An oil-in-water emulsion comprising an asphalt and purified coal product (PCP) is provided, wherein the PCP is in particulate form, and wherein at least about 90% by volume (% v) of the particles are no greater than about 25 μm in diameter; wherein the PCP has an ash content of less than about 10 wt %. Methods are also provided for the use of PCP as a stabilizing additive in the manufacture of asphalt containing emulsions.

A conductive polyester composition is provided, which includes a polyester base material and a conductive reinforcing material. The conductive reinforcing material includes a plurality of carbon nanotubes, and the plurality of carbon nanotubes are dispersed in the polyester base material. In each of the carbon nanotubes, a length of the carbon nanotube is defined as L, a diameter of the carbon nanotube is defined as D and is between 1 nanometer and 30 nanometers, and an L/D value of the carbon nanotube is between 300 and 2,000. The plurality of carbon nanotubes are in contact with each other to form a plurality of contact points, so that the conductive polyester composition has a surface impedance of not greater than 10.sup.7 Ω/sq.

A resin composition includes 100 parts by weight of a polyolefin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and thermal resistance after moisture absorption and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

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To provide an epoxy resin composition capable of forming a polished surface with high flatness when polished after curing, and a method for producing an electronic component mounting structure having a polished surface with high flatness, the polished surface obtained by polishing the surface of an encapsulation body. Disclosed are an epoxy resin composition, an electronic component mounting structure including the epoxy resin composition, and a method for producing the electronic component mounting structure, wherein: the epoxy resin composition includes a fused silica possibly containing hollow particles, and a curing agent; on a polished surface obtained by polishing a cured product of the epoxy resin composition, the number of pores having a diameter of more than 5 μm observed within a 25-mm.sup.2 area is one or less, the pores derived from cross sections of the hollow particles; and the polished surface is coated with a coating material.

Provided is a thermoplastic resin composition which includes: a first graft copolymer including a C.sub.4 to C.sub.10 alkyl (meth)acrylate-based monomer unit, an aromatic vinyl-based monomer unit, and a vinyl cyan-based monomer unit; a second graft copolymer including a C.sub.4 to C.sub.10 alkyl (meth)acrylate-based monomer unit, an aromatic vinyl-based monomer unit, and a vinyl cyan-based monomer unit; and a first styrene-based copolymer being a copolymer of a monomer mixture including a C.sub.1 to C.sub.3 alkyl-substituted styrene-based monomer, a vinyl cyan-based monomer, and a C.sub.1 to C.sub.3 alkyl (meth)acrylate-based monomer, wherein the first graft copolymer and the second graft copolymer have cores having mutually different average particle diameters. The thermoplastic resin composition is excellent in colorability, weather resistance, tensile strength, flexural strength, and impact strength.

The invention relates to a composition comprising: (A) a propylene-based polymer which is a propylene homopolymer or a propylene copolymer consisting of at least 90 wt % of propylene monomer units and at most 10 wt % of ethylene monomer units and/or an α-olefin monomer units having 4 to 10 carbon atoms, (B) a terpolymer of propylene, an α-olefin having 4 to 10 carbon atoms and ethylene and (C) a copolymer of ethylene and an α-olefin having 4 to 10 carbon atoms, wherein the copolymer (C) has a density of at least 0.880 g/cm.sup.3, wherein the amount of the propylene-based polymer (A) is at least 60 wt % with respect to the total composition.

A polyethylene composition comprising (A) an ethylene-based (co) polymer, (B) a styrenic unit-containing copolymer, and (C) a polyorganosiloxane. Also a method of making the composition; a crosslinked polyethylene product made by curing the composition; manufactured articles comprising a shaped form of the inventive composition or product; and methods of using the inventive composition, product, or articles.

A thermoplastic molding composition comprising (A) 15 to 45 wt.-% graft copolymer (A) obtained by emulsion polymerization of styrene and acrylonitrile in presence of an agglomerated butadiene rubber latex (A1) with D50 of 150 to 800 nm; (B) 40 to 75 wt.-% copolymer (B) of styrene and acrylonitrile having a weight ratio of 80:20 to 65:35 and Mw of 150,000 to 300,000 g/mol, (C) 2.0 to 5.0 wt.-% elastomeric block copolymer (C) made from 15 to 65 wt.-% diene, and 35 to 85% by weight vinylaromatic monomer; (D) 2.0 to 5.0 wt.-% titanium dioxide pigment D comprising at least 95 wt.-% titanium dioxide and 1.7 to 3.3 wt.-% alumina; and (E) 0 to 7.0 wt.-% of at least one additive/processing aid (E) different from (D); having a high chemical resistance, high color and thermal stability and low tendency to delamination. This can be used for sheet extrusion and thermoforming, in particular as inner liner for a cooling apparatus.

High heat resistant ABS molding compositions for use in the automotive sector, electronics, and household or healthcare sector comprising: (A) 15 to 35 wt.-% ABS graft copolymer (A); (B) 15 to 35 wt.-% a-methylstyrene/acrylonitrile copolymer (B) (weight ratio 95:5 to 50:50); (C) 20 to 40 wt.-% styrene/acrylonitrile copolymer (C) (weight ratio 95:5 to 50:50; M.sub.w 150,000 to 300,000); (D) 10 to 30 wt.-% random terpolymer (D) made from 13 to 27 wt.-% α, β ethylenically unsaturated cyclic anhydride, 60 to 74 wt.-% aromatic vinyl monomer, and 13 to 27 wt.-% maleimide monomer); (E) 0.1 to 5 wt.-%, of at least one elastomeric block copolymer (E) comprising a vinylaromatic monomer block S and an elastomeric random diene/vinylaromatic onomer block B/S; hard phase proportion is 1 to 40 vol.-% and the diene proportion is less than 50 wt.-%; and (F) 0 to 5 wt.-% of further additives and/or processing aids (F).

Disclosed herein is a thermoplastic molding composition, including: a) 30 to 99.85 wt % of at least one thermoplastic polyamide as component A; b) 0.1 to 10 wt % of at least one polyhydric alcohol having more than 6 hydroxyl groups, and having a number average molecular weight M.sub.n of more than 2000 g/mol as component B; c) 0.05 to 3 wt % of at least one sterically hindered phenol antioxidant as component C; d) 0 to 3 wt % of at least one polycarboxylic compound having more than 3 carboxylic acid groups and/or carboxylate groups, and having a number average molecular weight M.sub.n of more than 300 g/mol as component D; e) 0 to 50 wt % of at least one fibrous and/or particulate filler as component E; and f) 0 to 25 wt % of further additives as component F; where the total of wt % of components A to F is 100 wt %.