FOAM MOLDED BODY, ELECTRIC WIRE, METHOD FOR PRODUCING FOAM MOLDED BODY AND METHOD FOR PRODUCING ELECTRIC WIRE
A foam molding composition from which a foam molded body and a foamed electric wire can be produced having excellent heat resistance, a small average cell size, a high foaming ratio, and good outer diameter stability. The foam molding composition includes a resin (A) having a pyrolysis temperature of 330° C. or higher and at least one compound (B) selected from phosphoric acid esters and salts thereof and phosphoric acid ester complex compounds. Also disclosed is a foam molded body obtained from the foam molding composition, an electric wire including a core wire and a covering material covering the core wire obtained from the foam molding composition, and a method for producing the foam molded body.
MODELED OBJECT AND METHOD FOR PRODUCING SAME
Provided is a method for producing a modeled object easily producible and capable of effectively increasing mechanical properties in modeling using a three-dimensional printer. The method for producing a modeled object includes the steps of: preparing a resin composition containing inorganic fibers with an average fiber length of 1 μm to 300 μm and an average aspect ratio of 3 to 200 and a thermoplastic resin; and modeling an object using the resin composition on a fused deposition modeling-based three-dimensional printer to produce a modeled object, wherein in modeling the object on the fused deposition modeling-based three-dimensional printer, a deposition pitch is less than 0.20 mm and a road width is less than 0.20 mm.
MODELED OBJECT AND METHOD FOR PRODUCING SAME
Provided is a method for producing a modeled object easily producible and capable of effectively increasing mechanical properties in modeling using a three-dimensional printer. The method for producing a modeled object includes the steps of: preparing a resin composition containing inorganic fibers with an average fiber length of 1 μm to 300 μm and an average aspect ratio of 3 to 200 and a thermoplastic resin; and modeling an object using the resin composition on a fused deposition modeling-based three-dimensional printer to produce a modeled object, wherein in modeling the object on the fused deposition modeling-based three-dimensional printer, a deposition pitch is less than 0.20 mm and a road width is less than 0.20 mm.
Composite Structure
A composite structure comprising a resinous component that is adhered to a surface of a metal component is provided. The resinous component is formed from a polymer composition that comprises a polyarylene sulfide, inorganic fibers, and an impact modifier. The inorganic fibers have an aspect ratio of from about 1.5 to about 10.
Composite Structure
A composite structure comprising a resinous component that is adhered to a surface of a metal component is provided. The resinous component is formed from a polymer composition that comprises a polyarylene sulfide, inorganic fibers, and an impact modifier. The inorganic fibers have an aspect ratio of from about 1.5 to about 10.
IONIC LIQUID CATALYSTS IN SULFUR-CONTAINING POLYMER COMPOSITIONS
Compositions comprising thiol-terminated sulfur-containing prepolymers, curing agents reactive with the thiol-terminated sulfur-containing prepolymers, and ionic liquid catalysts, useful in aerospace sealant applications are disclosed. The use of ionic liquid catalysts provides curable sealant compositions having an extended working time and a rapid cure rate.