The present invention relates to a silane-grafted polyolefin, to a multilayer composition comprising said polyolefin and to an article comprising said composition.

A monomer composition containing an unsaturated polyalkylene glycol ether-based monomer is provided having excellent stability. The monomer composition contains an unsaturated polyalkylene glycol ether-based monomer represented by the following chemical formula (1):
YO(R.sup.1O).sub.nR.sup.2  (1)
[in the formula, Y represents an alkenyl group having 2 to 7 carbon atoms; R.sup.1O represents one or two or more types of oxyalkylene groups having 2 to 18 carbon atoms; n represents an average addition mole number of oxyalkylene groups and is a number of 5 to 500; and R.sup.2 represents a hydrogen atom or a hydrocarbon group having 1 to 30 carbon atoms], an organic acid, and water, and having a pH of 4 to 13.

Gels and gel-containing materials, including hydrogels, are described. A gel can be formed by blending polyacrylic acid (PAA) and a polyglycol, such as polytetramethylene ether glycol (PTMEG) at room temperature and, in some cases, without using a catalyst. The blend material can be used to form soft or hard materials, films and particles. The blend material can be combined with vinyl monomers and polymerize to form a hydrogel. The hydrogel can have a high mechanical strength and high water absorbency.

A polyester elastomer is provided, which includes a product of reacting (a) amide oligomer, (b) polyalkylene glycol, and (c) poly(alkylene arylate). (a) Amide oligomer has a chemical structure of

##STR00001##

or a combination thereof, wherein R.sup.1 is C.sub.4-8 alkylene group, R.sup.2 is C.sub.4-8 alkylene group, and each of x is independently an integer of 10 to 20. (b) Polyalkylene glycol has a chemical structure of

##STR00002##

wherein R.sup.3 is C.sub.2-10 alkylene group, and y is an integer of 20 to 30. (c) Poly(alkylene arylate) has a chemical structure of

##STR00003##

or a combination thereof, wherein Ar is

##STR00004##

R.sup.4 is C.sub.2-6 alkylene group, and z is an integer of 1 to 10.

Provided are an adhesive composition for a polarizing plate, a polarizing plate, and an optical display device, the adhesive composition comprising an epoxy-based compound, a (meth)acrylate-based compound, a photo-acid generator, and an optical radical initiator, the (meth)acrylate-based compound comprising a mixture of a bifunctional (meth)acrylate-based compound and a monofunctional (meth)acrylate-based compound having a hydrophobic functional group, wherein the adhesive strength measured after the adhesive composition for a polarizing plate is separately applied to a PET film, a TAC film, and a COP film, to which a polarizer is then bound, followed by photo-curing, is about 200 gf/inch or more.

A functionally graded shape memory polymer (SMP) that has a range of transition temperatures that are spatially distributed in a gradient fashion within one single article. The SMP is formed by post-curing a pre-cured glassy SMP in a linear temperature gradient that imposes different vitrification temperature limits at different positions along the gradient. Utilizing indentation-based surface shape memory coupled with optical measurements of photoelastic response, the capability of this material to respond over a wide range of thermal triggers is correlated with the graded glass transition behavior. This new class of SMP offers great potential for such applications as passive temperature sensing and precise control of shape evolution during a thermally triggered shape recovery.

The present invention relates to a continuous process for preparing a comb polymer, without organic solvent, by esterification and/or amidification of an acidic homopolymer or copolymer, which consists in performing the esterification and/or amidification of said homopolymer/copolymer by reaction at elevated temperature in the mixing and transportation zone of a tubular reactor, optionally equipped with a water removal system, in the presence of at least one poly(alkylene glycol) in solid or molten form and of an antioxidant, said esterification and/or amidification taking place at a temperature greater than or equal to 170° C.

The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100˜140 parts of halogen-free phosphorous epoxy resin, 10˜35 parts of dicyclopentadiene phenolic epoxy resin, 32˜60 parts of benzoxazine, 1˜5 parts of phenolic resin, 0.05˜0.5 parts of accelerants; and 25˜70 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI≧500V), high heat resistance(Tg≧150 ° C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.

Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.