Patent classifications
C08L2201/10
Polyester container and manufacturing method therefor
The present invention relates to a polyester container. The polyester container is formed from a polyester resin containing a particular content of diol moieties derived from isosorbide and diethylene glycol, and thus can show high transparency in spite of a great wall thickness thereof.
CURABLE COMPOSITION, CURED PRODUCT, ELECTRONIC DEVICE, DISPLAY DEVICE, OPTICAL MEMBER, POLYMER, PHOTOSENSITIVE COMPOSITION, PATTERN, AND COMPOUND
A curable composition including a first compound having a group represented by general formula (x) and an epoxy group and having a molecular weight of 1000 or less. In the general formula (x), Rf.sub.1 and Rf.sub.2 each independently represent a fluorine-containing alkyl group.
—C(Rf.sub.1)(Rf.sub.2)—OH (x)
PHOTOCURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF
A UV-curable silicone composition is disclosed. The UV-curable silicone composition comprises: (A) an organopolysiloxane having at least two alkenyl groups and at least one aryl group in a molecule; (B) a polysiloxane block copolymer comprising: (i) a polysiloxane block and (ii) an organo block, wherein the polysiloxane block (i) is bonded to the organo block (ii) via a specific linkage, and wherein the polysiloxane block copolymer has at least two thiol groups in a molecule; (C) a photoinitiator; and (D) an inorganic filler. The composition exhibits excellent transparency even if an inorganic filler is added to improve thixotropic property.
Polyester film and method for manufacturing the same
A polyester film and a method for manufacturing the same are provided. The polyester film includes a physically recycled polyester resin and a chemically recycled polyester resin. The physically recycled polyester resin is formed by a plurality of physically recycled polyester chips. The chemically recycled polyester resin is formed by a plurality of chemically recycled polyester chips and mixed with the physically recycled polyester resin. The plurality of chemically recycled polyester chips further includes chemically recycled electrostatic pinning polyester chips. The chemically recycled electrostatic pinning polyester chips contain electrostatic pinning additives, and the electrostatic pinning additives are metal salts. Expressed in percent by weight based on a total weight of the polyester film, a content of the electrostatic pinning additives in the polyester film is between 0.005% and 0.1% by weight.
RANDOM OR BLOCK POLYIMIDE SILOXANE COPOLYMER AND MANUFACTURING METHOD OF THE SAME
The present invention provides a random or block polyimide-siloxane copolymer, which may be prepared from a hard amine monomer, a dianhydride monomer, and a soft amine monomer, may have mechanical properties, flexibility, and thermal properties adjusted through the control of soft amine content, and may exhibits high thermal stability, corrosion resistance, transparency and flexibility, and a method for preparing the same. The random or block polyimide-siloxane copolymer, which may be flexible and thermally stable and may exhibits adjustable mechanical properties and skin-like sensory functions, may be applied to flexible electronic devices.
Polyamideimide Film-Forming Composition, Polyamideimide Film, Method of Preparing Polyamideimide Film-Forming Composition, Method of Producing Polyamideimide Film, and Uses of Polyamideimide Film-Forming Composition and Polyamideimide Film
The present disclosure relates to a polyamideimide film-forming composition, a polyamideimide film, a method of preparing a polyamideimide film-forming composition, a method of producing a polyamideimide film, and uses of a polyamideimide film-forming composition and a polyamideimide film. The polyamideimide film according to one embodiment prevents deterioration of colorless and transparent optical properties, has excellent visibility with no optical stains, has excellent heat resistance, is flexible, and has excellent bending properties.
PROTEIN POLYURETHANE ALLOYS AND LAYERED MATERIALS INCLUDING THE SAME
Protein polyurethane alloys including one or more proteins dissolved within one or more polyurethanes. The protein polyurethane alloy may have one or more mechanical properties that are superior to the polyurethane in the absence of protein. The protein polyurethane alloys may be incorporated into a layered material including one or more protein polyurethane alloy layers.
HEAT DISSIPATIVE AND LIGHTWEIGHT OPTICAL ELEMENTS HAVING INCREASED STRENGTH AND STIFFNESS
A polymer thin film includes polyethylene having a weight average molecular weight of at least approximately 500,000 g/mol, where the thin film is characterized by transparency within the visible spectrum of at least approximately 80%, bulk haze of less than approximately 5%, and an in-plane elastic modulus of at least approximately 10 GPa. The polymer thin film may be thermally conductive and may be incorporated into an optical element and configured to dissipate heat, such as from a light-emitting device.
HIGH STRENGTH AND HIGH THERMAL CONDUCTIVITY POLYETHYLENE THIN FILM HAVING A BIMODAL MOLECULAR WEIGHT
An optically clear, high strength, high modulus, and high thermal conductivity polyethylene thin film may be formed from a crystallizable polymer and an additive configured to interact with the crystallizable polymer to facilitate crystallite alignment and, in some examples, create a higher crystalline content within the polyethylene thin film. The polyethylene thin film may be characterized by a bimodal molecular weight distribution where the molecular weight of the additive may be less than approximately 5% of the molecular weight of the crystallizable polymer. Example crystallizable polymers may include high molecular weight polyethylene, high density polyethylene, and ultra-high molecular weight polyethylene. Example additives may include low molecular weight polyethylene and polyethylene oligomers. The polyethylene thin film may be characterized by a Young's modulus of at least approximately 10 GPa, a tensile strength of at least approximately 0.7 GPa, and a thermal conductivity of at least approximately 5 W/mK.
THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE MANUFACTURED USING THE SAME
The present invention provides a thermoplastic resin composition including a first graft copolymer including a conjugated diene-based polymer, an alkyl (meth)acrylate-based monomer, an aromatic vinyl-based monomer, and a vinyl cyanide-based monomer; a second graft copolymer including an alkyl (meth)acrylate-based polymer, an aromatic vinyl-based monomer, a vinyl cyanide-based monomer, and an alkyl (meth)acrylate-based monomer; and a thermoplastic copolymer including an alkyl (meth)acrylate-based monomer, an aromatic vinyl-based monomer, and a vinyl cyanide-based monomer, wherein the first graft copolymer is included in an amount of 5 to 12% by weight, and the weight of the first graft copolymer is less than the weight of the second graft copolymer and at the same time less than the weight of the thermoplastic copolymer, and a molded article manufactured using the thermoplastic resin composition.