A laminate having a semiconductor substrate, a support substrate, and an adhesive layer and a release layer disposed between the semiconductor substrate and the support substrate, wherein the release layer is a film formed from a releasing agent composition containing an organic resin, a branched-chain polysilane, and a solvent.

A laminate having a semiconductor substrate, a support substrate, and an adhesive layer and a release layer disposed between the semiconductor substrate and the support substrate, wherein the release layer is a film formed from a releasing agent composition containing an organic resin, a branched-chain polysilane, and a solvent.

A method for manufacturing a part made of composite material includes forming a ceramic matrix phase in pores of a fibrous preform by pyrolysis of a cross-linked copolymer ceramic precursor, the cross-linked copolymer including a first precursor macromolecular chain of a first ceramic having free carbon, and a second precursor macromolecular chain of a second ceramic having free silicon, the first macromolecular chain being bonded to the second macromolecular chain by cross-linking bridges including a bonding structure of formula *.sup.1—X—*.sup.2; in this formula, X designates boron or aluminium, -*.sup.1 designates the bond to the first macromolecular chain and -*.sup.2 the bond to the second macromolecular chain.

A polysilazane having a ratio of the amount of SiH.sub.3 exceeding 0.050 and a ratio of the amount of NH of less than 0.045, based on the amount of aromatic ring hydrogen of xylene when .sup.1H-NMR of a 17% by mass solution of polysilazane dissolved in xylene is measured. A siliceous film-forming composition comprising the polysilazane. A method for producing a siliceous film comprising applying the polysilazane composition above a substrate.

A polysilazane having a ratio of the amount of SiH.sub.3 exceeding 0.050 and a ratio of the amount of NH of less than 0.045, based on the amount of aromatic ring hydrogen of xylene when .sup.1H-NMR of a 17% by mass solution of polysilazane dissolved in xylene is measured. A siliceous film-forming composition comprising the polysilazane. A method for producing a siliceous film comprising applying the polysilazane composition above a substrate.

Provided are: a thermosetting resin composition, for use in an organic material suited to high frequency use, that has outstanding low dielectric tangent, heat resistance, flexibility, and ease of workability; a thermosetting resin sheet; an electronic component; and an electronic device. The present invention is a thermosetting resin composition that includes the following constituents (A1)-(C). (A1) Polyimide resin: a polyimide resin including a diamine residue with formula (8) and/or formula (9) (in formula (8), a, b, c, and d are integers 1 or greater that meet the conditions a+b=6-17 and c+d=8-19, and the dashed lines denote carbon-carbon single bonds or carbon-carbon double bonds) (in formula (9), e, f, g, and h are integers 1 or greater that meet the conditions e+f=5-16 and g+h=8-19, and the dashed lines denote carbon-carbon single bonds or carbon-carbon double bonds). (B) Phenylene ether resin: a phenylene ether resin that has a number average molecular weight of 500-5,000 and, at a terminal of a molecular chain, includes at least one cross-linked functional group selected from the group consisting of a phenolic hydroxyl group, an acryl group, a vinyl group, and an epoxy group. (C) Maleimide resin: a maleimide resin.

##STR00001##

Provided are: a thermosetting resin composition, for use in an organic material suited to high frequency use, that has outstanding low dielectric tangent, heat resistance, flexibility, and ease of workability; a thermosetting resin sheet; an electronic component; and an electronic device. The present invention is a thermosetting resin composition that includes the following constituents (A1)-(C). (A1) Polyimide resin: a polyimide resin including a diamine residue with formula (8) and/or formula (9) (in formula (8), a, b, c, and d are integers 1 or greater that meet the conditions a+b=6-17 and c+d=8-19, and the dashed lines denote carbon-carbon single bonds or carbon-carbon double bonds) (in formula (9), e, f, g, and h are integers 1 or greater that meet the conditions e+f=5-16 and g+h=8-19, and the dashed lines denote carbon-carbon single bonds or carbon-carbon double bonds). (B) Phenylene ether resin: a phenylene ether resin that has a number average molecular weight of 500-5,000 and, at a terminal of a molecular chain, includes at least one cross-linked functional group selected from the group consisting of a phenolic hydroxyl group, an acryl group, a vinyl group, and an epoxy group. (C) Maleimide resin: a maleimide resin.

##STR00001##

Catalysts for facilitating cross-linking of liquid precursors into solid dielectric materials are disclosed. Initially, catalysts are protected, either by coordination with other compounds or by conversion to an ionic salt. Protection prevents catalysts from facilitating cross-linking unless activated. A catalyst is activated upon receiving an excitation, e.g. thermal excitation by heating. Upon receiving an excitation, protection of a catalyst dissociates, decomposes, becomes neutralized, or is otherwise transformed to allow the catalyst to facilitate cross-linking of the precursors into solid dielectric materials. Methods for fabricating dielectric materials using such protected catalysts as well as devices comprising the resulting materials are also described. Dielectric materials comprising cross-linked cyclic carbosilane units having a ring structure including C and Si may be formed in this manner. Protected catalysts disclosed herein allow careful control of precursor cross-linking, resulting in higher quality dielectric materials that may be formed by coating techniques.

Catalysts for facilitating cross-linking of liquid precursors into solid dielectric materials are disclosed. Initially, catalysts are protected, either by coordination with other compounds or by conversion to an ionic salt. Protection prevents catalysts from facilitating cross-linking unless activated. A catalyst is activated upon receiving an excitation, e.g. thermal excitation by heating. Upon receiving an excitation, protection of a catalyst dissociates, decomposes, becomes neutralized, or is otherwise transformed to allow the catalyst to facilitate cross-linking of the precursors into solid dielectric materials. Methods for fabricating dielectric materials using such protected catalysts as well as devices comprising the resulting materials are also described. Dielectric materials comprising cross-linked cyclic carbosilane units having a ring structure including C and Si may be formed in this manner. Protected catalysts disclosed herein allow careful control of precursor cross-linking, resulting in higher quality dielectric materials that may be formed by coating techniques.

A composition comprising a silicon-based polymer, and a derivatized carbon nano-particle is provided. Further, a method for coating a substrate, coated substrates and articles comprising a substrate coated with the composition are provided.