The present disclosure pertains to vinylidene fluoride copolymers comprising recurring units derived from hydrophilic (meth)acrylic monomers and fluoro monomers compositions, and to their use in the manufacturing of battery components, such as membrane separators and electrode binders, to said battery components and to electrochemical devices comprising said components. Processes of making said copolymers and electrodes and separators including the copolymers are also described.

A soft polyolefin resin composition and an article molded therefrom are provided. The polyolefin resin includes: (A) 50 to 95% by weight of an ethylene-propylene block copolymer obtained by polymerization of a propylene homopolymer or an ethylene-propylene random copolymer with an ethylene-propylene rubber copolymer in stages in reactors; (B) 4.8 to 40% by weight of an ethylene-α-olefin rubber copolymer; and (C) 0.2 to 10% by weight of a copolymer of ethylene and a polar monomer, based on the total weight of components (A) to (C). The glass transition temperature of the rubber component in the ethylene-propylene block copolymer appears at −60 to −40° C. when measured by a dynamic mechanical analyzer, the melt index of the polyolefin resin composition measured at 230° C. under a load of 2.16 kg is 0.5 to 20 g/10 minutes, and the glass transition temperature of the rubber component in the polyolefin resin composition appears at −60 to −40° C. when measured by a dynamic mechanical analyzer.

A resin composition includes 100 parts by weight of a maleimide resin; 20 parts by weight to 60 parts by weight of a benzoxazine resin; 5 parts by weight to 40 parts by weight of an epoxy resin; 120 parts by weight to 240 parts by weight of silica including spherical silica having a sediment volume of less than or equal to 0.4 mL/g and a particle size distribution D50 of less than or equal to 1.0 μm; and 0.5 part by weight to 1.6 parts by weight of an imidazole compound having a long-chain alkyl group, wherein the imidazole compound having a long-chain alkyl group includes octylimidazole, undecylimidazole, heptadecylimidazole or a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, ratio of thermal expansion, copper foil peeling strength, thermal resistance after moisture absorption, dissipation factor, amount of resin cluster and appearance of cooper-free circuit board.

The present invention relates to a polymer composition (C) comprising at least one polyamide (P1), and from 1 to 50 wt. %, based on the total weight of (C), of at least one functionalized polymer (P2), wherein P2 is a poly(aryl ether sulfone) (PAES) having at least one functional group (SO.sub.3.sup.−), (M.sup.p+).sub.1/p in which M.sup.p+ is a metal cation of p valence. The present invention also relates to articles incorporating the polymer composition (C) and the use of functionalized polymer (P2) as a compatibilizer in the polymer composition (C) comprising two immiscible polymers.

A method for producing a microporous material comprising the steps of: providing an ultrahigh molecular weight polyethylene (UHMWPE); providing a filler; providing a processing plasticizer; adding the filler to the UHMWPE in a mixture being in the range of from about 1:9 to about 15:1 filler to UHMWPE by weight; adding the processing plasticizer to the mixture; extruding the mixture to form a sheet from the mixture; calendering the sheet; extracting the processing plasticizer from the sheet to produce a matrix comprising UHMWPE and the filler distributed throughout the matrix; stretching the microporous material in at least one direction to a stretch ratio of at least about 1.5 to produce a stretched microporous matrix; and subsequently calendering the stretched microporous matrix to produce a microporous material which exhibits improved physical and dimensional stability properties over the stretched microporous matrix.

To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application. An epoxy resin composition containing an epoxy resin and a curing agent, wherein the curing agent is partially or fully a polyvalent hydroxy resin represented by the following general formula (1). Each R.sup.1 independently represents a hydrocarbon group having 1 to 8 carbon atoms, each R.sup.2 independently represents a hydrogen atom or a dicyclopentenyl group, and at least one R.sup.2 is a dicyclopentenyl group; and n represents a number of repetitions of 0 to 5.

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A binder for preparing a positive electrode of a lithium secondary battery, and a method for preparing a positive electrode using the same. The binder includes two or more different lithium-substituted polyacrylic acids with different molecular weights. The lithium-substituted polyacrylic acids include two different lithium-substituted polyacrylic acids differing in weight average molecular weight by 500,000 or more from each other.

A cleaning blade includes a contact part coming into contact with a member to be cleaned, the contact part being constituted by a member containing polyurethane rubber produced by polymerizing at least a polyol component and a polyisocyanate component. The ratio (M100/Re) of 100% modulus (M100 [MPa]) to rebound resilience coefficient (Re [%]) of the member is 0.25 or more. The rebound resilience coefficient (Re [%]) of the member is less than 25%. The tensile stress at 23° C. and 200% strain of the member is 15 MPa or more.

A cable-to-pipe connector is provided. A cable-to-pipe connector for providing continuous transfer of current from a cable to a utility pipe in above grade and below grade systems, comprising a conductive lug comprising a head at a top end of the conductive lug affixed to a noncircular neck that is further affixed to a body in a linear formation, the head, the neck, and the body having decreasing diameters respectively. An insulating shell partially encasing by the conductive lug. A horizontal aperture at a midway point of the head. A first fastener extending from above a top of the head through the horizontal aperture. A threaded member at a base end of the conductive lug and a bottom end of the insulation shell.

A thermoplastic resin composition of the present invention comprises: a polycarbonate resin; a rubber-modified vinyl-based graft copolymer; a large particle size rubbery polymer having an average particle size of about 400 to about 1,500 nm; an aromatic vinyl-based copolymer resin; a phosphorus-based flame retardant; talc; wollastonite; a maleic anhydride grafted rubbery polymer; and a black pigment. The thermoplastic resin composition is superior in terms of adhesion to metal, strength, flame retardancy, fluidity, and appearance.