Patent classifications
C08L2201/08
Wear-resistant rubber compositions, systems, and methods
This disclosure relates to wear-resistant rubber compositions, such as those, for example, comprising at least one hydroxy-terminated polybutadiene, at least one natural rubber, at least one polymerization accelerant; at least one sulfur; and at least one polybutadiene, wherein the wear-resistant rubber composition may have an effective cross-linking density of at least about 30×10.sup.−5 moles/cm.sup.3.
Surface treated talc and polymer compositions for high temperature applications
The present invention relates to a composition for high temperature applications. More specifically, the present invention relates to a coated talc, a process for the preparation of such and its use as an additive in the production of polyolefin composite. Polyolefin composites produced according to the process of the present invention are exhibit a high thermal stability and are useful in a broad range of high temperature applications.
Melt processible fluororesin composition and injection molded article formed from same
Provided is a melt processible fluororesin composition for injection molding of articles that has melt flow that facilitates injection molding, that can enhance strength of a fluororesin weld line area in an injection molded article, and that achieves excellent release from a mold. The fluororesin composition includes two or more types of melt processible fluororesins having different melt flow rates; one of the melt processible fluororesins being a high melt flow rate melt processible fluororesin having a melt flow rate of 35 g/10 min or greater, and another being a low melt flow rate melt processible fluororesin having a melt flow rate of 10 g/10 min or greater but less than 35 g/10 min; and wherein the ratio of the melt flow rate (MFRa) of the high MFR melt processible fluororesin to the melt flow rate (MFRb) of the low MFR melt processible fluororesin (MFRa/MFRb) is from 1 to 10.
SLURRY COMPOSITION FOR NON-AQUEOUS SECONDARY BATTERY HEAT-RESISTANT LAYER, HEAT-RESISTANT LAYER FOR NON-AQUEOUS SECONDARY BATTERY, AND NON-AQUEOUS SECONDARY BATTERY
Provided is a slurry composition for a non-aqueous secondary battery heat-resistant layer that has excellent dispersion stability and coatability and can form a heat-resistant layer for a non-aqueous secondary battery having both excellent heat shrinkage resistance and reduced residual water content. The slurry composition contains a water-soluble polymer, non-conductive organic particles, and water. The water-soluble polymer includes an amide group-containing monomer unit, an acid group-containing monomer unit, and a hydroxyl group-containing monomer unit. The proportional content of the amide group-containing monomer unit in the water-soluble polymer is not less than 63 mass % and not more than 98 mass %, and the proportional content of the acid group-containing monomer unit in the water-soluble polymer is not less than 1 mass % and not more than 20 mass %. The non-conductive organic particles include a cross-linkable monomer unit with a proportional content of not less than 20 mass % and not more than 95 mass %.
HEMP POLYMER MATERIALS AND METHODS OF MAKING SAME
The present invention relates to polymer compounds containing hemp and/or components of hemp, and methods for producing such polymer compounds.
THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREBY
A thermoplastic resin composition and a molded article including the same can include 100 parts by weight of a base resin including 10 to 50% by weight of an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A-1) containing acrylate rubber having an average particle diameter of 0.3 to 0.5 μm, 5 to 40% by weight of an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A-2) containing acrylate rubber having an average particle diameter of 0.05 μm or more and less than 0.3 μm, and 20 to 65% by weight of an aromatic vinyl polymer (B), and 0.5 to 12 parts by weight of a polyamide (C). The thermoplastic resin composition can have a solvent resistance of 15 days or more.
POLYETHYLENE COMPOSITION FOR FILAMENTS OR FIBERS
A polyethylene composition made from or containing: A) from 75% to 97% by weight of a copolymer of ethylene having: 1) a density of 0.925 g/cm.sup.3 or higher; and 2) a MI.sub.2 value of 0.5 g/10 min. or greater; and B) from 3% to 25% by weight of a polyolefin composition made from or containing: B.sup.I) from 5% to 35% by weight of a propylene homopolymer or a propylene copolymer; B.sup.II) from 20% to 50% by weight of a copolymer of ethylene containing from 1.0% to 20.0% by weight of alpha-olefin units and 25.0% by weight or less of a fraction soluble in xylene at 25° C.; and B.sup.III) from 30% to 60% by weight of a copolymer of ethylene and propylene containing from 25.0% to 75.0% by weight of ethylene derived units and from 40.0% to 95.0% by weight of a fraction soluble in xylene at 25° C.
HEALTHCARE ARTICLE COMPRISING A RANDOM PROPYLENE-ETHYLENE COPOLYMER
The present invention relates to a healthcare article comprising a polymer composition comprising a random propylene-ethylene copolymer, wherein the polymer composition comprises less than 150 ppm, preferably less than 100 ppm, more preferably less than 50 ppm, more preferably less than 20 ppm, most preferably 0 ppm of phthalates based on the weight of the random propylene ethylene copolymer.
CURABLE RESIN COMPOSITION, DRY FILM AND CURED PRODUCT THEREOF, AND ELECTRONIC COMPONENT INCLUDING CURED PRODUCT
Provided is a curable resin composition having developability and resolution improved without degrading the heat resistance and the chemical resistance, furthermore, a curable resin composition that is useful as a PID material for optical uses or a material for optical sensor protective films and enables the formation of a cured product having both higher transparency and excellent heat resistance, a dry film containing the curable resin composition, a cured product thereof and a printed wiring board including the cured product. A curable resin composition containing (A) an amide-imide resin, (B) a compound having an ethylenic double bond and (C) a photopolymerization initiator, wherein the amide-imide resin (A) is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic acid anhydride and has a number-average molecular weight of 500 to 1000.
Polyolefin based compositions modified by silanes
A thermoplastic polyolefin composition which is capable of being shaped and repeatedly recycled, comprises propylene-based polymers, said composition being modified with 0.01-5 wt % of organic oligomeric silanes selected from partially hydrolyzed alkoxy substituted vinyl, allyl or methacryl silanes, and blends thereof, and 0.0005-0.5 wt % of a compound capable of generating free radicals.