A colorant-containing composition includes (D) at least one colorant, (E) at least one siloxane-polyoxamide copolymer according to the general formula (IV), and optionally (F) additives. A process for producing a colorant-containing composition is also provided.

A colorant-containing composition includes (D) at least one colorant, (E) at least one siloxane-polyoxamide copolymer according to the general formula (IV), and optionally (F) additives. A process for producing a colorant-containing composition is also provided.

A colorant-containing composition includes (D) at least one colorant, (E) at least one siloxane-polyoxamide copolymer according to the general formula (IV), and optionally (F) additives. A process for producing a colorant-containing composition is also provided.

The present invention provides a resin composition including: (A) a silicone resin containing a constitutional unit shown by the following composition formula (1) and having a weight average molecular weight of 3,000 to 500,000; (B) an epoxy resin-curing agent; and (C) a filler; wherein the mass fraction of the component (C) is 50 to 95% by mass based on the total mass. This can provide a resin composition that can mold a wafer in a lump, has good molding properties particularly to a thin-film wafer having a large diameter, gives low-warping properties, as well as good wafer protection properties, high reliability, and good heat resistance after molding, can perform a molding process favorably, and can be used for wafer level packaging favorably.

##STR00001##

The present invention provides a resin composition including: (A) a silicone resin containing a constitutional unit shown by the following composition formula (1) and having a weight average molecular weight of 3,000 to 500,000; (B) an epoxy resin-curing agent; and (C) a filler; wherein the mass fraction of the component (C) is 50 to 95% by mass based on the total mass. This can provide a resin composition that can mold a wafer in a lump, has good molding properties particularly to a thin-film wafer having a large diameter, gives low-warping properties, as well as good wafer protection properties, high reliability, and good heat resistance after molding, can perform a molding process favorably, and can be used for wafer level packaging favorably.

##STR00001##

Provided is a multicomponent room temperature-curable organopolysiloxane composition capable of providing a cured product superior in fast curability, storage stability and durability. The room temperature-curable organopolysiloxane composition comprises: (A) an alkoxysilyl-ethylene group-terminated organopolysiloxane having in each molecule at least one silyl-ethylene bond represented by the following structural formula (1)

##STR00001##

(wherein R.sup.1 represents an alkyl group; R.sup.2 represents a hydrocarbon group having 1 to 20 carbon atoms; a represents an integer of 1 to 3; and n represents an integer of 0 to 10); (B) an organopolysiloxane represented by the following general formula (2)

##STR00002## (wherein R.sup.2 represents a hydrocarbon group having 1 to 20 carbon atoms; and m represents a number at which such organopolysiloxane exhibits a viscosity of 10 to 1,000,000 mPa.Math.s at 25° C.); and (C) a curing catalyst.

Provided is a multicomponent room temperature-curable organopolysiloxane composition capable of providing a cured product superior in fast curability, storage stability and durability. The room temperature-curable organopolysiloxane composition comprises: (A) an alkoxysilyl-ethylene group-terminated organopolysiloxane having in each molecule at least one silyl-ethylene bond represented by the following structural formula (1)

##STR00001##

(wherein R.sup.1 represents an alkyl group; R.sup.2 represents a hydrocarbon group having 1 to 20 carbon atoms; a represents an integer of 1 to 3; and n represents an integer of 0 to 10); (B) an organopolysiloxane represented by the following general formula (2)

##STR00002## (wherein R.sup.2 represents a hydrocarbon group having 1 to 20 carbon atoms; and m represents a number at which such organopolysiloxane exhibits a viscosity of 10 to 1,000,000 mPa.Math.s at 25° C.); and (C) a curing catalyst.

A resin composition comprising (A) a silphenylene skeleton-bearing organosilicon compound containing at least two hydroxyl and/or alkoxy groups per molecule and (B) an organosilicon compound having a hydrogen atom and a hydroxyl and/or alkoxy group on a common silicon atom, or comprising (C) a silphenylene skeleton-bearing organosilicon compound having a hydrogen atom and a hydroxyl and/or alkoxy group on a common silicon atom is condensation curable without a need for catalysts. The cured product has satisfactory hardness, crack resistance, heat resistance and light resistance.

A resin composition comprising (A) a silphenylene skeleton-bearing organosilicon compound containing at least two hydroxyl and/or alkoxy groups per molecule and (B) an organosilicon compound having a hydrogen atom and a hydroxyl and/or alkoxy group on a common silicon atom, or comprising (C) a silphenylene skeleton-bearing organosilicon compound having a hydrogen atom and a hydroxyl and/or alkoxy group on a common silicon atom is condensation curable without a need for catalysts. The cured product has satisfactory hardness, crack resistance, heat resistance and light resistance.

A curable composition comprising (a) an organopolysiloxane comprising a curable functional group; (b) a cross-linker comprising a silyl hydride group or a thiol group; (c) a reaction accelerator; (d) optionally an inhibitor; and (e) optionally other additives. The curable composition exhibits high refractive index and optical clarity. The curable composition can be used to prepare a cured material that exhibits high refractive index, optical clarity, crack resistance, and low moisture vapor permeability.