There is provided herein a curable polysiloxane composition comprising a reactive polysiloxane having the general structural formula (I): ##STR00001##
as described herein. There is provided a method of making the polysiloxane. In addition there is provided a curable composition including the polysiloxane.

There is provided herein a curable polysiloxane composition comprising a reactive polysiloxane having the general structural formula (I): ##STR00001##
as described herein. There is provided a method of making the polysiloxane. In addition there is provided a curable composition including the polysiloxane.

There is provided herein a curable polysiloxane composition comprising a reactive polysiloxane having the general structural formula (I): ##STR00001##
as described herein. There is provided a method of making the polysiloxane. In addition there is provided a curable composition including the polysiloxane.

A heat- or photo-curable composition comprising: a polysiloxane which is produced by reacting a silicon compound (i) represented by the formula: R.sup.1.sub.nSi(X).sub.4-n (wherein R.sup.1 represents an alkyl group, an aryl group or the like; X represents a chlorine atom or an alkoxy group; and n represents 0 to 2) with a silicon compound (ii) represented by the formula (b) or (c) (wherein R.sup.2 to R.sup.7 independently represent an alkyl group or the like; M.sup.1 and M.sup.2 independently represent an arylene group, an alkylene group or the like; and Y.sup.1 to Y.sup.6 independently represent a chlorine atom or an alkoxy group) in the presence of an alkali catalyst or an acid catalyst; a polymerization initiator which enables the generation of an acid or a base by the action of heat or light; and a solvent. The composition enables the formation of a thick film. When the composition is coated onto a substrate, is then heated or exposed to light, is then developed if necessary, and is then heated and cured at a low temperature, a cured film can be formed. ##STR00001##

A heat- or photo-curable composition comprising: a polysiloxane which is produced by reacting a silicon compound (i) represented by the formula: R.sup.1.sub.nSi(X).sub.4-n (wherein R.sup.1 represents an alkyl group, an aryl group or the like; X represents a chlorine atom or an alkoxy group; and n represents 0 to 2) with a silicon compound (ii) represented by the formula (b) or (c) (wherein R.sup.2 to R.sup.7 independently represent an alkyl group or the like; M.sup.1 and M.sup.2 independently represent an arylene group, an alkylene group or the like; and Y.sup.1 to Y.sup.6 independently represent a chlorine atom or an alkoxy group) in the presence of an alkali catalyst or an acid catalyst; a polymerization initiator which enables the generation of an acid or a base by the action of heat or light; and a solvent. The composition enables the formation of a thick film. When the composition is coated onto a substrate, is then heated or exposed to light, is then developed if necessary, and is then heated and cured at a low temperature, a cured film can be formed. ##STR00001##

The present disclosure provides hydrosilylation curable compositions comprising resin linear organosiloxane block copolymers comprising, among other things, from about 0.5 to about 5 mole % C.sub.1 to C.sub.30 hydrocarbyl group comprising at least one aliphatic unsaturated bond. Such hydrosilylation curable resin-linear organosiloxane block copolymers have significantly faster cure speed, relative to their condensation curable counterparts. A faster cure speed can be important for encapsulating electronic devices, such as light-emitting diode (LED) chip devices, particularly devices having tall structures.

The present disclosure provides hydrosilylation curable compositions comprising resin linear organosiloxane block copolymers comprising, among other things, from about 0.5 to about 5 mole % C.sub.1 to C.sub.30 hydrocarbyl group comprising at least one aliphatic unsaturated bond. Such hydrosilylation curable resin-linear organosiloxane block copolymers have significantly faster cure speed, relative to their condensation curable counterparts. A faster cure speed can be important for encapsulating electronic devices, such as light-emitting diode (LED) chip devices, particularly devices having tall structures.

An opto-physical material comprises a curable matrix composition and an effective amount of an ultraviolet light additive dispersed therein. The opto-physical material has a refractive index ranging from 1 to 1.8 at 589 nm wavelength and a light transmission value of 30% or less at any wavelength in the ultraviolet light spectrum. In addition, a test value of an optical physical property for the opto-physical material does not differ by more than 5% from a predetermined value of the optical physical property when the predetermined value is measured under the same measurement conditions for an opto-physical material comprising a comparative curable matrix composition lacking the ultraviolet light additive, wherein the optical physical property is selected from color shift in the visible light spectrum, light diffusivity at any wavelength in the light spectrum, light transmission in the visible light spectrum, and combinations thereof.

An opto-physical material comprises a curable matrix composition and an effective amount of an ultraviolet light additive dispersed therein. The opto-physical material has a refractive index ranging from 1 to 1.8 at 589 nm wavelength and a light transmission value of 30% or less at any wavelength in the ultraviolet light spectrum. In addition, a test value of an optical physical property for the opto-physical material does not differ by more than 5% from a predetermined value of the optical physical property when the predetermined value is measured under the same measurement conditions for an opto-physical material comprising a comparative curable matrix composition lacking the ultraviolet light additive, wherein the optical physical property is selected from color shift in the visible light spectrum, light diffusivity at any wavelength in the light spectrum, light transmission in the visible light spectrum, and combinations thereof.

Provided are a novel composite material in which a fluoropolymer and a fluorine-containing organopolysiloxane are dispersed in a mutually inseparable state, a method for producing the same, use of the same, and a precursor composition. The fluoropolymer-fluorine-containing organopolysiloxane composite material comprises: (A) one or more fluoropolymers selected from the group comprising polyvinylidene fluoride and polyvinylidene fluoride copolymers; (B) an organopolysiloxane crosslinking reaction product having a fluorine atom-containing organic group, obtained by subjecting to a crosslinking reaction a reactive organopolysiloxane having a fluorine atom-containing organic group and one or more reactive functional groups in the molecule capable of crosslinking between molecules by the reaction of these reactive functional groups; and optionally (X) fillers and/or other additives besides component (A) and component (B). Components (A) and (B) are included such that the mass ratio ((A)/(B)) of component (A) and component (B) is in the range of from 99/1 to 60/40.