A fiber reinforced thermoplastic resin molded article includes (A) carbon fibers, (B) graphite and (C) a thermoplastic resin, wherein the carbon fibers (A), the graphite (B) and the thermoplastic resin (C) are contained in amounts of 1 to 30 parts by weight, 1 to 40 parts by weight and 30 to 98 parts by weight, respectively, relative to 100 parts by weight, of the carbon fibers (A), the graphite (B) and the thermoplastic resin (C), the weight average fiber length of the carbon fibers (A) is 0.3 to 3 mm and the specific gravity of the molded article is 1.1 to 1.9 g/cm.sup.3. The fiber reinforced thermoplastic resin molded article has excellent bending strength and heat conductivity.

Provided is a polyarylene sulfide resin composition including a polyarylene sulfide resin, an epoxy resin, glass fiber, and glass flake. The amount of the epoxy resin is 0.5 to 20 parts by mass, the amount of the glass fiber is 10 to 350 parts by mass, and the amount of the glass flake is 1 to 250 parts by mass relative to 100 parts by mass of the polyarylene sulfide resin. The epoxy resin is a combination of a bisphenol-type epoxy resin and a novolac-type epoxy resin. Also provided is a molded body formed by melt-molding the resin composition. The resin composition has good adhesiveness to epoxy resins and good flowability. Furthermore, a molded body having high thermal shock resistance can be produced using the resin composition.

Provided is a polyarylene sulfide resin composition including a polyarylene sulfide resin, an epoxy resin, glass fiber, and glass flake. The amount of the epoxy resin is 0.5 to 20 parts by mass, the amount of the glass fiber is 10 to 350 parts by mass, and the amount of the glass flake is 1 to 250 parts by mass relative to 100 parts by mass of the polyarylene sulfide resin. The epoxy resin is a combination of a bisphenol-type epoxy resin and a novolac-type epoxy resin. Also provided is a molded body formed by melt-molding the resin composition. The resin composition has good adhesiveness to epoxy resins and good flowability. Furthermore, a molded body having high thermal shock resistance can be produced using the resin composition.

Provided is a polyarylene sulfide resin composition including a polyarylene sulfide resin, an epoxy resin, glass fiber, and glass flake. The amount of the epoxy resin is 0.5 to 20 parts by mass, the amount of the glass fiber is 10 to 350 parts by mass, and the amount of the glass flake is 1 to 250 parts by mass relative to 100 parts by mass of the polyarylene sulfide resin. The epoxy resin is a combination of a bisphenol-type epoxy resin and a novolac-type epoxy resin. Also provided is a molded body formed by melt-molding the resin composition. The resin composition has good adhesiveness to epoxy resins and good flowability. Furthermore, a molded body having high thermal shock resistance can be produced using the resin composition.

A thermally conductive polymer article is disclosed, made from a polymer resin and thermally conductive additives, wherein the article has undergone laser structuring and plasma metallization and, preferably, surface-mount technology (SMT) by non-lead reflow soldering, to provide an integrated circuit. The article can be in the shape of a printed circuit board or a LED lighting component among other possibilities. The thermally conductive additive can be either electrically insulative or electrically conductive, or both types can be used. The thermally conductive polymer compound can be extruded, molded, calendered, thermoformed, or 3D-printed before taking shape as a heat dissipating, laser structured, and plasma metalized polymer article.

A thermally conductive polymer article is disclosed, made from a polymer resin and thermally conductive additives, wherein the article has undergone laser structuring and plasma metallization and, preferably, surface-mount technology (SMT) by non-lead reflow soldering, to provide an integrated circuit. The article can be in the shape of a printed circuit board or a LED lighting component among other possibilities. The thermally conductive additive can be either electrically insulative or electrically conductive, or both types can be used. The thermally conductive polymer compound can be extruded, molded, calendered, thermoformed, or 3D-printed before taking shape as a heat dissipating, laser structured, and plasma metalized polymer article.

An organic peroxide formulation comprises at least one organic peroxide, at least one drying oil, and at least one free radical trap. A process comprises curing mixtures that include at least one elastomer and the organic peroxide formulation in the presence of oxygen. Elastomer compositions, methods of manufacturing elastomer articles, and elastomer articles made from the elastomer compositions are also disclosed.

An organic peroxide formulation comprises at least one organic peroxide, at least one drying oil, and at least one free radical trap. A process comprises curing mixtures that include at least one elastomer and the organic peroxide formulation in the presence of oxygen. Elastomer compositions, methods of manufacturing elastomer articles, and elastomer articles made from the elastomer compositions are also disclosed.

Provided is a thermoplastic composite, a method for preparing a thermoplastic composite, and an injection-molded product. The thermoplastic composite comprises 35-75% by weight of a thermoplastic resin, 5-45% by weight of a non-cellulosic organic fiber, and 5-20%) by weight of hollow glass microspheres, based on 100% by weight of the total weight of the thermoplastic composite.

Provided is a thermoplastic composite, a method for preparing a thermoplastic composite, and an injection-molded product. The thermoplastic composite comprises 35-75% by weight of a thermoplastic resin, 5-45% by weight of a non-cellulosic organic fiber, and 5-20%) by weight of hollow glass microspheres, based on 100% by weight of the total weight of the thermoplastic composite.