Provided is a production method for a layered product in which a metal film can be formed on the surface of a polyarylene sulfide (PAS) molded article with a high adhesive force by a simple step. Further, provided are: a polyarylene sulfide resin composition and a molded article that can be used in the layered product in which a metal film can be formed on the surface of the PAS molded article with a high adhesive force by a simpler step; and production methods therefor. More specifically, provided are: a polyarylene sulfide resin composition obtained by blending a polyarylene sulfide resin, a thermoplastic elastomer and/or a hydrolyzable thermoplastic resin, a carbonate, and a polyolefin-based wax; a molded article which is obtained by melt-molding the polyarylene sulfide resin composition and in which the surface is roughened; a layered product having a metal plating layer; and production methods therefor.

There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

The invention relates to the use of PMMI copolymers for reducing the decrease in molecular weight of the polymer induced by addition of talc in compositions based on aromatic polycarbonate. At the same time, the mechanical, optical and rheological properties of the thermoplastic composition, in spite of the addition of the PMMI copolymer, remain good and are in some cases even improved.

A polyvinyl halide compound has thermal conductivity and includes polyvinyl halide resin, natural or synthetic graphite of flake or spheroid form, and at least 0.5 weight percent of epoxidized vegetable oil. Selection of types and amounts of graphite and epoxidized vegetable oil provide thermal conductivity while other desirable properties of the compound are suitably maintained. The compound can be used for making any end use article that needs flame retardance and good thermal management and is especially useful as a thermally conductive material to replace die cast or extruded aluminum heat sinks in industrial applications, such as LED lighting fixtures.

A process of melt compounding a polyolefin formulation comprising a ethylenic-based (co)polymer, an antioxidant, and from 0.15 to 1.00 weight percent of an organic peroxide having a 1-hour half-life temperature of less than or equal to 155 degrees Celsius (° C.) and/or a 10-hour half-life temperature of less than or equal to 135° C. Also, intermediate compositions having a modified rheology and crosslinked polyolefin products made therefrom; methods of making and using same; and articles containing same.

The present invention relates to a method for chemically adhering a diene rubber to a piezoelectric polymer, the method comprising the steps of: a) providing a piezoelectric polymer having at least one surface, b) providing a rubber component having at least one surface and comprising a sulfur cross-linkable rubber composition, c) introducing oxygen-containing functional groups on the at least one surface of the piezoelectric polymer, d) reacting the oxygen-containing functional groups with a compound comprising thiocyanate groups, and e) contacting the surface of the piezoelectric polymer obtained of step d) with the surface of the rubber component, and cross-linking.

A reinforced flame retardant composition comprising: 30-80 wt % of a polymer component comprising 25-65 wt % of a poly(alkylene terephthalate); 5-25 wt % of a poly(phenylene ether); optionally, 5-35 wt % of a polyamide; 5-30 wt % of a reinforcing mineral filler, preferably talc, 5-35 wt % of glass fibers; 4-25 wt % of a flame retardant component comprising: a metal di(C.sub.1-6alkyl)phosphinate and an auxiliary flame retardant; 0.01-2 wt % of a compatibilizing agent; 5-15 wt % of an impact modifier; wherein a molded sample of the composition has a UL94 rating of V0 at thicknesses of 1.5 mm and lower; and a comparative tracking index of 250-399 volts, preferably 400-599 volts, more preferably 600 volts or greater as determined in accordance with UL 746A, a mean time of arc resistance of at least 120 seconds as determined according to ASTM D495, or a combination thereof.

The present invention provides a polyfunctional phenolic resin and a polyfunctional epoxy resin having low viscosity and having excellent mechanical properties and heat resistance of a cured product to be obtained, a curable resin composition containing these, and a cured product thereof. Specifically, provided are a polyfunctional phenolic resin formed with a naphthol structure optionally having a substituent on an aromatic ring and a catechol structure optionally having a methyl group as a substituent on an aromatic ring bonded together via a methylene group optionally having a substituent, a polyfunctional epoxy resin obtained by epoxidizing the polyfunctional phenolic resin, a curable resin composition containing any of these, and a cured product thereof.

Provided is a composition including a polyvinylidene fluoride (A); and a vinylidene fluoride polymer (B) excluding the polyvinylidene fluoride (A), wherein the polyvinylidene fluoride (A) comprises vinylidene fluoride unit and a pentenoic acid unit represented by formula (1): CH.sub.2═CH—(CH).sub.2—COOY wherein Y represents at least one selected from the group consisting of an inorganic cation and an organic cation, a content of vinylidene fluoride unit of the polyvinylidene fluoride (A) is 95.0 to 99.99 mol % based on all monomer units of the polyvinylidene fluoride (A), and a content of the pentenoic acid unit of the polyvinylidene fluoride (A) is 0.01 to 5.0 mol % based on all monomer units of the polyvinylidene fluoride (A).

Disclosed are an organic thin film including a semiconducting polymer including a ligand that is metal-coordination bondable or is metal-coordination bonded and an elastomer including a ligand that is metal-coordination bondable or is metal-coordination bonded, wherein the semiconducting polymer and the elastomer are configured to be dynamic intermolecular bonded by a metal-coordination bond, an organic sensor, and an electronic device.