Provided is a room temperature moisture-curable silicone gel composition containing: (A) diorganopolysiloxane, both terminals of which are blocked by silanol groups; (B) hydrolysable organosilicon compound represented by Formula (2) and/or a partial hydrolysate thereof ##STR00001##
(where R.sup.2 is a monovalent hydrocarbon group, R.sup.3 is an alkyl group or a cycloalkyl group, and a is 2 or 3.); (C) a curing catalyst; and (D) a heat-resistant aid containing a homogeneous mixture of (D-a), (D-b), and (D-c) (where (D-a) is organopolysiloxane having a viscosity of 10-10,000 mPa.Math.s at 25° C., (D-b) is carboxylate of cerium, and (D-c) is a titanium compound and/or a partial hydrolytic condensate thereof). This room temperature moisture-curable silicone gel composition can be a silicone gel cured product which has a small variation rate of low-stress properties evaluated by the index such as penetration even under heat-resistant conditions exceeding 230° C. and which has excellent heat-resistance.

A resin composition including: a magnetic fluid that includes magnetic particles, a dispersant, and a dispersion medium; and a resin or precursor thereof that includes, in a molecule thereof, at least one partial structure selected from the group consisting of a diene skeleton, a silicone skeleton, a urethane skeleton, a 4- to 7-membered ring lactone skeleton, an alkyl group having from 6 to 30 carbon atoms and an alkylene group having from 6 to 30 carbon atoms, a production method thereof, a resin composition molded body obtained by using the resin composition, and a production method thereof.

A resin composition including: a magnetic fluid that includes magnetic particles, a dispersant, and a dispersion medium; and a resin or precursor thereof that includes, in a molecule thereof, at least one partial structure selected from the group consisting of a diene skeleton, a silicone skeleton, a urethane skeleton, a 4- to 7-membered ring lactone skeleton, an alkyl group having from 6 to 30 carbon atoms and an alkylene group having from 6 to 30 carbon atoms, a production method thereof, a resin composition molded body obtained by using the resin composition, and a production method thereof.

A pressure sensitive adhesive composition includes (A) 0.1% to 5% an anchorage additive and (B) 95% to 99.9% of a silicone pressure sensitive adhesive composition. This pressure sensitive adhesive composition can be cured to form a pressure sensitive adhesive. When cured on a backing substrate, the resulting adhesive article is useful for protecting electronic devices during fabrication, shipping, and use.

A pressure sensitive adhesive composition includes (A) 0.1% to 5% an anchorage additive and (B) 95% to 99.9% of a silicone pressure sensitive adhesive composition. This pressure sensitive adhesive composition can be cured to form a pressure sensitive adhesive. When cured on a backing substrate, the resulting adhesive article is useful for protecting electronic devices during fabrication, shipping, and use.

Provided is: a thermally conductive silicone gel composition which has a high thermal conductivity, and is less likely to flow out and slip off/drop off from a surface on which the gel composition is placed, even when the composition that has not been cured is placed on a sloped surface or in a vertical direction, and has excellent gap-filling ability with respect to a heat dissipation part, etc., and excellent repairability if desired; a thermally conductive member comprising the thermally conductive silicone gel composition; and a heat dissipation structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for a hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The gel composition has certain viscosity properties as disclosed herein.

Provided is: a thermally conductive silicone gel composition which has a high thermal conductivity, and is less likely to flow out and slip off/drop off from a surface on which the gel composition is placed, even when the composition that has not been cured is placed on a sloped surface or in a vertical direction, and has excellent gap-filling ability with respect to a heat dissipation part, etc., and excellent repairability if desired; a thermally conductive member comprising the thermally conductive silicone gel composition; and a heat dissipation structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for a hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The gel composition has certain viscosity properties as disclosed herein.

Provided is: a thermally conductive silicone gel composition which has a high thermal conductivity, and is less likely to flow out and slip off/drop off from a surface on which the gel composition is placed, even when the composition that has not been cured is placed on a sloped surface or in a vertical direction, and has excellent gap-filling ability with respect to a heat dissipation part, etc., and excellent repairability if desired; a thermally conductive member comprising the thermally conductive silicone gel composition; and a heat dissipation structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for a hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The gel composition has certain viscosity properties as disclosed herein.

The present invention pertains to a functionalized polymeric liquid polysiloxane material comprising non-organofunctional Q-type siloxane moieties and mono-organofunctional T-type siloxane moieties, as well as optionally tri-organofunctional M-type siloxane moieties and/or di-organofunctional D-type siloxane moieties characterized in that the polysiloxane material has a specified degree of polymerization, comprises a limited low amount of four-membered Q2-type and/or Q3-type siloxane ring species relative to the total Q-type siloxane species, and is functionalized at specific moieties. The present invention further pertains to methods for producing the polymeric liquid polysiloxane material as well as associated uses of the material.

A two-component silicone composition made of a component A including a hydroxyl-group terminated polydiorganosiloxane P; between 0.05-5.0 wt. % water, relative to component A; and component B including a non-condensable polydiorganosiloxane; a catalyst K cross-linking polydiorganosiloxanes; between 0-50 wt. % of a first organosilane V1 according to formula (I), between 2-60 wt. % of a second organosilane V2 according to formula (II), up to 25 wt. % of organosilanes V3 having hydrolyzable alkoxysilane groups Si—ORa not falling under the formulae (I) and (II), with Ra being a hydrogen atom or monovalent, linear or branched alkyl group with 1-6 carbon atoms, Rb being a divalent, linear or branched alkyl group or alkenyl group with 2-20 carbon atoms, and Rc being a divalent, linear or branched alkyl group with 2-20 carbon atoms containing a secondary amino group; the composition containing less than 10 mole-%, relative to the amount of organosilane V2, of organosilanes with epoxy groups.