A flame retardant composition comprising: 34-94 wt % of a homopolycarbonate, acopolycarbonate, or a combination thereof; 5-85 wt % poly(carbonate-siloxane), in an amount effective to provide 2-6 wt % dimethyl siloxane; 0.05-0.6 w t%, preferably 0.2-0.4 wt%, of a C.sub.1-16 alkyl sulfonate salt flame retardant; 1-15 wt % of a mineral-filled silicone flame retardant synergist; 0.05-0.5 wt % of an anti-drip agent; wherein each amount is based on the total weight of the flame retardant composition, which sums to 100 wt %; and wherein a molded sample of the flame retardant composition has a Vicat softening temperature of greater than or equal to 140° C. as measured according to the ISO-306 standard at a load of 10 N and a heating rate of 50° C. per hour, and a flame test rating of V0 as measured according to UL-94 at a thickness of 1.0 millimeter, or at a thickness of 0.8 millimeter.

In order to provide a resin composition excellent in pattern processability and film strength, a resin composition film, and a semiconductor device using these, there is provided a resin composition including (A) a polymer compound, (B) a cationic polymerizable compound, and (C) a cationic polymerization initiator, in which (A) the polymer compound has a carboxylic acid residue at a molecular chain terminal.

A conductive resin composition has low-temperature curability and is excellent in resistance stability during stretching. A conductive resin composition contains: (A) a polyorganosiloxane having an alkenyl group, (B) a polyorganosiloxane having a specific structure, (C) a conductive particle, (D) a compound having a hydrosilyl group, and (E) a hydrosilylation catalyst.
The content of the component (B) is 6 to 50 parts by mass based on 100 parts by mass of the component (A).

A Curable Silicone Composition, Encapsulant And Optical Semiconductor Device provides a curable silicone composition having excellent storage stability at room temperature. A curable silicone composition having (A) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one siloxane unit represented by SiO.sub.4/2; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in one molecule; (C) an alkyne group-containing compound; and (D) a curing catalyst, wherein the content of the resinous alkenyl group-containing organopolysiloxane (A) is 20 mass % or more based on the total mass of the organopolysiloxane components.

The present invention relates to an interdigitated microelectrode biosensor using the reaction between receptors and target biomaterials, the interdigitated microelectrode biosensor comprising: an insulating layer formed so as to cover all of the sensor formation area of a substrate; a first interdigitated microelectrode formed such that a plurality of first protruding electrodes are arranged in a comb shape on the insulating layer of the substrate; a second interdigitated microelectrode, facing the first interdigitated microelectrode and formed such that a plurality of second protruding electrodes are arranged in a comb shape on the insulating layer of the substrate such that the plurality of second protruding electrodes are arranged to respectively interdigitate with the plurality of first protruding electrodes formed at the first interdigitated microelectrode; and a plurality of receptors arranged in the space between the first and second interdigitated microelectrodes, which are arranged to interdigitate with each other, so as to specifically react with the target biomaterial, thereby increasing an impedance detection width and detection limit, and improving detection accuracy according to the characteristics of each monomer and each polymer.

Provided are an aqueous resin dispersion of an ethylene-vinyl alcohol copolymer exhibiting excellent dispersion stability, a production method for the aqueous resin dispersion, a hydrophilization agent including the aqueous resin dispersion, a hydrophilization method using the hydrophilization agent, a metal material on which a hydrophilic coating has been formed, and a heat exchanger on which a hydrophilic coating has been formed. Specifically provided are: an aqueous resin dispersion comprising an ethylene-vinyl alcohol copolymer (A) and a radical polymer (B) having a structural unit derived from a radical-polymerizable carboxylic acid monomer (B1-1), wherein the content of the radical polymer (B) is 10-80 mass % relative to the total content of the ethylene-vinyl alcohol copolymer (A) and the radical polymer (B); a production method for the aqueous resin dispersion; a hydrophilization agent including the aqueous resin dispersion; a hydrophilization method using the hydrophilization agent; a metal material on which a hydrophilic coating has been formed; and a heat exchanger on which a hydrophilic coating has been formed.

The present disclosure discloses polyester composites and their preparation methods, and belongs to the technical field of polymer processing and modification. The polyester composites of the present disclosure comprise 65 to 90 parts of polyester, 5 to 35 parts of an elastomer, 0.05 to 3 parts of a chain extender and 0.01 to 5 parts of a functional additive. The polyester composites of the present disclosure not only have ultra-high toughness, but also can maintain high tensile strength, have excellent hydrolysis resistance, can be matched with an antibacterial agent or an antistatic agent to have good antibacterial or antistatic additional functions, can be widely applied to the fields of fibers and fabrics, plastic structural parts, plastic packages or automobile interior parts, and have a wide prospect.

The present invention relates to a process comprising the step of melt-mixing a semi-aromatic polyamide (A) having a melting point on second heating of 295° C. or less comprising terephthalamide repeat units and a polyamide oligomer (B) comprising terephthalamide repeat units and having an amine end group concentration of less than 2000 me q/Kg and an inherent viscosity of at least 0.10, at a temperature which is greater than the melting point on first heating of both semi-aromatic polyamide (A) and polyamide oligomer (B) for a time period sufficient to produce semi-aromatic polyamide (C) having a melting point on second heating which is greater than or equal to 300° C.

A handling additive composition is disclosed. The composition is useful to improve handling of silicone elastomers prepared from polydiorganosiloxanes and silicone elastomers made therewith.

A resin composition includes a first prepolymer and a second prepolymer, the first prepolymer being prepared from a first mixture subjected to a prepolymerization reaction, the second prepolymer being prepared from a second mixture subjected to a prepolymerization reaction, wherein the first mixture includes a maleimide resin and a benzoxazine resin, and the second mixture includes a maleimide resin and a bis(trifluoromethyl)benzidine. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including copper foil peeling strength, dissipation factor, ratio of thermal expansion, cure shrinkage and glass transition temperature.