Patent classifications
C08L81/06
RESIN COMPOSITION, CURED OBJECT, PREPREG, METHOD FOR PRODUCING RESIN COMPOSITION, AND AROMATIC POLYSULFONE RESIN
The present invention relates to a resin composition containing: an epoxy resin; and an aromatic polysulfone resin containing an amino group-containing aromatic polysulfone having an amino group at at least one terminal of a main chain of a polymer chain, in which a number average molecular weight of the aromatic polysulfone resin is 10,000 or less.
RESIN COMPOSITION, CURED OBJECT, PREPREG, METHOD FOR PRODUCING RESIN COMPOSITION, AND AROMATIC POLYSULFONE RESIN
The present invention relates to a resin composition containing: an epoxy resin; and an aromatic polysulfone resin containing an amino group-containing aromatic polysulfone having an amino group at at least one terminal of a main chain of a polymer chain, in which a number average molecular weight of the aromatic polysulfone resin is 10,000 or less.
Fabrication of a polishing pad for chemical mechanical polishing
A method of forming a CMP pad includes providing a solution of a block copolymer (BCP), where the BCP includes a first segment and a second segment connected to the first segment, the second segment being different from the first segment in composition. The method further includes processing the BCP to form a polymer network having a first phase and a second phase embedded in the first phase, where the first phase includes the first segment and the second phase includes the second segment, and subsequently removing the second phase from the polymer network, thereby forming a polymer film that includes a network of pores embedded in the first phase. Thereafter, the method proceeds to combining the CMP top pad and a CMP sub-pad to form a CMP pad, where the CMP top pad is configured to engage with a workpiece during a CMP process.
COMPATIBILIZED POLYMER COMPOSITIONS
A polymer composition includes a poly(para-phenylene sulfide) (PPS), at least one poly(aryl ether sulfone) (PAES), and at least one alkali metal carbonate. Preferably, the polymer composition is free or substantially free of solvent. A method includes melt mixing a poly(para-phenylene sulfide) (PPS), at least one poly(aryl ether sulfone) (PAES), and at least one alkali metal carbonate.
COMPATIBILIZED POLYMER COMPOSITIONS
A polymer composition includes a poly(para-phenylene sulfide) (PPS), at least one poly(aryl ether sulfone) (PAES), and at least one alkali metal carbonate. Preferably, the polymer composition is free or substantially free of solvent. A method includes melt mixing a poly(para-phenylene sulfide) (PPS), at least one poly(aryl ether sulfone) (PAES), and at least one alkali metal carbonate.
COMPATIBILIZED POLYMER COMPOSITIONS
A polymer composition includes a poly(para-phenylene sulfide) (PPS), at least one poly(aryl ether sulfone) (PAES), and at least one alkali metal carbonate. Preferably, the polymer composition is free or substantially free of solvent. A method includes melt mixing a poly(para-phenylene sulfide) (PPS), at least one poly(aryl ether sulfone) (PAES), and at least one alkali metal carbonate.
POLYMER-CERAMIC COMPOSITE HOUSINGS AND HOUSING COMPONENTS FOR PORTABLE ELECTRONIC DEVICES
The present disclosure includes thin, high-stiffness laminates, portable electronic device housings including the same, and methods for making such laminates and portable electronic device housings. Some laminates include an inner section having one or more first laminae and one or more second laminae, and first and second outer sections disposed on opposing sides of the inner section, each having one or more third laminae The laminate has a width and a length that is perpendicular to the width. Each of the first lamina(e) can have fibers aligned in a direction parallel to the length, each of the second lamina(e) can have fibers aligned in a direction parallel to the width, and each of the third lamina(e) can have fibers aligned in a direction angnlarly disposed at an angle of at least 10 degrees to each of the length and the width.
POLYMER-CERAMIC COMPOSITE HOUSINGS AND HOUSING COMPONENTS FOR PORTABLE ELECTRONIC DEVICES
The present disclosure includes thin, high-stiffness laminates, portable electronic device housings including the same, and methods for making such laminates and portable electronic device housings. Some laminates include an inner section having one or more first laminae and one or more second laminae, and first and second outer sections disposed on opposing sides of the inner section, each having one or more third laminae The laminate has a width and a length that is perpendicular to the width. Each of the first lamina(e) can have fibers aligned in a direction parallel to the length, each of the second lamina(e) can have fibers aligned in a direction parallel to the width, and each of the third lamina(e) can have fibers aligned in a direction angnlarly disposed at an angle of at least 10 degrees to each of the length and the width.
Tough, high temperature polymers produced by stereolithography
The present invention concerns methods of forming a three-dimensional object, and polymerizable liquids such as dual cure resins useful for making a three-dimensional object by sterolithography, such as by continuous liquid interface production (CLIP).
Tough, high temperature polymers produced by stereolithography
The present invention concerns methods of forming a three-dimensional object, and polymerizable liquids such as dual cure resins useful for making a three-dimensional object by sterolithography, such as by continuous liquid interface production (CLIP).