The rubberized textile material for a belt textile ply is provided on at least one side of a textile web with a peroxidically crosslinkable ethylene-alpha-olefin-diene terpolymer rubber mixture, preferably an EPDM mixture. In this rubberization mixture the third monomer content (diene content) of the EPDM is preferably at least 4% and the rubber mixture contains: a peroxidic crosslinker, a mineral oil having an aromatics proportion of at least 50 percent by weight and at least one reactive phenol and/or reactive phenol resin capable of binding to the double bonds of unsaturated polymers. The reactive phenol and/or phenol resin and the mineral oil are present in the rubber mixture in a content of altogether 5 to 60 phr. The rubberization has an exceptional manufacturing tack coupled with good adhesion and good dynamic properties.

The invention relates to systems and techniques for manufacturing articles containing cellulosic material, a coupling agent, and a binder resin, and related processes of making and using the cellulosic articles. In particularly exemplary embodiments, the manufactured articles are door skins, sometimes known as door facings, and doors made from the door skins. The article contains a lipophilic cellulosic material, a coupling agent, and a binder. The coupling agent is believed to increase the hydrophilicity (wettability) of the lipophilic cellulosic material.

The invention presents a preparation method of organic silicone elastomers cross-linked bypolyphenols, which comprises steps as follows: (1) Dissolve 15-250 parts (by mass) of amino-polysiloxanes in the organic solvents to get the amino-polysiloxanes solution; then, dissolve 1˜20 parts of polyphenols in 1-60 parts of water to get the aqueous solution of polyphenols; mix the said two solutions, add 2-130 parts of reinforcement fillers, stir evenly, and then pour them into the mold. (2) Cure and cross-link the mold containing the mixed solutions at 80° C.-170° C. for a period of time, and cool it to room temperature to get the organic silicone elastomer.

A thermoplastic elastomer composition according to the present disclosure includes a component (A): an elastomer having a glass transition temperature of 0° C. or lower, having at least one structural unit of a structural unit that is a hydrogenated isoprene-derived structure and an isobutene-derived structural unit, and having an unsaturated bond; a component (B): an α-olefin-based thermoplastic resin (where a 4-methyl-1-pentene α-olefin copolymer and a case corresponding to a component (E) to be described later are excluded); a component (C): an aromatic petroleum resin, an aliphatic petroleum resin, an aliphatic/aromatic petroleum resin, a dicyclopentadiene-based petroleum resin, a terpene resin, a rosin derivative, a 4-methyl-1-pentene α-olefin copolymer, and hydrogenated substances thereof; and a component (D): a crosslinking agent, in which the thermoplastic elastomer composition is formed by dynamic crosslinking of a mixture containing the component (A), the component (B), and the component (C) in the presence of the component (D).

[Problem] The purpose of the invention is to provide: a thermoplastic elastomer composition capable of providing molded articles that are lightweight, have better oil resistance than those provided by conventional cross-linked thermoplastic elastomers, and have hardness and mechanical properties such as tensile strength and tensile elongation that are equal to or superior to those provided by conventional cross-linked thermoplastic elastomers; and an ethylene/α-olefin/unconjugated polyene copolymer having little compression set at low temperature as well as flexibility and an excellent balance of rubber elasticity at low temperature and tensile strength at normal temperature. [Solution] Produced are: a thermoplastic elastomer composition obtained by dynamically crosslinking a mixture containing a crystalline olefin polymer (A), an ethylene/α-olefin (having 4-20 carbon atoms)/unconjugated polyene copolymer (1B) that satisfies specific requirements, and a phenol resin-based crosslinking agent (C); and an ethylene-α-olefin/unconjugated polyene copolymer (2B) that satisfies specific requirements.

A compound represented by the following formula (1) and a method for producing the same, and a composition, a composition for optical component formation, a film forming composition for lithography, a resist composition, a method for forming a resist pattern, a radiation-sensitive composition, a method for producing an amorphous film, an underlayer film forming material for lithography, a composition for underlayer film formation for lithography, a method for producing an underlayer film for lithography, a resist pattern formation method, a circuit pattern formation method, and a purification method. ##STR00001## wherein R.sup.1 is a 2n-valent group of 1 to 60 carbon atoms or a single bond; R.sup.2 to R.sup.5 are each independently a linear, branched, or cyclic alkyl group of 1 to 30 carbon atoms, an aryl group of 6 to 30 carbon atoms, an alkenyl group of 2 to 30 carbon atoms, a group represented by the following formula (A), a group represented by the following formula (B), a thiol group, or a hydroxy group, wherein at least one selected from the group consisting of R.sup.2 to R.sup.5 is a group selected from the group consisting of a group represented by the following formula (A) and a group represented by the following formula (B); m.sup.2 and m.sup.3 are each independently an integer of 0 to 8; m.sup.4 and m.sup.5 are each independently an integer of 0 to 9, provided that m.sup.2, m.sup.3, m.sup.4, and m.sup.5 are not 0 at the same time; n is an integer of 1 to 4; and p.sup.2 to p.sup.5 are each independently an integer of 0 to 2: ##STR00002## wherein each R.sup.6 is independently an alkylene group of 1 to 4 carbon atoms; and m′ is an integer of 1 or larger, and ##STR00003## wherein R.sup.6 is as defined above; R.sup.7 is a hydrogen atom or a methyl group; and m″ is 0 or an integer of 1 or larger.

Disclosed is a thermoplastic vulcanizate composition with a dispersed phase of a rubber, partially cured in a phenolic resin curing agent, and a continuous thermoplastic phase including at least one thermoplastic polymer, where the composition has one or more of the following properties: (i) an epoxidized soy bean oil is added after the partial curing of the rubber phase; (ii) a combination of an alkyl radical scavenger and an alkyl phosphite is added during the partial curing of the rubber phase; (iii) the thermoplastic phase has ≥10 wt % polypropylene having a heat of fusion >80 J/g, and the composition includes (a) stannous chloride; (b) a non-basic hindered amine light stabilizer; and/or (c) both (a) and (b); and (iv) where (i) to (iii) include carbon black in the composition.

An epoxy group-containing organopolysiloxane shows the following average composition formula (1) and has an epoxy equivalent of 500 g/mol or more. The epoxy group-containing organopolysiloxane has excellent ultraviolet curability even when the content of epoxy group is small (when the epoxy equivalent is large), an ultraviolet curable silicone composition uses the same, and a method forms a cured film. ##STR00001## In the formula, each R.sup.1 represents the same or different unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms (except for a group containing an epoxy group); R.sup.2 represents a group containing an epoxy group; R.sup.3 represents a hydrogen atom or a saturated monovalent hydrocarbon group having 1 to 4 carbon atoms; a, b, and c are positive numbers, d is 0 or a positive number, satisfying (a+b)/(c+d)=0.5 to 1.0.

The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) a phenolic curing agent; and (D) a curing accelerator, ##STR00001##
wherein A represents a single bond or a divalent organic group selected from the following formulae. ##STR00002## This provides a resin composition with improved strength and excellent adhesion and flexibility, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.

The present disclosure relates to an adhesive composition including a polyvinyl alcohol and a water-soluble polyphenol compound, to an adhesive containing the composition, and to a manufacturing method therefor. The adhesive composition has a low or no toxicity, can adhere even without a curing process unlike a conventional adhesive, enables the manufacturing of a gel by hydrogen binding characteristics between the polyvinyl alcohol compound and the water-soluble polyphenol compound, and retains adhesive properties in water.