This invention generally relates to transparent compositions containing a blend of poly(phenylene ether) and styrenic polymer, methods for their manufacture, and food packaging films and containers derived therefrom.

According to one embodiment, the present invention provides a resin composition, which comprises a polymer (A) containing 45% by mass or more of a (meth)acrylate unit (a) represented by the following formula (1), a polymer (B) containing 60% by mass or more of a methyl (meth)acrylate unit (b) and having a mass average molecular weight of 5,000 to 20,000, and a polycarbonate-based resin (C).

##STR00001##

An embodiment can provide a polyamide-imide film and a method for producing same, the film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, in an XRD graph with a section in which 2θ=8° to 32° as a baseline, the film shows a peak area of 50% or above around 2θ=23° with respect to a peak area seen around 2θ=15°.

A thermoplastic resin composition contains a styrene-methyl methacrylate-butyl acrylate copolymer and thus exhibits improved blackness and scratch resistance, and a molded article including the same.

The purpose of the present invention is to provide a thermoplastic resin that has a high refractive index and enables low birefringence and balanced heat resistance and moldability. This thermosetting resin includes repeating units represented by formula (1). (In the formula, the rings Z are the same or different and represent an aromatic hydrocarbon ring, R.sup.1 and R.sup.2 independently represent a C1-C12 hydrocarbon group optionally including a hydrogen atom, a halogen atom, and an aromatic group, Ar.sup.1 and Ar.sup.2 represent a C6-C10 aromatic group optionally having a substituent, L.sup.1 and L.sup.2 independently represent a divalent linking group, j and k independently represent an integer of 0 or more, m and n independently represent 0 or 1, and W is at least one selected from the groups represented by formulae (2) and (3).) (In the formula, X represents a divalent linking group.)

A polymer is disclosed, represented by Chemical Formula 1 or Chemical Formula 2: ##STR00001## wherein, in Chemical Formula 1 and Chemical Formula 2, Ar.sup.1, Ar.sup.2, R.sup.3, s, x, and y are defined in the detailed description.

A polyethylene homopolymer composition comprises: a first ethylene homopolymer having a density, d.sup.1 of from 0.930 to 0.975 g/cm.sup.3, a melt index, I.sub.2.sup.1 of from 0.01 to 10 g/10 min, and a molecular weight distribution, Mw/Mn of less than 2.5; and a second ethylene homopolymer having a density, d.sup.2 of from 0.945 to 0.980 g/cm.sup.3, a melt index, I.sub.2.sup.2 of at least 1.0 g/10 min, and a molecular weight distribution, M.sub.w/M.sub.n of less than 2.5; wherein melt index, I.sub.2.sup.2 of the second ethylene homopolymer is greater than the melt index, I.sub.2.sup.1 of the first ethylene homopolymer. The polyethylene homopolymer compositions which may be nucleated have a weight average molecular weight, M.sub.w of 75,000, a molecular weight distribution, M.sub.w/M.sub.n of less than 4.0 and may be usefully employed in molding applications, such as, for example, in compression molded closures.

New C.sub.2C.sub.3 random copolymers, which combine low sealing initiation temperature (SIT), high hot-tack, low C6-solubles, good optical properties and an improved stiffness/impact balance, which are particularly suited for preparing blown films. The present invention is furthermore related to the manufacture of said copolymers and to their use, as well as to the blown films comprising such C.sub.2C.sub.3 random copolymers.

The present application relates to a cured product and the use thereof. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. The cured product has excellent transparency, moisture resistance, mechanical properties, and cracking resistance, etc. The cured product, for example, may be applied as an encapsulant or an adhesive material of a semiconductor device to provide a device having high long-term reliability.

Provided are a resin composition including a coloring material, a resin, and a solvent, in which, in a case where a film having a thickness of 0.60 μm is formed by heating the resin composition at 200° C. for 30 minutes, a thickness of the film after performing a heating treatment of the film at 300° C. for 5 hours in a nitrogen atmosphere is 70% or more of a thickness of the film before the heating treatment; a film formed of the resin composition; a color filter; a solid-state imaging element; and an image display device.