A halogen-free type polycarbonate resin composition and a resin molded object having good flame retardant properties and physical properties that make them suitable for the use as manufactured products are provided. A resin composition of the present disclosure includes a component A, a component B, a component C and a component D. The component A is a polycarbonate resin. The component B is talc having an average median diameter of 4.6 μm or more and 6.0 μm or less, whose content is 5% or more and 20% or less by weight. The component C is an organic sulfonic acid or an organic sulfonic acid metal salt, whose content is 0.05% or more and 2.0% or less by weight. The component D is a drip inhibitor, whose content is 0.05% or more and 1.0% or less by weight.

The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

Method for sulphation and phosphorylation of a cellulose substrate for imparting anti-flame properties to the substrate in which at least one phosphonic acid of formula (I):
PO(OH).sub.2—R—PO(OH).sub.2,   (I)
is used as a catalyst of sulphation and a phosphorylating agent and relative substrate.

An impact-resistant film comprises at least one layer of an elastomeric polymer material and an adhesive layer.

A composition includes specific amounts of an aromatic polycarbonate, a block polycarbonate-polysiloxane, a poly(alkylene terephthalate), a block polyestercarbonate, and an organophosphate ester. Relative to a corresponding composition lacking the block polyestercarbonate, the composition exhibits improved solvent resistance while substantially maintaining impact strength, melt flow, and flame retardancy. The composition is useful for fabricating articles that may come into contact with liquid chemicals or chemical vapors.

A composite polymer solution comprising a homogeneous mixture of a first polymer solution comprising a first polymer having a structure derived from the reaction of one or more amine monomers and a plurality of acid monomers, wherein i) the one or more amine monomers includes at least 60 mole percent 5(6)-amino-2-(p-aminophenyl)benzimidazole; and ii) the plurality of acid monomers include those having a structure of
Cl—CO—Ar.sub.1—CO—Cl and Cl—CO—Ar.sub.2—CO—Cl wherein Ar.sub.1 is a para-oriented aromatic group and Ar.sub.2 is a meta-oriented aromatic group, and wherein the plurality of acid monomers has at least 50 mole percent of the monomer containing Ar.sub.2; and a second polymer solution comprising a second polymer having a structure derived from the reaction of metaphenylene diamine and isophthaloyl chloride.

Disclosed is a thermoplastic resin composition. Due to addition of the epoxy-based resin, the phosphorous-based flame retardant, the silicon-based compound and the calcium carbonate to the basic resin according to the present invention, a thermoplastic resin composition having superior flame retardancy and excellent rigidity, heat resistance and processability, and a molded article manufactured therefrom may be provided.

A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100˜140 parts of halogen-free phosphorous epoxy resin, 10˜35 parts of dicyclopentadiene phenolic epoxy resin, 32˜60 parts of benzoxazine, 1˜5 parts of phenolic resin, 0.05˜0.5 parts of accelerants; and 25˜70 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI≧500V), high heat resistance(Tg≧150 ° C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.

The present invention relates to a polypropylene resin composition and a cable cladded with the same. More particularly, the present invention relates to a polypropylene resin composition, including 25 to 35% by weight of a polypropylene polymer, 15 to 25% by weight of a styrene block copolymer, 15 to 25% by weight of a poly(arylene ether) resin, 26 to 35% by weight of a phosphorus flame retardant, and 0 to 10% by weight of a processing additive.

In accordance with the present invention, a polypropylene resin composition including a small amount of flame retardant but exhibiting excellent flame resistance, insulation performance, processability, and property balance, and a cable cladded with the same are provided.

A process of forming a flame retardant material from furan dicarboxylic methyl ester (FDME) includes converting an FDME molecule to a 2,5-furan dicarbonyl dichloride (FDCC) molecule and chemically reacting the FDCC molecule with a phosphorus-containing material to form an FDME-based flame retardant material that includes a phosphorus-based flame retardant moiety.