The invention relates to a method of additive manufacturing an object using a 3D printing apparatus, in which at least one layer or part of at least one layer is formed by an addition-crosslinking electro-conductive silicone composition comprising : (A) at least one organopolysiloxane compound A comprising, per molecule at least two C.sub.2- C.sub.6 alkenyl radicals bonded to silicon atoms, (B) at least one organohydrogenopolysiloxane compound B comprising, per molecule, at least two hydrogen atoms bonded to an identical or different silicon atom, (C) at least one catalyst C comprising at least one metal from the platinum group or the compound thereof, (D) at least one reinforcing silica filler D, (E) at least one thixotropic agent which is selected from compounds having epoxy group, (poly)ether group, and/or (poly)ester group, organopolysiloxane having an aryl group and mixtures thereof; (F) at least one electro-conductive filler F, which is selected from nickel coated carbon, preferably graphite, graphene or mixtures thereof; (G) optionally at least one crosslinking inhibitor G.

Provided is a polycarbonate-polyorganosiloxane copolymer, including a polyorganosiloxane block (A-1) including a specific structural unit and a polycarbonate block (A-2) formed of a specific repeating unit.

Provided is a polycarbonate-polyorganosiloxane copolymer, including a polyorganosiloxane block (A-1) including a specific structural unit and a polycarbonate block (A-2) formed of a specific repeating unit.

A laminate body including a base material and a flat silicone sealing layer adhered thereto, generally without any voids, is provided. Also provided is a curable hot melt silicone composition layer with a particular curable hot melt silicone composition, providing a laminate body that does not readily cause stress on a substrate after the curable hot melt silicone composition is cured. A laminate body comprises a base material, and a curable hot melt silicone composition layer in contact with the base material. The curable hot melt silicone composition includes an organopolysiloxane resin containing siloxane units selected from a group containing T units or Q units making up at least 20 mol % or more of all siloxane units. The curable hot melt silicone composition generally has a melt viscosity as measured using a flow tester at a pressure of 2.5 MPa and at 100° C. of 5,000 Pa.Math.s or less.

A laminate body including a base material and a flat silicone sealing layer adhered thereto, generally without any voids, is provided. Also provided is a curable hot melt silicone composition layer with a particular curable hot melt silicone composition, providing a laminate body that does not readily cause stress on a substrate after the curable hot melt silicone composition is cured. A laminate body comprises a base material, and a curable hot melt silicone composition layer in contact with the base material. The curable hot melt silicone composition includes an organopolysiloxane resin containing siloxane units selected from a group containing T units or Q units making up at least 20 mol % or more of all siloxane units. The curable hot melt silicone composition generally has a melt viscosity as measured using a flow tester at a pressure of 2.5 MPa and at 100° C. of 5,000 Pa.Math.s or less.

A laminate body including a base material and a flat silicone sealing layer adhered thereto, generally without any voids, is provided. Also provided is a curable hot melt silicone composition layer with a particular curable hot melt silicone composition, providing a laminate body that does not readily cause stress on a substrate after the curable hot melt silicone composition is cured. A laminate body comprises a base material, and a curable hot melt silicone composition layer in contact with the base material. The curable hot melt silicone composition includes an organopolysiloxane resin containing siloxane units selected from a group containing T units or Q units making up at least 20 mol % or more of all siloxane units. The curable hot melt silicone composition generally has a melt viscosity as measured using a flow tester at a pressure of 2.5 MPa and at 100° C. of 5,000 Pa.Math.s or less.

Provided are a coloring composition including a colorant, a first resin including a repeating unit represented by Formula (b-10), and a second resin different from the first resin, in which the second resin is at least one selected from a polyimide precursor, a polyimide resin, a polybenzoxazole precursor, a polybenzoxazole resin, or a polysiloxane resin; a film formed of the coloring composition; an optical filter; a solid-state imaging element; and an image display device. In Formula (b-10), Ar.sup.10 represents a group including an aromatic carboxyl group, L.sup.11 represents —COO— or —CONH—, L.sup.12 represents a trivalent linking group, and P.sup.10 represents a polymer chain.

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A disposable absorbent article having a topsheet, a backsheet, and an absorbent core disposed between the topsheet and the backsheet is described. The disposable absorbent article includes an odor control composition having a preservative, a surfactant, methylated beta-cyclodextrin (m-BCD), and perfume.

A disposable absorbent article having a topsheet, a backsheet, and an absorbent core disposed between the topsheet and the backsheet is described. The disposable absorbent article includes an odor control composition having a preservative, a surfactant, methylated beta-cyclodextrin (m-BCD), and perfume.

Provided is a hydrosilylation reactive composition that has a sufficient pot life at room temperature, that can be cured at low temperature by exposure to high energy radiation, and that produces a stable semi-cured product during the curing process, and to provide a semi-cured product and a cured product obtained using this hydrosilylation reactive composition. The composition comprises: (A) a compound containing at least one aliphatically unsaturated monovalent hydrocarbon group in the molecule; (B) a compound containing at least two hydrogen atoms bonded to silicon atoms in the molecule; (C) a first hydrosilylation catalyst exhibiting activity in the composition without exposure to high energy radiation; and (D) a second hydrosilylation catalyst not exhibiting activity unless exposed to high energy radiation, and exhibiting activity in the composition by exposure to high energy radiation.