Patent classifications
C08L101/12
SILICONE HYDROGELS COMPRISING POLYAMIDES
Described are silicone hydrogels that are more biocompatible than current ocular materials. The silicone hydrogels are formed from a reactive monomer mixture comprising: a mixture of hydroxyl substituted silicone containing components, at least one polyamide; and at least one hydrophilic monomer. The silicone hydrogels also display a desirable balance of properties, including clarity, oxygen permeability, wettability and desirable protein uptake.
RESIN COMPOSITION, RESIN FILM COMPRISING SAID RESIN COMPOSITION, AND GLASS LAMINATE INCLUDING SAID RESIN FILM
The resin composition of the present invention has a phase separation structure including a continuous phase of a thermoplastic resin A and a dispersion phase of a thermoplastic resin B, wherein the thermoplastic resin A and the thermoplastic resin B each have a glass transition temperature of −50° C. or more and 50° C. or less, an absolute value of a difference between glass transition temperatures Tg1 and Tg2, which are each in a range of −50° C. or more and 50° C. or less, is 17° C. or less, and a haze at 23° C. is less than 1.5%. The present invention can provide a resin composition excellent in transparency at low temperature, a resin film containing the resin composition, and a glass laminate including the resin film.
RESIN COMPOSITION, RESIN FILM COMPRISING SAID RESIN COMPOSITION, AND GLASS LAMINATE INCLUDING SAID RESIN FILM
The resin composition of the present invention has a phase separation structure including a continuous phase of a thermoplastic resin A and a dispersion phase of a thermoplastic resin B, wherein the thermoplastic resin A and the thermoplastic resin B each have a glass transition temperature of −50° C. or more and 50° C. or less, an absolute value of a difference between glass transition temperatures Tg1 and Tg2, which are each in a range of −50° C. or more and 50° C. or less, is 17° C. or less, and a haze at 23° C. is less than 1.5%. The present invention can provide a resin composition excellent in transparency at low temperature, a resin film containing the resin composition, and a glass laminate including the resin film.
Composition for 3 dimensional printing
The present invention relates to a composition for 3D printing, a 3D printing method using the same, and a three-dimensional comprising the same, and provides a composition for 3D printing capable of realizing a three-dimensional shape having precision and excellent curing stability.
THERMALLY CURABLE PIEZOELECTRIC COMPOSITES AND USE THEREOF IN ADDITIVE MANUFACTURING
Parts made by additive manufacturing are often structural in nature, rather than having functional properties conveyed by a polymer or other component present therein. Printed parts having piezoelectric properties may be formed using compositions comprising a plurality of piezoelectric particles and a polymer material comprising at least one thermoplastic polymer and at least one thermally curable polymer precursor. At a sufficient temperature, the at least one thermally curable polymer precursor may undergo a reaction, optionally also undergoing a reaction with the piezoelectric particles, and form an at least partially cured printed part. The piezoelectric particles may be mixed with the polymer material and remain substantially non-agglomerated when combined with the polymer material. The compositions may define a form factor such as a composite filament, a composite pellet, or an extrudable composite paste, which may be utilized in forming printed part by extrusion, layer-by-layer deposition, and thermal curing.
ADHESIVE DEVICES AND USES THEREOF
The invention features adhesive devices for holding objects (e.g., bone fragments) fixed with respect to each other.
ADHESIVE DEVICES AND USES THEREOF
The invention features adhesive devices for holding objects (e.g., bone fragments) fixed with respect to each other.
Laser-welded body and production method therefor
A laser-welded body includes at least three of resin members, which contain a thermoplastic resin including: a first resin member which is a laser-irradiated subject, has an absorbance a.sub.1 of 0.01 to 0.12; a second resin member which has an absorbance a.sub.2 of 0.1 to 0.9 and includes a butted part where ends of one or more resin members are brought into contact with each other; and a third resin member which has an absorbance a.sub.3 of 0.2 to 3.8, and the absorbances a.sub.2, a.sub.3 exhibited by the second resin member and the third resin member are attributed to the inclusion of nigrosine as a laser beam absorbent therein, and the resin members are overlapped in the above mentioned to form contacted parts at these interfaces, at least a part of the butted part and/or the contacted parts are laser-welded.
Laser-welded body and production method therefor
A laser-welded body includes at least three of resin members, which contain a thermoplastic resin including: a first resin member which is a laser-irradiated subject, has an absorbance a.sub.1 of 0.01 to 0.12; a second resin member which has an absorbance a.sub.2 of 0.1 to 0.9 and includes a butted part where ends of one or more resin members are brought into contact with each other; and a third resin member which has an absorbance a.sub.3 of 0.2 to 3.8, and the absorbances a.sub.2, a.sub.3 exhibited by the second resin member and the third resin member are attributed to the inclusion of nigrosine as a laser beam absorbent therein, and the resin members are overlapped in the above mentioned to form contacted parts at these interfaces, at least a part of the butted part and/or the contacted parts are laser-welded.
Saltwater corrosion-resistant composite coating
A saltwater corrosion resistant composite coating is described. The coating includes at least one conductive polymer, chitosan, reduced graphene oxide (rGO), and a cured epoxy. The rGO and chitosan are dispersed in particles of the conductive polymer to form a 3D network. At least a portion of the chitosan is covalently bound to the rGO. At least a portion of the conductive polymer is covalently bound to the chitosan, and the 3D network is dispersed in the cured epoxy.