Patent classifications
C08L2203/18
Rubber composition having improved electrical insulation properties for reducing galvanic corrosion
A rubber composition having improved electrical insulation properties for reducing galvanic corrosion, a method of preparing the composition, and a rubber hose for vehicles using the composition are disclosed. The rubber composition includes a base polymer, a reinforcing agent, an anti-aging agent, an activating agent, a plasticizer, and a crosslinking agent, and has electrical insulation resistance (10.sup.7 Ω.Math.cm) of 50 or more.
Bimodal high-density polyethylene resins and compositions with improved properties and methods of making and using the same
Bimodal high-density polyethylene polymer compositions with increased high melt strength and good processability. The compositions comprise a base resin having a density of about 945 kg/m.sup.3 to about 955 kg/m.sup.3, and an ethylene polymer (A) having a density of at least about 968 kg/m.sup.3, in an amount ranging from 45% to 55% by weight and an ethylene polymer (B) having a density lower than the density of polymer (A). The composition has a complex viscosity at a shear rate of 0.01 rad/s ranging from about 200 to 450 kPa.Math.s and a complex viscosity at a shear rate of 100 rad/s ranging from about 1900 to 2500 Pa.Math.s. Articles made from these compositions, such as pipes and fittings achieve long-term oxidative resistance and have a low wall thickness variability while maintaining high production output.
THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREBY
A thermoplastic resin composition and a molded article including the same can include 100 parts by weight of a base resin including 10 to 50% by weight of an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A-1) containing acrylate rubber having an average particle diameter of 0.3 to 0.5 μm, 5 to 40% by weight of an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A-2) containing acrylate rubber having an average particle diameter of 0.05 μm or more and less than 0.3 μm, and 20 to 65% by weight of an aromatic vinyl polymer (B), and 0.5 to 12 parts by weight of a polyamide (C). The thermoplastic resin composition can have a solvent resistance of 15 days or more.
Electrically Conductive PVC Solvent Cement
In a preferred embodiment, there is provided an electrically conductive solvent cement for coupling thermoplastic components, the cement comprising a thermoplastic resin, a solvent for dissolving the thermoplastic resin, and an electrically conductive material.
THERMOPLASTIC POLYMER BLENDS
The present disclosure is directed to thermoplastic polymer blends. The blends can include a first thermoplastic polyurethane and a second thermoplastic polyurethane, wherein the blend includes from 10 wt % to 50 wt % of the second thermoplastic polyurethane based on a total weight of the thermoplastic polymer blend. The first thermoplastic polyurethane can include a reaction product of a first reaction mixture consisting of or consisting essentially of an aliphatic diisocyanate and an aliphatic isocyanate-reactive component. The second thermoplastic polyurethane can include a reaction product of a second reaction mixture including a polyisocyanate, an isocyanate-reactive component having a number average molecular weight of from 500 g/mol to 10,000 g/mol, and a chain extender having a number average molecular weight of from 60 g/mol to 450 g/mol.
Enhancing bond strength of medical devices
Components of medical devices include polyethylene-poly(ethylene oxide) amphiphilic graft copolymers (PE-g-PEO) in their base polymer formulations. The base polymeric formulations comprise at least a polymer or co-polymer of ethylene. These components are suitable for solvent-bonding with other components and enhance bond strength of the medical devices.
Enhancing bond strength of medical devices
Components of medical devices include polypropylene-poly(ethylene oxide) amphiphilic graft copolymers (PP-g-PEO) in their base polymer formulations. The base polymeric formulations comprise at least a polymer or co-polymer of propylene. These components are suitable for solvent-bonding with other components and enhance bond strength of the medical devices.
Thermoplastic resin composition, molded object, and production methods therefor
A thermoplastic resin composition, a molded body, and first and second production methods are disclosed. The thermoplastic resin composition contains a polyolefin resin, a polyamide resin, and a modified elastomer and shows non-Newtonian properties in a fluidized state. The molded body includes the thermoplastic resin composition. The first production method includes molding the thermoplastic resin composition at a shear rate of 80 sec.sup.−1 or more and a standby step in which resin composition is on standby at a shear rate of 0 sec.sup.−1 or more but less than 80 sec.sup.−1. The second production method includes molding the resin composition at a shear rate X.sub.1 to obtain part of a molded body and molding the resin composition at a shear rate X.sub.2 to obtain another part of the molded body, wherein an absolute value of a difference between X.sub.1 and X.sub.2 is 200 sec.sup.−1 or more.
Rubber composition for hose and hose
The present invention is to provide a rubber composition for a hose and the like, the rubber composition having excellent oil resistance and low-temperature performance. A rubber composition for a hose, the rubber composition comprising: a hydrogenated acrylonitrile butadiene rubber having an acrylonitrile amount of 24 mass % or less, a carbon black, a peroxide, and a triallyl isocyanurate; a content of the peroxide being 2.4 parts by mass or more per 100 parts by mass of the hydrogenated acrylonitrile butadiene rubber; and a content of the triallyl isocyanurate being 1.9 parts by mass or more per 100 parts by mass of the hydrogenated acrylonitrile butadiene rubber, and a hose formed by using the rubber composition for a hose.
POLYMER COMPOSITION WITH FILLER, ITS METHOD OF PREPARATION AND USE
The present invention relates to a composition comprising a combination of a polymeric processing aid and an impact modifier or polymeric processing aid, its exact composition and its process of preparation and use. In particular, the present invention relates to a composition comprising a combination of a polymeric processing aid and an impact modifier or a polymeric processing aid; and its use for filled impact modified halogen containing thermoplastic polymers. More particularly, the present invention relates to a filled halogenated containing polymer composition with a polymeric processing aid and an impact modifier, its composition and its process of preparation.