The present invention relates to a halogen-free flame-retardant resin composition, based on the weight parts of organic solids, comprising (A) from 1 to 10 parts by weight of bismaleimide resin, (B) from 30 to 60 parts by weight of benzoxazine resin, (C) from 10 to 40 parts by weight of polyepoxy compound, (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant, and (E) from 1 to 25 parts by weight of curing agent, which is amine curing agent and/or phenolic resin curing agent. The present invention further provides prepregs, laminates, laminates for printed circuits prepared from said resin composition.

Isolated quantities of plastic solids having greater than 70% by weight polyethylene terephthalate (PET) also include a) from 0.1% to 10% by weight polyvinyl chloride (PVC), and a moisture content of less than 4% by weight, or b) from 0.05% to 10% or 0.1% to 4% by weight halogens, or c) from 0.1% to 4% by weight polyvinyl chloride (PVC), and at least 0.1% by weight of solid materials that do not phase change below 270 C. and 1 atm. The quantities of these solid plastics are suitable for use as feedstocks to various chemical recycling processes.

Quantities of plastic solids derived from mixed plastic waste are provided. The quantities can comprise polyolefins and/or polyethylene terephthalate and can be co-located with other quantities of plastic solids. The quantities of solids plastics can comprise particulate plastic solids that are suitable for use as feedstocks to various chemical recycling processes.