C08L2203/16

Plastic Films

The invention relates to plastic films and a silicone containing polymer blend composition that can be used in the production of the plastic films which is a polymer composition obtainable from, per 100 parts by weight of the composition, 99.99 to 90 parts by weight of a polyolefin polymer (P) and 0.01 to 10 parts by weight of a masterbatch (M).

Broad Orthogonal Distribution Polyethylenes for Films

A polyethylene comprising of ethylene derived units and 0.5 wt % to 10 wt % C.sub.3 to C.sub.12 α-olefin derived units may be synthesized using a mixed catalyst that comprises rac-dimethylsilylbis(tetrahydroindenyl)zirconium dichloride and a zirconium co-catalyst in a mole ratio of 50:50 to 90:10, and wherein the zirconium co-catalyst is a poor comonomer incorporator as compared to the rac-dimethylsilylbis(tetrahydroindenyl)zirconium dichloride catalyst. Such a polyethylene may have a density of 0.91 g/cm.sup.3 to 0.93 g/cm.sup.3, an I.sub.2 value of 0.5 g/10 min to 2 g/10 min, an I.sub.21 value of 25 g/10 min to 75 g/10 min, an I.sub.21/I.sub.2 ratio of 25 to 75, a molar reversed-co-monomer index (RCI,m) of 30 to 180, a phase angle equal or lower than 70° at complex modulus G* of 10,000 Pa, a Θ.sub.2 of 1.5 radians to −1.5 radians, and a low density population of 50% and 70% by weight of the polyethylene.

Compatibilized polymer composition comprising a polyamide

The present invention relates to a polymer composition (C) comprising at least one polyamide (P1), and from 1 to 50 wt. %, based on the total weight of (C), of at least one functionalized polymer (P2), wherein P2 is a poly(aryl ether sulfone) (PAES) having at least one functional group (SO.sub.3.sup.−), (M.sup.p+).sub.1/p in which M.sup.p+ is a metal cation of p valence. The present invention also relates to articles incorporating the polymer composition (C) and the use of functionalized polymer (P2) as a compatibilizer in the polymer composition (C) comprising two immiscible polymers.

ETHYLENE-BASED MODIFIER, ETHYLENE-BASED RESIN COMPOSITION, FILM, METHOD FOR PRODUCING ETHYLENE-BASED RESIN COMPOSITION, AND METHOD FOR PRODUCING FILM
20230029101 · 2023-01-26 ·

Provided is an ethylene-based modifier with which a film having good slipperiness and relatively less fish eyes can be formed. The ethylene-based modifier has a strain-hardening exponent of 0.27 or more and 0.53 or less as determined by the LAOS method.

Polyester composition, polyester film, and magnetic recording medium

The invention provides a polyester composition in which the primary repeating units contain an aromatic dicarboxylic acid component (Component A) and an ethylene glycol component (Component C) and a long-chain alkyl dicarboxylic acid component having not less than 6 carbons (Component B) or a long-chain alkyl diol component having not less than 6 carbons (Component D), wherein a sum (WB+WD) of a relative amount (WB) of Component B as calculated based on a total number of moles of Component A and Component B plus a relative amount (WD) of Component D as calculated based on a total number of moles of Component C and Component D are within a range of 2-13 mol %. The invention also provides a polyester film prepared from the polyester composition and having excellent dimensional stability, as well as a magnetic recording medium utilizing the polyester film.

Polyethylene Glycol-Based Polymer Processing Aid Masterbatches
20230024578 · 2023-01-26 ·

Provided herein are polymer compositions and methods of making them, including blending a polymer and a polyethylene glycol (PEG) masterbatch. The PEG masterbatch can include one or more PEGs each having molecular weight less than 40,000 g/mol. The polymer can be a C.sub.2-C.sub.6 olefin homopolymer or a copolymer of two or more C.sub.2-C.sub.20 α-olefins. The PEG masterbatch and resulting polymer composition is preferably free or substantially free of fluorine, including fluoropolymer-based PPAs.

Polymeric insulating films

Insulating films suitable for use in magnet wire, electrical machines, and other applications may include at least one layer formed from extruded material. The extruded material may include a blend of a first polymeric material and a second polymeric material different than the first polymeric material. The first polymeric material may include one of polyetheretherketone, polyaryletherketone, polyetherketoneketone, polyphenylsulfone, polyphenylene sulfide, or polybenzimidazole, and the second polymeric material may include one of polyphenylsulfone, polyetherimide, polyethersulfone, polyphenylene sulfide, polycarbonate, or polyester.

POLYMERIC COMPOSITION, ITS METHOD OF PREPARATION, ITS USE AND OBJECT COMPRISING IT

A process for increasing the chemical resistance of a polymeric composition is provided. The method includes a step of blending: a) the (meth)acrylic polymer AP1 and b) a copolymer CP1. The copolymer CP1 includes at least 41 wt % of vinyl aromatic monomer units by weight of the copolymer CPI. The polymeric composition includes at least 5 wt % of the copolymer CP1, by weight of the polymeric composition. A chemical resistance of the polymeric composition is better than a chemical resistance of the (meth)acrylic polymer AP1 without CP1. Chemical resistance is measured by a time to crack at 120° C. when subjected to an outer radius bending strain of 75% and wetted with a cloth soaked in isopropanol 99%.

MULTIMODAL ETHYLENE COPOLYMER

The present invention relates to a new multimodal ethylene copolymer (P), to the use of the copolymer in film applications and to a film comprising the copolymer of the invention.

PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND WIRING STRUCTURE CONTAINING CURED PRODUCT

There are provided a photosensitive resin composition, a cured product thereof, and a wiring structure body, an electronic component, a semiconductor device, and a camera module each including the cured product. This photosensitive resin composition is cured by irradiation with active energy rays, instead of by heat treatment at high temperatures. In this photosensitive resin composition, film loss after a development process is restrained. Furthermore, a miniaturized pattern can be accurately formed by photolithography. An aspect of the present invention is a photosensitive resin composition including components (A) to (C): (A) a modified polyphenylene ether represented by formula (1) and formula (2), (B) a silsesquioxane compound represented by formula (3), and (C) a photopolymerization initiator, a cured product thereof, and a wiring structure body, an electronic component, a semiconductor device, and a camera module each including the cured product.