A composition with improved storage viscosity is provided. The composition contains a (meth)acrylic-based copolymer (A′) and an epoxy compound (C). A molecule of the (meth)acrylic-based copolymer (A′) includes an XY diblock structure or an XYX triblock structure therein. A number of repeating units which are derived from a (meth)acrylic ester monomer having an alkoxysilyl group and are included in an X block is 1.0 or more on average; an amount of repeating units which are derived from a (meth)acrylic ester monomer having an alkoxysilyl group and are included in a Y block is 0% by weight to 3% by weight, with respect to a weight of all repeating units included in the Y block. A molecular weight distribution (Mw/Mn) of the (meth)acrylic-based copolymer (A′) is 1.8 or less.

A thermoplastic resin composition having good formability and low dielectric characteristics that have not been achieved by conventional liquid crystal polymer resin compositions, while maintaining excellent heat resistance and flame retardancy of liquid crystal polymers, and usable for information and communication devices used in a high frequency range is provided. A thermoplastic resin composition contains liquid crystal polymers (A) and a modified polyolefin (B) having a polar group. The liquid crystal polymer (A) contains a first liquid crystal polymer (a-1) that has a melting point of less than 300° C. and a second liquid crystal polymer (a-2) that has a melting point of 300° C. or more. It is preferable for the thermoplastic resin composition that the phase structure is a sea-island structure or a bicontinuous structure, and the second liquid crystal polymer (a-2) is contained at least in a sea phase or a continuous phase.

The present invention relates to a polymeric processing aid its composition and its process of preparation and its use. In particular the present invention it relates to a polymeric processing aid and its use for highly filled halogen containing thermoplastic polymers. More particularly the present invention relates to a highly filled halogen containing polymer composition with a polymeric processing aid, its composition and its process of preparation.

Disclosed herein are tires having a tread having stiffness made from a rubber composition of specified ingredients including an elastomer component, a resin component including a terpene phenol resin having a specified hydroxyl value and a DCPD-based resin, a filler component including reinforcing silica filler and carbon black, optionally a liquid plasticizer, and a cure package. Also disclosed are methods for stiffness in a tire tread by using a resin component comprising a terpene phenol resin having a specified hydroxyl value and a DCPD-based resin in a rubber composition comprising an elastomer component, a filler component including reinforcing silica filler and carbon black, optionally a liquid plasticizer, and a cure package.

The invention relates to a composition and a method for producing moisture-crosslinking silicones with catalysis by at least two different catalysts A and B, a related process and the use of the composition, in particular, in sealants, adhesives, joint compounds or coating agents.

Provided herein are polymer compositions comprising a polymer and polyethylene glycol (PEG)-based polymer processing aid (PPA). The polyethylene glycol can have molecular weight less than 40,000 g/mol. The polymer can be a C.sub.2-C.sub.6 olefin homopolymer or a copolymer of two or more C.sub.2-C.sub.20 α-olefins, and the polymer composition can take the form of polymer pellets; a polymer melt; reactor-grade polymer granules and/or polymer slurries; or other form of polymer composition containing the PPA and optionally one or more other additives. The polymer composition is preferably free or substantially free of fluorine, including fluoropolymer-based PPAs.

A composition that includes: (a) from 65 to 85% by weight of polypropylene homopolymer in powder form, the average particle size of which is micrometric, (b) from 14 to 30% by weight, preferably 14 to 25% by weight, of natural fibers less than or equal to 2 mm in length, and (c) from 1 to 3% by weight of compatibilizer, its uses for the preparation of a composite material by extrusion, wherein this composite material is useful for preparing a part by injection, in particular a vehicle part whose rigidity is improved.

An impact-modified polyamide composition comprising from 5 wt % to 85 wt % of polyamide polymer; from 10 wt % to 60 wt % glass fiber; from 3 wt % to 30 wt % of an impact modifier; and a melt stabilizer at a concentration less than 5 wt %; wherein the weight ratio of the impact modifier to the melt stabilizer ranges from 1.0:1 to 100:1; and wherein the polyamide composition demonstrates an un-notched Charpy impact energy loss at 23° C. that is greater than 80 kJ/m.sup.2 and a tensile strength greater than 135 MPa.

The present invention provides a resin composition for molding having excellent thermal meltability and capable of providing a molded article that is less likely to crack from a resin weld during use and has excellent surface gloss, and a molded article including the resin composition for molding. Provided is a resin composition for molding, containing: a chlorinated polyvinyl chloride resin; a polyvinyl chloride resin; and a melt additive, the resin composition having an area ratio of a peak B observed in a range of 0.6 to 1.0 ppm to a peak A observed in a range of 9.5 to 10 ppm (Area of peak B/Area of peak A) of 1 to 1,000 when a .sup.1H NMR spectrum is measured by solution NMR.

The present invention relates to the use of a mixture of at least one semi-crystalline aliphatic polyamide and at least one amorphous polyamide, wherein the at least one semi-crystalline aliphatic polyamide is obtained by polycondensation: of at least one C.sub.6 to C.sub.18, preferentially C.sub.10 to C.sub.18, more preferentially C.sub.10 to C.sub.12 amino acid, or at least one C.sub.6 to C.sub.18, preferentially C.sub.10 to C.sub.18, more preferentially C.sub.10 to C.sub.12 lactam, or at least one C.sub.4-C.sub.36, preferentially C.sub.5-C.sub.18, preferentially C.sub.5-C.sub.12, more preferentially C.sub.10-C.sub.12 diamine Ca, with at least one C.sub.4-C.sub.36, preferentially C.sub.6-C.sub.18, preferentially C.sub.6-C.sub.12, more preferentially C.sub.10-C.sub.12 dicarboxylic acid Cb; in order to prepare a semi-crystalline composition, the modulus of which does not vary by more than 25% within the temperature range from 10° C. to 40° C.