Patent classifications
C08L2201/02
IMPACT MODIFIED POLYAMIDE COMPOSITIONS
Described herein are polymer compositions (PC) including a polyamide (PA) and a reactive impact modifier. As explained in detail below, the polyamide (PA) is a semi-aromatic polyamide derived from the polycondensation of an aliphatic diamine, a bis(aminoalkyl)cyclohexane, terephthalic acid, and, optionally, a cyclohexanedicarboxylic acid. It was surprisingly discovered that semi-aromatic polyamides derived from the cycloaliphatic diamine bis(aminoalkyl)cyclohexane or the specific combination of the cycloaliphatic diamine bis(aminoalkyl)cyclohexane and the cycloaliphatic dicarboxylic acid cyclohexanedicarboxylic acid provided for polymer compositions (PC) having improved retention of mechanical properties (e.g. tensile strength and flexural strength) after aging in aqueous solutions, relative to analogous polyamides free of the bis(aminoalkyl)cyclohexane and the cyclohexanedicarboxylic acid.
Thermoplastic Resin Composition and Electronic Device Housing Comprising Same
A thermoplastic resin composition of the present invention includes a polycarbonate resin; a rubber-modified aromatic vinyl graft copolymer; a polyester resin; a glycol-modified polyester resin having about 10 mol % to about 60 mol % of a cyclohexanedimethanol (CHDM) content based on a total amount of a diol component; and a vinyl copolymer including an epoxy group. The thermoplastic resin composition has good impact resistance, flowability, external appearance and the like.
THERMOPLASTIC RESIN COMPOSITION EXHIBITING SUPERIOR MATTE AND GLOSSY, AND MOLDED ARTICLE MANUFACTURED FROM THE SAME
The present disclosure relates to a thermoplastic resin composition and a molded article manufactured from the same. More particularly, the present disclosure relates to a thermoplastic resin composition including 10 to 59% by weight of an acrylic graft copolymer resin (a) having a graft efficiency of 50 to 95%; 1 to 20% by weight of an acrylic graft copolymer resin (b) having a graft efficiency of 5 to 49%; and 21 to 89% by weight of an aromatic vinyl compound-vinyl cyan compound copolymer resin (c), wherein a weight ratio of (a):(b) is 1:1 to 10:1, and a molded article manufactured from the same. In accordance with the present disclosure, a thermoplastic resin composition that exhibits glossy effect by injection molding and matte effect by extrusion molding while providing superior mechanical strength and thus is applicable to both glossy products and matte products, and a molded article manufactured from the same are provided.
PROCEDURE FOR OBTAINING FLEXIBLE EXPANDABLE MATERIAL (FEM) RESISTANT TO COMBUSTION USING BIOPLASTIFICIZERS
The present invention is a novel fire-resistant material used for the manufacturing of pipe collars as passive fire protection. The technological process consists of two phases. The first phase involves mixing poly (vinyl chloride-co-vinyl acetate) copolymers (VC-co-VAc) or a modified poly(vinyl chloride-co-vinyl acetate) copolymer (VC-co-VAc) with expandable graphite and plasticizers/modifiers such as: diisononyl phthalate—DINP, dioctyl adipate—DOA, 1-hexadecene or methyl esters of soybean fatty acids (MBS), azodicarbonamide (ADC), tri-p-cresyl phosphate, tri-m-cresyl phosphate or tri-o-cresyl phosphate, epoxidized soybean oil (ESO) and polyacrylate or poly(vinylacetate) emulsion. The second phase considers shaping the resulting mixture in a temperature-controlled press to make various samples, which are further tested. The samples had different dimensions: 4-6 mm thickness, 70-400 mm width and 240-500 mm length.
FLAME RETARDANT RESIN COMPOSITION
A flame-retarded resin includes at least one resin for which flame retardant capability is desired and at least one triaryl silicon-containing compound (I) as flame retardant in admixture therewith and/or chemically bonded, e.g., grafted, to the resin.
RESIN COMPOSITION, ADHESIVE FILM, AND CIRCUIT BOARD USING THE SAME
A resin composition for a PCB includes a styrene-butadiene-styrene block copolymer in an amount from 95 to 100 parts by weight, a modified porous spheres of silicon oxide in an amount from 1 to 50 parts by weight, and a liquid polybutadiene in an amount from 5 to 50 parts by weight. The styrene-butadiene-styrene block copolymer and the liquid polybutadiene both include vinyl groups on the molecular side chains. The modified porous spheres of silicon oxide also include vinyl groups. An adhesive film and a circuit board using the resin composition are also provided.
RESIN COMPOSITION AND RESIN MOLDED ARTICLE
A resin composition includes a polycarbonate resin; a reaction product of a glycidyl group-containing polyethylene copolymer and a polyethylene terephthalate resin; an unreacted polyethylene terephthalate resin that is not subjected to a reaction with the glycidyl group-containing polyethylene copolymer; an organic phosphorous flame retardant; and a flame retardant antidrip agent, wherein in a resin phase separation structure observed by an electron microscope, the polycarbonate resin and the unreacted polyethylene terephthalate resin form a continuous phase, the reaction product forms a dispersed phase, and a specific surface area of the dispersed phase is 2 or greater.
MOISTURE RESISTANT POLYMER FORMULATIONS CONTAINING PHOSPHORUS-BASED FLAME RETARDANTS
Polymer compositions containing a suitable polymer and a triazine metal phosphate compound are disclosed, and the triazine metal phosphate compound can have a d50 particle size from 0.1 to 45 μm and a BET surface area from 0.5 to 30 m.sup.2/g. The polymer compositions have improved moisture resistance and improved wet insulating properties as compared to polymer compositions that contain polymerized versions of the triazine metal phosphate compound. The polymer compositions can be utilized in a variety of end-uses, such as wire and cable applications.
GLASS FIBER REINFORCED POLYPROPYLENE RESIN COMPOSITION AND MOLDED ARTICLE COMPRISING THE SAME
Disclosed are a polypropylene resin composition and a molded article including the same. The polypropylene resin composition may include a polypropylene resin, glass fiber, a non-halogen flame retardant, a compatibilizer, and sodium salt ionomer such that the resin composition may provide substantially improved mechanical properties such as tensile strength, impact strength, and flexural modulus, and excellent flame retardancy and flame retardant stability over time.
Resin composition, copper clad laminate and printed circuit board using same
The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).